Cu-Zn alloy nano powders were fabricated by the electrical explosion of Zn-electroplated Cu wire along with commercial brass wire. The powders exploded from brass wire were composed mainly of phases while those from electroplated wires contained additional Zn-rich phases as , and Zn. In case of Zn-elec-troplated Cu wire, the mixing time of the two components during explosion might not be long enough to solidify as the phases of lower Zn content. This along with the high vapor pressure of Zn appears to be the reason for the observed shift of explosion products towards the high-Zn phases in electroplated wire system.

Bioaerosols are airborne particles of biological origins including viruses, bacteria, fungi, and all varieties of living materials. In suitable hosts, bioaerosols are capable of causing acute or chornic diseases that may be infectious, allergenic, or toxigenic. Bioaerosols from outdoor air accumulate on filters of heating, ventilating and air conditioning (HVAC) system in large quantities and are able to multiply there under certain conditions. In this study, silver was coated on activated carbon fiber (ACF) filters by an electroless plating method, and their efficacy for bioaerosols removal was tested. Physical filtration and biological antimicrobial test were performed. SEM and XRD analyses were used to characterize the morphology and components of ACF filters. Electroless silver-plated ACF filters showed antimicrobial efficiency, whereas pure ACF filters did not. It was found that electroless silver plating did not influence the physical filtration efficiency of ACF filters.

Al-Cu alloy nano powders were produced by the electrical explosion of Cu-plated Al wires. The composition and phase of the alloy could be controlled by varying the thickness of Cu deposit on Al wire. When the Cu layer was thin, Al solid solution and were the major phases. As the Cu layer becomes thicker, Al diminished while phase prevailed instead. The average particle size of Al-Cu nano powders became slightly smaller from 63 nm to 44 nm as Cu layer becomes thicker. The oxygen content of Al-Cu powder decreased linearly with Cu content. It is well demonstrated that the electrodeposition combined with wire explosion could be simple and economical means to prepare variety of alloy and intermetallic nano powders.

Ni-diamond composite powders with nickel layer of round-top type on the surface of synthetic diamond (140/170 mesh) were prepared by the electroless plating method (EN) with semi-batch reactor. The effects of nickel concentration, feeding rates of reductant, temperature, reaction time and stirring speeds on the weight percentage and morphology of deposited Ni, mean particle size and specific surface area of the composite powders were investigated by Atomic Adsortion Spectrometer, SEM-EDX, PSA and BET. It was found that nucleated Ni-P islands, acted as catalytic sites for further deposition and grown into these relatively thick layers with nodule-type on the surface of diamond by a lateral growth mechanism. The weight percentage of Ni in the composite powder increased with reaction time, feeding rate of reductant and temperature, but decreased with stirring speed. The weight percentage of Ni in Ni-diamond composite powder was 55% at 150 min., 200 rpm and 7 .

해양환경의 비저항 변화에 따른 모재, Ni도금 및 Cr도금의 분극저항, 부식전류밀도, 부식억제율 및 분극지배기구에 관하여 연구한 결과 다음과 같은 결론을 얻었다. 1) Cr도금 및 Ni도금의 분극저항은 모재의 분극저항보다 더 높게 나타나고, 이들 재료의 분극저항은 비저항이 감소함에 따라 낮아진다. 2) 비저항이 낮아질수록 Cr도금 및 Ni도금의 부식전류밀도는 모재의 부식전류보다 더 억제됨에 따라 Ni 및 Cr도금의 부식억제율은 더 높게 된다. 3) 해양환경의 비정항에 따른 모재, Ni도금 및 Cr 도금의 부식반응은 음극지배로 판단된다.(이 논문의 결론부분임)

In this paper, we proposed the optimal process conditions on the electro-gilding process. The responses are plating thickness and Sn proportion. The factors are temperature, current density, and addition. We minimized the total number of experiments based on the principle of dividing into small part. We grouped the factors using the plating process information which we already knew. We did Hull Cell test to find relationship between plating solution and electric effects, and applied ANOVA and RSM to estimate the optimal process conditions.

무전해 PCB 도금 공정 수세액을 분리막으로 처리하여 투과수는 공업용수로 재사용하고 유가금속인 금(Au)을 회수하는 방법에 관하여 연구하였다. 역삼투 분리막 테스트 셀을 이용하여 수세액 처리에 적합한 분리막을 선정하였으며 scale-up을 위한 나권형 모듈 투과 실험을 실시하였다. 먼저, (주)새한에서 생산되는 RO-TL(tap water, low pressure), RO-BL(brackish water, low pressure), RO-normal(for water purifier)막으로 투과실험하였으며 그 중 RO-TL막이 soft etching, 촉매 및 Ni 수세액 처리에 우수한 것으로 판명되었다. 따라서 RO-TL막으로 제작한 나권형 가정용 정수기 모듈로 7bar, 25℃에서 scale-up 실험을 수행하였다. Au수세액의 투과 유속은 약 30 LMH로서 가장 높았으나 Au 제거율이 80% 미만이었다. Pd, Ni 및 soft etching 수세액의 투과유속은 각각 약 22, 17, 10 LMH 정도이며 Pd의 제거율은 85% 이상, Ni 및 Cu 제거율은 97% 이상이었다. 또한 Au, Ni 및 Cu 이온이 함유된 수세액 중 유가금속인 Au를 선택적으로 회수하기 위하여 NF막을 사용하였다. Au수세액 중 Ni 및 Cu 이온은 대부분 제거되었으며 투과액 중에 Au이온이 81.9% 존재하였고 계속하여 RO-TL막으로 Au를 농축 회수하였다. 마지막으로 4"직경의 NF 및 RO-TL 나권형 모듈을 연속적으로 사용하여 Au를 효과적으로 회수할 수 있음을 재확인하였다.인하였다.