국내 비내진 설계된 RC 골조 외부접합부의 횡저항 능력특성을 연구하기 위하여, 1988년 이후의 건물을 대상으로 실물 크기의 70%의 T형 보-기둥 실험체 4개를 제작하여 보에 횡력을 가력하여 실험을 수행하였다. 작용한 횡력은 총 9단계로 변위를 조절하여 최대 횡변위비 3.5%까지 가력하였고, 각 변위 단계마다 3싸이클의 반복하중을 가력하였다. 실제의 상황과 유사하게 하기 위하여 실험동안 기둥에 압축력을 지속적으로 작용하였다. 실험 결과, 부재가 휨 공칭강도에 도달하여야 하는 내력에 비하여 실험 결과는 85%이하로 나타났고 층간변위비 0.85% 미만에서 모든 실험체의 접합부에서 전단균열이 발생하여 국내 외부접합부가 취약함을 확인할 수 있었다. 또한 접합부 균열발생시 주응력-층간변위비는 Priestly의 제안식과 유사하게 나타났다.

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and 6.44 J/m2 for 400, 450, and 500˚C, respectively, in a N2 atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

최근 초고층 건축물은 비정형적 외관을 갖는 랜드 마크적인 역할과 택지의 효율적인 사용을 위한 수직 도시 기능을 수행한다. 건축물의 외관은 비정형적인 요소로서 3T형태(Twisted, Tilted, Tapered)의 설계안들이 대부분 제안되고 있으며, 세장한 형태의 형상비를 만족하기 위한 새로운 구조시스템의 연구 개발이 활발히 진행 중이다. 다이아그리드 시스템의 하중 전달 메커니즘은 대각 가새(Diagrid)의 삼각형 형상에 기인하여 중력하중 뿐만 아니라 횡하중을 전달하기 때문에 대부분의 기둥이 제거되게 된다. 또한 대각 가새의 축방향 거동(인장/압축)에 의해 전단력을 전달하여 전단 변형이 최소화되기 때문에 기둥이 전단력을 전달하던 기존 방식에 비해 비정형적인 외관에 쉽게 대응할 수 있는 구조시스템이다. 본 연구에서는 싸이클론 타워의 건축 계획안을 바탕으로 접합부 디테일 선정 과정과 접합부의 구조안전성을 유한요소해석을 통해 검증하였다. 이를 통해 응력집중 완화 방안을 제시하여 적절한 캡 플레이트 두께와 캡플레이트 확장 길이를 제시하여 응력집중 현상을 완화하였다.

This paper investigates the dependence of a-Si:H/c-Si passivation and heterojunction solar cell performances on various cleaning processes of silicon wafers. It is observed that the passivation quality of a-Si:H thin-films on c-Si wafers depends highly on the initial H-termination properties of the wafer surface. The effective minority carrier lifetime (MCLT) of highly H-terminated wafer is beneficial for obtaining high quality passivation of a-Si:H/c-Si. The wafers passivated by p(n)-doped a-Si:H layers have low MCLT regardless of the initial H-termination quality. On the other hand, the MCLT of wafers incorporating intrinsic (i) a-Si:H as a passivation layer shows sensitive variation with initial cleaning and H-termination schemes. By applying the improved cleaning processes, we can obtain an MCLT of 100μsec after H-termination and above 600μsec after i a-Si:H thin film deposition. By adapting improved cleaning processes and by improving passivation and doped layers, we can fabricate a-Si:H/c-Si heterojunction solar cells with an active area conversion efficiency of 18.42%, which cells have an open circuit voltage of 0.670V, short circuit current of 37.31 mA/cm2 and fill factor of 0.7374. These cells show more than 20% pseudo efficiency measured by Suns-Voc with an elimination of series resistance.

PC(Precast Concrete) 구조시스템은 건식화 조립식 공법으로 구조물 건설에 있어 공기, 노동력 절감 등의 여러 장점을 가지고 있다. 하지만 구조벽체의 경우 이를 PC화하여 사용할 경우 접합부의 내진성능이 떨어지므로 PC 구조벽체를 사용하는 경우는 드물다고 할 수 있다. 본 연구에서는 이러한 점을 감안하여 접합부 성능을 개선하여 횡력저항요소로 사용가능한 2종류의 PC 구조벽체를 제안하였다. 제안된 PC 구조벽체는 RC 벽체 및 PC 벽체가 혼합된 복합 PC 벽체와 벽체하부 연결철근의 일부를 단면감소시키고 비부착상세를 적용한 PC 벽체로서 지진발생 시 충분한 강도와 변형능력을 확보할 수 있도록 하였다. 제안된 PC 구조벽체의 내진성능평가를 위하여 RC 벽체를 포함한 3가지 벽체에 대한 실험체를 제작하여 주기 횡하중 실험을 수행하였다. 실험결과, 제안된 PC 구조벽체는 강도, 강성, 변형능력 및 에너지 소산능력이 기존 PC 구조벽체보다 월등히 향상되어 우수한 내진성능을 확보할 수 있는 것으로 나타났다.

Existing non-destructive test for evaluation of concrete compressive strength may show deviation in results analysis due to deterioration of precision by strength calibration and dry or humid condition by age, so there needs be testing method to determine long term structural internal force by collecting specimen with no damage of structure and measuring compressive strength through destruction test. This research applied to mock-up member the compressive strength evaluation method using joint separation mold that can plan and produce specimen cured in the same composition environment as concrete structure by attaching arbitrary(joint separation) to the form before concrete piling, and as a result, the management specimen was contrary to the hydration temperature of the member or was affected by external atmospheric temperature, however the joint separation specimen connected to structure and managed in the same environment showed a temperature curve similar to the member and decrease in temperature difference. Additionally, from initial age, with the compressive strength of joint separation specimen most similar to core strength，stable compressive strength can be evaluated up to design criteria strength 100MPa, so the method is proposed as an evaluation technique that can confirm highly reliable concrete quality.

프리캐스트 콘크리트 세그먼트 공법은 품질관리가 용이하고 비용 및 공사기간을 단축할 수 있으나 각 세그먼트의 조립으로 인한 접합부의 응력집중 및 큰 변위로 인해 구조적으로 불리한 거동을 보여 많은 장점에도 불구하고 폭넓은 적용에 있어 그 한계가 발생한다. 이에 본 연구에서는 구조 성능이 개선된 프리캐스트 세그먼트 접합부를 제안하고 실험을 통하여 균열 및 파괴양상, 변형률, 최대하중, 변위 연성도의 측면에서 제안한 접합부의 구조 성능을 평가하고자 하였다. 본 연구에서는 시공성 및 구조성능을 고려하여 전단키 및 포스트텐션, 강봉 등의 적용여부를 변수로 한 접합부를 제안하고 이에 대해 정적 재하 실험을 수행하였다. 실험 결과, 전단키 및 포스트텐션을 적용한 SGSP 실험체는 최대하중의 측면에서 일체형 실험체에 비해 약 86%에 준하는 내력을 보였으며 연성 측면에서는 일체형 실험체의 연성 능력 이상의 연성거동을 보임으로써 제안한 접합부의 개선된 구조성능 및 적용 가능성을 확인할 수 있었다.

The spot weldability of dissimilar metal joints between stainless steels (AISI316) and interstitial free (IF) steels were investigated. This study was aimed to determine the spot welding parameters for a dissimilar metal joint and to evaluate the dissimilar metal joint's weldability, including its welding nugget shape, tensileshear strength, hardness, and microstructure. The fracture surface was investigated by using a Scanning Electron Microscopy (SEM). The experimental results showed that the shape of nugget was asymmetric, in which the fusion zone of the STS316 sheet was larger due to the higher bulk-resistance. The microstructure of the fusion zone was fully martensite. In order to evaluate the microstructure further, dilution of stainless steels were calculated and imposed onto the Schaeffler diagram. The predicted microstructure from the Schaeffler diagram was martensite. In order to confirm the predicted microstructure, XRD measurements were carried out. The results showed that that initial weld nugget was composed of austenite and martensite.

In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The B10 life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from (-40±2)˚C to (120±2)˚C, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

이 논문은 반복-수평력을 받는 프리캐스트 기둥-RC 기초 Anchor 접합부의 반복-수평력에 대한 내력 특성을 규명하기 위함이다. 본 연구는 하부 기초에 프리캐스트 콘크리트 기둥과 기초를 Anchor식으로 접합한 콘크리트 구조체가 정확한 응력전달 경로 및 파괴 메커니즘에 있어서 기존의 콘크리트-강재 연결부와 어떠한 차이가 있는지 제시한다. 반복-수평력 작용하의 철근의 인발력 실험결과는 프리캐스트 기둥-RC 기초 Anchor 시공에 필요한 철근의 최소 필요 삽입 깊이를 제시한다. 또한, 실험을 통해 제시된 응력 전달 경로 및 파괴 메커니즘을 제품별 메뉴얼에 제시되어 있는 메커니즘과 비교, 검토함으로서 접합부의 명확한 응력전달 경로 및 파괴 메커니즘을 시공자의 요구 성능에 맞게 제시한다. 그러므로 본 연구를 통해 프리캐스트 콘크리트 기둥의 정확한 주근의 개수, 공칭직경, 정착 길이 등에 대한 최적의 설계 조건을 제시함으로써, 시공 시 이들에 대한 정확한 데이터를 제공한다.

본 연구는 철근콘크리트 내부 보-기둥 접합부의 전단거동 예측에 관한 비선형 모델을 제안한 것이다. 보-기둥 접합부 패널존에서의 전단거동 모델을 위하여 면내전단 예측을 위한 연화트러스모델 이론을 수정한 이론을 적용하였다. 이로부터 접합부에서의 평형조건에 의한 등가 모멘트 및 회전 관계를 이용하여 접합부에서의 전단변형 관계를 접합부의 회전스프링의 특성관계로 변환하여 고려토록 하였다. 소개된 해석모델을 축력 및 전단을 받는 내부 철근콘크리트 보-기둥 접합부의 실험과 비교하였으며, 제시된 모델은 접합부에서의 전단력 뿐만 아니라 전단변형의 예측에도 유효한 것으로 판단되었다.

An evaluation of the concrete strength has very important meaning in the maintenance and the structural safety. The reliability of ferroconcrete building is weakening and enlarging the life is strongly demanded due to the early deterioration of concrete. Like this social demand, concrete strength presumption is being indirectly executed using the result in parallel with the concrete pouring by material age. This data is usually different as concrete poured practically and the way of hardening and curing. Although existing concrete strength presumption formula is proposed, the material used and the concrete strength is different. And as a matter of remicon, the concrete strength varies according to the site and the way of curing. So the objective of this research is strength evaluation of the structural body concrete according to the concrete pouring and curing temperature change seasonally after using the system which evaluates the structural body concrete strength which is applied the transparent junction-separation mold that is presented. Also there is an objective to present the fundamental data for the constructional quality technique proposal of the structural body concrete developed in relation to field specimen and the strength evaluation method by non-breaking.

Zygomycosis and aspergillosis are representative filamentous fungal infections in the sinonasal region. However, their combined form seldom occurs. This report describes one case of zygomycosis and aspergillosis occurring in a patient that did not have diabetes or any other immunocompromising conditions. The patient presented with a history of intermittent swelling and pus discharge from the gingiva of the right maxillary posterior teeth. The radiographs demonstrated a periapical radiolucency around the right maxillary first molar, together with mild haziness and mucosal thickening of the right maxillary sinus. U nder t he c linical impression o f odontogenic sinusitis, a Caldwell-Luc operation was performed. However, the final diagnosis based on microscopic examination was combined zygomycosis and aspergillosis. Previous studies of zygomycosis occurring alone describe a very aggressive clinical course, including necrosis of tissue,cranial nerve involvement and death. Our patient did not show any of these symptoms, and recovered after surgical debridement only. It can be concluded from the present case that the prognosis of fungal infections depends on the immune status of the host, rather than behavior of the fungi.

Silicon carbide (SiC) is a promising material for power device applications due to its wide band gap(3.26 eV for 4H-SiC), high critical electric field and excellent thermal conductivity. The Schottky barrier diodeis the representative high-power device that is currently available commercially. A field plate edge-terminated4H-SiC was fabricated using a lift-off process for opening the Schottky contacts. In this case, Ni/Ti dual-metalcontacts were unintentionally formed at the edge of the Schottky contacts and resulted in the degradation ofthe electrical properties of the diodes. The breakdown voltage and Schottky barrier height (SBH, ΦB) was 107V and 0.67eV, respectively. To form homogeneous single-metal Ni/4H-SiC Schottky contacts, a deposition andetching method was employed, and the electrical properties of the diodes were improved. The modified SBDsshowed enhanced electrical properties, as witnessed by a breakdown voltage of 635V, a Schottky barrier heightof ΦB=1.48eV, an ideality factor of n=1.04 (close to one), a forward voltage drop of VF=1.6V, a specific onresistance of Ron=2.1mΩ-cm2 and a power loss of PL=79.6Wcm-2.

TFT-LCD is the most popular type of flat display panel in the information technology field. The back light unit is a main part of the structure of a TFT-LCD panel. Occasionally, studies have shown that failures of the CCFL of the BLU occur due to the poor weld characteristics of these materials. The aim of this study was to prepare some technical data and to characterize a microjoined electrode for the CCFL. Microstructure examinations, microhardness measurements, resistance measurements and microtensile tests of the microjoined electrode were carried out. The result indicates that a large amount of grain coarsening exists in the heat-affected zone (HAZ) of the weld between the cup and the pin. This grain coarsening of the HAZ between the cup and pin is caused by the welding cycle, which may have an influence on the lowest microhardness values. Fracturing of the microjoined electrode also occurred at the HAZ close to the cup between the weld holding the cup and the pin. Additionally, no specific changes of the electrical resistance among the cup, pin, and lead wire themselves or in the microjoined electrode were observed.

Crack-free joining of Si3N4 and Al2O3 using 15 layers has been achieved by a unique approach introducing Sialon polytypoids as a functionally graded materials (FGMs) bonding layer. In the past, hot press sintering of multilayered FGMs with 20 layers of thickness 500μm each has been fabricated successfully. In this study, the number of layers for FGM was reduced to 15 layers from 20 layers for optimization. For fabrication, model was hot pressed at 38 MPa while heating up to 1700˚, and it was cooled at 2˚/min to minimize residual stress during sintering. Initially, FGM with 15 layers had cracks near 90 wt.% 12H / 10 wt.% Al2O3 and 90 wt.% 12H/10 wt.% Si3N4 layers. To solve this problem, FEM (finite element method) program based on the maximum tensile stress theory was applied to design optimized FGM layers of crack free joint. The sample is 3-dimensional cylindrical shape where this has been transformed to 2-dimensional axisymmetric mode. Based on the simulation, crack-free FGM sample was obtained by designing axial, hoop and radial stresses less than tensile strength values across all the layers of FGM. Therefore, we were able to predict and prevent the damage by calculating its thermal stress using its elastic modulus and coefficient of thermal expansion. Such analyses are especially useful for FGM samples where the residual stresses are very difficult to measure experimentally.

In this paper, a new waffle-shaped(WAS) precast concrete panel was developed through the geometrical modification of the conventional double tee panel. It is a one-way joisted panel with a shallow depth and a boxed shape by wide edge beams. To investigate the structural performance of the connections between W AS panels, loading tests called by WIW were performed at the connections along short edges of two WAS panels. WIW tests were executed according to two different width of shear key(50mm and 80mm) and three types of reinforced topping concrete(wire-mesh alone, wire-mesh plus HD 10, and wire-mesh plus HD13). As a result, the grouting width of shear keys did not act on the ultimate behaviors significantly, and the flexural strength of WIW connections along the long edges of W AS panels was superior to nominal flexural strength. The connections with proper details of steel reinforcement can distribute the positive bending moment at mid-span of W AS panels to the negative moment, which is useful for efficient member design.

PPS(Post-tensioned Precast concrete System)공법은 U자형 PC로 제작된 넓은 보와 PC또는 현장 타설 콘크리트로 제작한 기둥으로 구성되며, PC보와 기둥의 일체성 확보를 위하여 프리스트레스를 도입하였다. 본 연구에서는 포스트텐션을 도입한 넓은 보-기둥 접합부의 구조적 특성을 규명하고, 다양한 변수해석이 가능하기 위한 자료를 제공하고자 유한요소해석 프로그램인 ANSYS을 사용하여 비선형 해석을 수행하였다 콘크리트에 대한 해석요소는 8개의 절점을 가지며 각 절점이 3개의 자유도(X, Y, Z축에 대한 병진 변위)를 갖는 Solid 65요소를 사용하였다. Solid 65요소에서 전단전달계수(Shear-Transfer factor)는 실험값에 근사적으로 해석값을 맞추기 위한 영향 계수값으로 균열이 발생하는 위치에 대한 전단강도의 감소를 반영한다. 그 결과, 본 실험체에 대한 해석에서는 열려진 전단전달계수 0.125와 닫혀진 전달계수 0.85에 기초하여 해석한 결과 닫혀진 전단전달계수는 0.85에서 열려진 전단전달계수에서는 0.2일때 가장 실험값에 근사한 해석치를 보였다.

최근의 건물의 동향을 보면 아름다움을 강조하여 비틀리고, 경사지고, 테이퍼형태를 가지고 있다. 이러한 건물에 대응하는 구조시스템으로 대형 대각가새 구조시스템이 등장하였다. 이 구조시스템은 건축적인 요구사항을 만족하면서 구조물량 절감의 가능성이 있지만 다수의 부재가 만나는 접합부에 대한 구조성능 평가가 필요하다. 이에 본 연구에서는 H형 단면을 이용한 대형 대각가새 구조시스템의 접합부에 대한 단조가력 실험을 수행하였으며 하중 및 변형능력을 평가하였다. 주요 변수로는 부위별로 용접방법 및 웨브의 이음길이를 적용하였다. 실험결과 완전용입용접에 대하여 국부적으로 부분용입용접을 사용한 경우와 비교해 보면 구조성능에는 차이가 없었고, 웨브의 중첩길이는 웨브사이 이격거리에 100%에 해당하는 길이가 필요함을 알 수 있었다.

1.5 μm-thick copper films deposited on silicon wafers were successfully bonded at 415˚C/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than 10.4 J/m2 as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than 300˚C had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over 400˚C. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.