As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

This paper presents the stress distribution of the damaged butt joint of steel plate using CFRP laminates when the flange in tension zone of steel box girder is welded by butt welding. When CFRP sheets are patched on tension flange of steel-box girder, the stress distribution of a vertical and normal direction on damaged welding part is shown as parameters such as a variation of the thickness of adhesive, the overlap length with steel, and the modulus of elasticity of CFRP sheets. For the study, we wrote the computer program using the EAS(Enhanced assumed strain) finite element method for plane strain that has a very fast convergency and exact stress for distorted shape.

국내의 경우 노후화된 콘크리트 포장에 대한 일반적인 유지보수 공법으로 아스팔트 덧씌우기 공법이 사용되고 있다. 그러나 기존 콘크리트 포장의 수명을 연장시키기 위한 아스팔트 덧씌우기 공법의 경우, 기존 포장과의 물리적 특성이 상이하여 반사균열, 포트홀 및 소성변형 등의 다양한 포장 파손이 발생하고 있는 실정이다. 이와 같은 문제점을 해결하기 위하여 아스팔트 덧씌우기 공법을 대처하기 위한 방안으로 콘크리트 덧씌우기 공법의 적용이 요구되고 있는 실정이다. 콘크리트 덧씌우기 공법은 사용 연한이 길고, 중차량에 대한 지지력이 우수하며, 소성변형이 발생하지 않으므로 유지보수 빈도 및 유지관리비를 현저히 줄일 수 있는 장점이 있다. 하지만 비교적 긴 양생기간으로 인하여 우회도로 가설 및 교통통제 등의 기술적인 문제가 발생한다. 따라서 본 연구에서는 충분한 작업성 확보 및 신속한 교통개방을 위하여 초속경 아크릴계 폴리머 개질 콘크리트를 사용하여 작업성, 내구성 및 환경저항성에 대한 평가를 통한 접착식 콘크리트 덧씌우기 공법의 적용성을 검토하였다. 조기 교통개방 특성 평가를 위한 강도측정 결과 재령 4시간 후 압축강도 21MPa, 부착강도 1.4MPa를 상회하는 결과를 확인하였다. 또한 환경하중 저항성 실험 결과 일반 포틀랜드 시멘트 콘크리트에 비해 매우 우수하여 내구성을 확보할 것으로 판단하였다. 따라서 본 연구를 통하여 초속경 아크릴계 폴리머 개질 콘크리트는 대규모 접착식 콘크리트 덧씌우기 공법에 적합한 재료로써, 충분한 작업성 및 신속한 조기 교통개방을 요구하는 유지보수 공법 적용이 가능할 것으로 판단된다.

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

Polyurethane adhesive is used in various fields as flexible packaging materials including a food packaging field. Therefore, the purpose of this study is synthesis of polyurethane adhesive which uses aliphatic isocyanate, and compares with aromatic isocyanate. The isocyanates for this test are toluene-2,4-diisocyanate(TDI), hexamethylene diisocyanate(HDI), 4,4-dicyclohexyl ethane diisocyanate(H12MDI), and isophorone diisocyanate(IPDI). And, the effect of any other diisocyanate are evaluated by several methods as for curing rate test, accelerate weathering test, and peel strength test. The polyurethane adhesive using curing catalyst and HDI has adhesion strength of about 560 g/15 mm between aluminium foil and nylon, about 1,520 g/15 mm between nylon and CPP. Those parameters are similar to polyurethane adhesive with TDI. Also, in case of curing rate, those are similar to TDI type polyurethane adhesive. Moreover, data of δE as color variation by QUV tester is equal to 4.12, as 48% against those of TDI type.

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and 6.44 J/m2 for 400, 450, and 500˚C, respectively, in a N2 atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

The crack initiation equals to fracture for bonded joint with brittle adhesive. The criterion is formulated in terms of the quasi-stress intensity factor Kp, for the maximum principle stress, that is analogous to the stress intensity factor used to characterize the stress field in the vicinity of bond terminus. Kp is evaluated using a boundary element analysis. The crack initiation at the terminus of adhesive bonded joints is estimated with the critical quasi-stress intensity factor Kp. This method presented here hardly pays attention to the crack propagation. Since there is a large influence of crack propagation on the strength of adhesive joints and structures, crack propagation must be taken into account on strength prediction of bonded joints. The quasi-stress intensity factor Kp for the maximum principle stress can use as the criteria of the crack initiation at the terminus of adhesive bonded joints having various shapes.

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

This paper describes an improved strategy for controlling the adhesion force using both the antiadhesion and adhesion layers for a successful large-area transfer process. An MPTMS (3-mercaptopropyltrimethoxysilane) monolayer as an adhesion layer for Au/Pd thin films was deposited on Si substrates by vapor self assembly monolayer (VSAM) method. Contact angle, surface energy, film thickness, friction force, and roughness were considered for finding the optimized conditions. The sputtered Au/Pd (~17 nm) layer on the PDMS stamp without the anti-adhesion layer showed poor transfer results due to the high adhesion between sputtered Au/Pd and PDMS. In order to reduce the adhesion between Au/Pd and PDMS, an anti-adhesion monolayer was coated on the PDMS stamp using FOTS (perfluorooctyltrichlorosilane) after O2 plasma treatment. The transfer process with the anti-adhesion layer gave good transfer results over a large area (20 mm × 20 mm) without pattern loss or distortion. To investigate the applied pressure effect, the PDMS stamp was sandwiched after 90˚ rotation on the MPTMS-coated patterned Si substrate with 1-μm depth. The sputtered Au/Pd was transferred onto the contact area, making square metal patterns on the top of the patterned Si structures. Applying low pressure helped to remove voids and to make conformal contact; however, high pressure yielded irregular transfer results due to PDMS stamp deformation. One of key parameters to success of this transfer process is the controllability of the adhesion force between the stamp and the target substrate. This technique offers high reliability during the transfer process, which suggests a potential building method for future functional structures.

The objectives of the present study are to show how to predict the crack initiation at the terminus of adhesive bonded joints to calculate the crack growth in the adhesive layer using the total strain energy release rate. The crack propagation for ductile adhesives is theoretically estimated using -curve. -curve is determined from static shearing tests of single lap joints. The total strain energy release rate for single lap joints is evaluated using a boundary element analysis. The strength prediction is conducted by means of the R-curve and the total strain energy release rate.The conclusions are summarized as follows; (1) A crack propagation geometry of the bonded structure using ductile adhesive was predicted from the distribution of the total strain energy release rate. (2) The final failure load for lap joints is predicted by the R-curve method based on the fracture mechanics. (3) The final failure load for stiffened plates with a steel L-beam is predicted by the R-curve method based on the fracture mechanics.

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of 300˚C for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer (200Å), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of 300˚C for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.

The effect of annealing treatment conditions on the interfacial adhesion energy between electrolessplated Ni film and polyimide substrate was evaluated using a 180˚ peel test. Measured peel strength values are 26.9±0.8, 22.4±0.8, 21.9±1.5, 23.1±1.3, 16.1±2.0 and 14.3±1.3g/mm for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at 200˚C in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

1.5 μm-thick copper films deposited on silicon wafers were successfully bonded at 415˚C/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than 10.4 J/m2 as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than 300˚C had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over 400˚C. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

The magnetron sputtering was used to deposit Ni buffer layers on the polyimide surfaces to increase the adhesion strength between Cu thin films and polyimide as well as to prevent Cu diffusion into the polyimide. The Ni layer thickness was varied from 100 to 400Å. The adhesion strength increased rather significantly up to 200Å of Ni thickness, however, there was no significant increase in strength over 200Å. The XPS analysis revealed that Ni thin films could increase the adhesion strength by reacting with the polar C=O bonds on the polyimide surface and also it could prevent Cu diffusion into the polyimide. The Cu/Ni/ polyimide multilayer thin films showed a high stability even at the high heating temperature of 200˚C, however, at the temperature of 300˚C, Cu diffused through the Ni buffer layer into polyimide, resulting in the drastic decrease in adhesion strength.

Kevlar was chemically surface modified with resorcinol-formaldehyde(RF) prepolymer and VP rubber latex for application to high strength tirecords. RF prepolymer was easily obtained by polymerization at room temperature in the presence of a base catalyst. The mechanical and thermal properties of Kevlar were not significantly changed during surface treated under various conditions. The change of adhesion with rubber were investigated through H-test method. Maximum increase of adhesion force between rubber and Kevlar was obtained up to 40% than that of untreated one when the fiber was soaked in RFL dipping solution and thermally treated at 170℃ for 3 - 5min.