The heat transfer characteristics of forced convection according to the geometric shapes with four rectangular blocks in a horizontal PCB channel was analyzed numerically using SST (Shear Stress Transport) turbulence model. As the boundary condition for CFD (Computational Fluid Dynamics) analysis, the inlet temperature and air velocity were respectively 300 K and 3.84 m/s and the heat flux of the block surface was 358 W/㎡. The shape factors of block were width, height, spacing and channel entrance height. As the results, the heat transfer rate was decreased as the width ratio (x/h) was increased, while it was increased as the height ratio (h/x) is increased. Also as the block spacing ratio (s/x) was increased, the heat transfer effects was not significantly affected. And as the channel entrance height ratio (H/x) was increased, the heat transfer performance was decreased.

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and 170˚C in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at 150˚C and 1.5×105A/cm2, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.

As information-oriented industry has been developed and electronic devices has come to be smaller, lighter, multifunctional, and high speed, the components used to the devices need to be much high density and should have find pattern due to high integration. Also, diverse reliability problems happen as user environment is getting harsher. For this reasons, establishing and securing products and components reliability comes to key factor in company's competitiveness. It makes accelerated test important to check product reliability in fast way. Out of fine pattern failure modes, failure of Electrochemical Migration(ECM) is kind of degradation of insulation resistance by electro-chemical reaction, which it comes to be accelerated by biased voltage in high temperature and high humidity environment. In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, 20/20μm pattern width/space applied by Semi Additive Process, was performed, and through this test, the investigation of failure mechanism and the life-time prediction evaluation under actual user environment was implemented. The result of accelerated test has been compared and estimated with life distribution and life stress relatively by using Minitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life has been estimated under 95% confidence level of failure data happened in each test conditions. And the life in actual usage environment has been predicted by using generalized Eyring model considering temperature and humidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have been calculated.

본 연구는 인쇄회로기판(PCB) 제조 시 에칭공정에서 발생되는 구리이온(Cu+2)을 고농도로 함유한 황산 폐에칭액을 NF 막분리법을 사용하여 에칭액 회수와 구리이온 처리를 효율적으로 수행하기 위한 NF 막여과 공정의 운전 조건을 설정하기 위한 기본 자료를 확보하는데 있다. 이를 위해 미국 Koch사의 SelRO MPS-34 4040 NF 막을 대상으로 구리이온을 고농도(5~25 g/L)로 함유한 모의 황산 폐에칭액의 회분식(dead-end) 나노여과 실험을 수행하여 투과 플럭스와 구리이온의 총괄 배제도를 측정하였다. 이 결과 황산용액에의 막 보관기간이 길수록, 황산용액의 pH가 낮을수록 황산에 의한 NF 막의 손상이 더 크게 발생하여 순수 투과 플러스가 증가하였다. 황산 폐에칭액의 투과 플럭스는 황산용액 내 구리이온의 농도가 증가할수록 막 표면에의 구리이온 농축(농도분극)의 증가에 따라 감소하였으며, 구리이온의 배제도는 구리이온의 농도가 높을수록, pH가 낮을수록, 황산용액 내의 막 보관기간이 길수록 낮아져 초기 37%에서 최소 15% 수준으로까지 감소하였다.

This study was conducted to examine the effect of 3,3',4,4',5-pentachlorobiphenyl (PCB 126) on morphological changes in the developing rat testis. PCB 126 (0.2㎎/㎏/week) in corn oil was weekly i.p. injected into rats from 1 to 11 weeks old. The total body weights and testicular weights were measured at 3, 6, 9 and 12 weeks, respectively. The morphological changes in the rat testes were then analyzed by light microscopy (LM) and transmission electron microscopy (TEM). The results demonstrated that PCB 126 treatment caused significant change in the ratio of testicular weight/body weight at 9 week. The treatment of PCB increased the number of pregonium cells at 3 week and it decreased spermatogenesis of the seminiferous tubules at 6 week. The results of this study suggest that PCB 126 can damage the male reproductive organ of the growing rat and that it might be associated with retardation of development of the testis.

This research deals with multiple Gantry-type assembly machines for the optimization of PCB assembly line. The automated assembly machine has 6 nozzles which can linearly move the X axis and the Y axis different from the turret type assembly machine. Each

Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/dm2 at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/dm2 as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.

The reliability prediction and evaluation for general electronic components are required to guarantee in quality and in efficiency. Although many methodologies for predicting the reliability of electronic components have been developed, their reliability might be subjective according to a particular set of circumstances, and therefore it is not easy to quantify their reliability. In this study reliability prediction of electronic components, that is the interface card, which is used in the CNC(Computerized Numerical Controller) of machine tools, was carried out using PRISM reliability prediction specification. Reliability performances such as MTBF(Mean Time Between Failure), failure rate and reliability were obtained, and the variation of failure rate for electronic components according to temperature change was predicted. The results obtained from this study are useful information to consider a counter plan for weak components before they are used.

Micro-sized bumps on a multi-layered build-up PCB were fabricated by pulse-reverse copper electroplating. The values of the current density and brightener content for the electroplating were optimized for suitable performance with maximum efficiency. The micro-bumps thus electroplated were characterized using a range of analytical tools that included an optical microscope, a scanning electron microscope, an atomic force microscope and a hydraulic bulge tester. The optical microscope and scanning electron microscope analyses results showed that the uniformity of the electroplating was viable in the current density range of 2-4 A/dm2; however, the uniformity was slightly degraded as the current density increased. To study the effect of the brightener concentration, the concentration was varied from zero to 1.2 ml/L. The optimum concentration for micro-bump electroplating was found to be 0.6 ml/L based on an examination of the electroplating properties, including the roughness, yield strength and grain size.

  This study considers the problem of scheduling jobs on uniform parallel machines with a common due date. The objective is to minimize the total absolute deviation of job completion times about the common due date. This problem is motivated by the fact t

  In this paper, we consider a planning problem arising from printed circuit board manufacturing industries. Given a set of several types of PCBs, component feeders and surface mounting machines in series in a PCB assembly line, the problem is to define t

This paper considers six sigma projects for the PCB industry. This paper is divided into the following four parts. In the first part, the concept and properties of six sigma management are introduced. In the second part, some tools of six sigma project using DMAIC phases are studied for a PCB manufacturing process. In the third part, some tools of six sigma project using DMADOV phases are considered for a PCB research and development process. Finally, some tools of six sigma project for a PCB transaction process are given.

This research considers the problem of scheduling Jobs on unrelated parallel machines with a common due date The objective is to minimize the total absolute deviation of Job completion times about the common due date. This problem is motivated by the fact

본 연구에서는 FETAX의 방법에 따라 PCB(Aroclor)가 산개구리의 배아발생에 미치는 효과를 조사하였다. 배아의 치사율과 기형률은 probit 분석법으로 조사하였다. PCB에 의한 LC50은 1.48ppb을 나타냈고 EC50은 0.25ppb를 나타냈으며 TI는 5.7을 나타내어 PCB는 높은 치사율을 나타내는 최기형성 물질로 판단된다. 기형양상은 수포형성 기형이 0.1ppb에서 62.0%, 꼬리기형이 1ppb에서 32.0%, profund형의 기형이 5ppb에서 68.0%를 나타냈다. PCB는 비교적 낮은 농도인 1.0ppb에서 머리에서 꼬리까지의 성장을 저해하는 결과를 나타내어 이러한 배아의 성장억제에 의 한 평가는 환경오염물질의 독성을 평가하는 데 민감한 지표로 사용되어질 수 있을 것으로 생각된다. 결론적으로 이러한 결과는 PCB가 산개구리 배아발생과정에 높은 독성을 지닌 것을 나타낸다.