10년 동안 경남 진주에서 수행된 야외 노출 시험은 실외 접지 환경(H4)에서 Alkaline Copper Quaternary(ACQ)로 방부 처리된 화이트 스프루스 (Picea glauca)의 사용 가능성을 보여주었으나, 10년이 경과하면서 일부 목재 시편에서 목재 부후균에 의한 가해가 관찰되었다. 부후 원인을 종합적으로 평가하기 위해 야외 노출 시험을 종료한 후 목재 시편들의 부후 상태를 조사하였으며 또한 목재 시편 내 방부제 유효 성분의 보유량 및 침윤도를 측정하였다. 스프루스 방부목의 약제 보유량은 국내 방부목 품질 기준(보유량: 5.2kg/m3 이상)을 충족하였으며, 변재 부위는 대부분 균일한 방부 처리를 보였다. 그러나 심재의 경우 자상 처리에도 불구하고 국내 방부목 품질 기준에서 규정하고 있는 최소 침윤 깊이인 8 mm를 충족하지 못하였다. 대부분의 목재 부후는 할렬의 발생에 의해 방부 처리되지 않은 심재의 미처리 부위가 노출됨에 의해 발생하였으며, 토양과 접한 지접부에서 할렬 발생이 다른 부위에 비해 상대적으로 많았는데, 이는 지상부나 지하부에 비해 수분의 이동이 용이하여 목재의 수축과 팽창 발생이 용이하기 때문인 것으로 판단된다. 이상의 결과로부터 H4에서 스프루스 방부목은 자상 처리를 하더라도 방부제가 깊이 침투되지 않는 심재의 특성 때문에 10년 이상의 사용 안전성을 요구하는 산업적인 용도로는 적합하지 않다고 할 수 있다.

In this study, copper oxide, manganese oxide and zeolite, clays containing catalysts were prepared to remove hydrogen sulfide emitted in odor of industry. In order to change the heat treatment temperature, a catalyst was prepared 100 degrees from 600 degrees to 1,000 degrees. GC-MS was used to confirm the hydrogen sulfide removal performance. Although the removal performance produced at 600 degrees was maintained by and large, the removal performance decreased as the temperature increased. In particular, the catalyst manufactured at 900 and 1000 degrees had low removal performance. To find out the cause of the decrease in removal performance, the analytical devices XRD, BET, XRF were used. In order to confirm the properties of the catalyst before and after adsorption, SEM-EDS and CS were used. As a result of analyzing the Cu-Mn catalyst, it was confirmed that the material was adsorbed on the surface. To confirm the adsorbent material, SEM-Mapping was employed. And it was verified that the sulfur was adsorbed. Measuring the SEM-EDS 3Point, it was confirmed to be about 25.09%. Another test method CS analyzer (Carbon/Sulfur Detector) was also deployed. As a result of the test, sulfur was confirmed to be about 27.2%. So comparing the two sets of data, it was verified that sulfur was adsorbed on the surface.

Cu-Ti thin films were fabricated using a combinatorial sputtering system to realize highly sensitive surface acoustic wave (SAW) devices. The Cu-Ti sample library was grown with various chemical compositions and electrical resistivity, providing important information for selecting the most suitable materials for SAW devices. Considering that acoustic waves generated from piezoelectric materials are significantly affected by the resistivity and density of interdigital transducer (IDT) electrodes, three types of Cu-Ti thin films with different Cu contents were fabricated. The thickness of the Cu-Ti thin films used in the SAW-IDT electrode was fixed at 150 nm. As the Cu content of the Cu-Ti films was increased from 31.2 to 71.3 at%, the resistivity decreased from 10.5 to 5.8 × 10-5 ohm-cm, and the density increased from 5.5 to 7.3 g/cm3, respectively. A SAW device composed of Cu-Ti IDT electrodes resonated at exactly 143 MHz without frequency shifts, but the full width at half maximum (FWHM) values of the resonant frequency gradually increased as the Cu content increased. This means that although the increase in Cu content in the Cu-Ti thin film helps to improve the electrical properties of the IDT electrode, the increased density of the IDT electrode deteriorates the acoustic performance of SAW devices.

To reduce production cost and inhibit the aggregation of graphene, graphene oxide and copper nitrate solution were used as raw materials in the paper. Cu particles were introduced to the graphene nanosheets by in-situ chemical reduction method in the hydrazine hydrate and sodium hydroxide solution, and the copper matrix composite reinforced with Cu-doped graphene nanosheets were fabricated by powder metallurgy. The synthesized Cu-doped graphene was characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS). The relative density, hardness, electrical conductivity and tensile strength of the copper matrix composite reinforced with Cudoped graphene were measured as well. The results show that copper ions and graphene oxide can be effectively reduced by hydrazine hydrate simultaneously. Most of oxygen functional groups on the Cu-doped graphene sheets can be removed dramatically, and Cu-doped graphene inhibit the graphene aggregation effectively. Within the experimental range, the copper matrix composites have good comprehensive properties with 0.5 wt% Cu-doped graphene. The tensile strength and hardness are 221 MPa and 81.6 HV, respectively, corresponding to an increase of 23% and 59% compared to that of pure Cu, and the electrical conductivity reaches up to 93.96% IACS. However, excessive addition of Cu-doped graphene is not beneficial for the improvement on the hardness and electrical conductivity of copper matrix composite.

Cu2+/polyacrylonitrile composite fibers were prepared by electrospinning, and then Cu/carbon nanofibers (denoted as Cu/ CNF-X; X = Cu content, 0, 3, or 5 wt%) were formed by calcining them. The effects of Cu2+ content and carbonization temperature on the conductivity and electrothermal conversion of Cu/CNF-X were investigated. The results revealed that the conductivity and electrothermal properties of Cu/CNF-X improve with the increase in the Cu2+ content and carbonization temperature. When the carbonization temperature was 800, 900, or 1000 °C, the conductivity of Cu/CNF-5 (0.08, 0.68, or 2.48 S/cm, respectively) increased to 1.6, 1.5, or 1.6 times that of Cu/CNF-0, respectively. The highest instantaneous surface temperatures of Cu/CNF-5 calcined at 800, 900, and 1000 °C (36, 145, and 270.2 °C, respectively) increased by 4, 25.5, and 44.6 °C, respectively, compared with those of the corresponding Cu/CNF-0 samples (32, 120.3, and 225.6 °C, respectively). Thus, the addition of a small amount of Cu2+ effectively improved the conductivity and electrothermal conversion performance of Cu/CNF-X, which has potential application value in industrial products in the future.

Heavy metal ions pollution has become of worldwide critical concern, thus, it is particularly important to monitor it in the environment and food for ensuring human health. In this study, p-phenylenediamine and 2-mercaptothiazoline were used to prepare nitrogen (N) and sulfur (S) co-doped carbon dots (N/SCDs) for fluorescent and colorimetric detection of Cu2+. The fabricated N/SCDs with bright green fluorescence showed excellent optical characteristics and favorable water solubility. In an aqueous system, a significant fluorescence quenching of N/SCDs at 512 nm is obtained in the presence of Cu2+. It also caused a significant colorimetric response with the color of prepared N/SCDs solution changed from colorless to yellow. Under optimal conditions, the analytical results showed that the linear range spanning from 5 to 400 μM, with a detection limit of 0.215 μM in fluorescence and 0.225 μM in colorimetric detection. In addition, N/SCDs displayed high selectivity toward Cu2+. No obvious interference was observed over other metal ions. Furthermore, we have also used N/SCDs to monitor Cu2+ in tap and lake water. The recovery of Cu2+ ranged between 89.6% and 113.1%. Exhibiting remarkable sensitivity and selectivity, the designed sensor offers a promising detection method for Cu2+ detection in the real sample.

Copper-coated carbon fibers have excellent conductivity and mechanical properties, making them a promising new lightweight functional material. One of the main challenges to their development is the poor affinity between carbon fiber and metals. This paper selects different carbon fibers for copper electroplating experiments to study the effect of carbon fiber properties on the interface bonding performance between the copper plating layer and carbon fibers. It has been found that the interfacial bonding performance between copper and carbon fiber is related to the degree of graphitization of carbon fiber. The lower the degree of graphitization of carbon fiber, the smaller the proportion of carbon atoms with sp2 hybrid structure in carbon fiber, the stronger the interfacial bonding ability between carbon fiber and copper coating. Therefore, carbon fiber with lower graphitization degree is conducive to reducing the falling off rate of copper coating and improving the quality of copper coating, and the conductivity of copper-plated carbon fibers increases with the decrease of graphitization degree of carbon fibers. The conductivity of copper-plated carbon fibers increases by more than six times when the graphitization degree of carbon fibers decreases by 23.9%. This work provides some benchmark importance for the preparation of highquality copper-plated carbon fibers.

This study evaluated the risk of single and combined exposure to microplastics in zebrafish (Danio rerio) through biomarkers, such as survival rate, excretion rate, and histological alterations of organ systems. The experimental groups were the control (Cont.), single microplastics exposure group (MPs, 1.83%/fish total weight (g)), the copper group (Cu, 21.6 μg L-1), and a group with combined exposure to MPs and copper (MPs*Cu). The experiment was conducted with individual exposure (7 days) for MP excretion rate analysis and group exposure (14 days) for biomarker analysis. The daily excretion rate of MPs tended to decrease in a time-dependent manner. The copper concentration in the body was not significantly different between single and combined copper exposure. The degeneration of mucous cells in the skin, capillary dilation of the gill lamella, increased intestinal mucous, hepatocyte hypertrophy, and the degeneration of glomeruli and renal tubules were observed in all exposure groups. These histological alterations showed the highest tendency in the MPs*Cu group. In this study, the changes in biomarkers were attributed to the single effect of copper or the combined effect of copper and MPs rather than being solely influenced by MPs.

The ecosystem provides a diverse array of environmental conditions for organisms, and only those that are capable of successfully adapting to these conditions within their habitats can endure, thrive, and proliferate. Further, the environmental conditions within these habitats can significantly affect the bioavailability of chemicals that are introduced therein, thus resulting in varied adverse impacts on the organisms. The present study aims to evaluate the sensitivity of Yuukianura szeptyckii - a species adapted to riparian - to heavy metals following ISO guideline 11276, with the objective of assessing its potential as an indicator species for ecotoxicological evaluations in riparian habitats. The findings revealed that cadmium and copper both had significant toxic effects depending on their concentrations. For cadmium, the LC50 was 280 mg kg-1, EC50 was 66 mg kg-1, and NOEC and LOEC were 25 and 50 mg kg-1, respectively. For copper, the LC50 was 911 mg kg-1, EC50 was 151 mg kg-1, and LOEC was 50 mg kg-1. Comparative analysis with previous results for the international standard species Folsomia candida and the domestic standard species Allonychiurus kimi indicated that Y. szeptyckii exhibited even greater sensitivity to toxicity values. The adverse effects on survival and reproduction were closely associated with the influx concentration of heavy metals in their bodies. Altogether, the results suggest that Y. szeptyckii is a sensitive species for ecotoxicological assessments in riparian habitats, thus making it suitable as an indicator species, particularly in riparian ecosystems that are characterized by relatively high humidity conditions.

This study improved the work efficiency by supplementing the shortcomings of the manual process by developing a double tube feeding device, and the following results were obtained by conducting the production capacity, production length, and defect rate tests. Developed a double tube production system to enable the simultaneous production of two tubes, increasing the production volume by about 1.5 times. The product length has been improved from semi-automatic to automated, and the production capacity has been improved from 16 to 25 pieces per hour (based on 15m). Developed a double-tube input straight line automatic adjustment feeder, which resulted in reducing the defect rate to less than 1%.

The flaw of low dispersibility in the metal matrix brought on by graphene's full crystal structure can be improved by the application of ion beam radiation to the surface of the material. Copper atoms are uniformly dispersed on the modified graphene oxide ( GOM) surface after being irradiated to a copper ion beam, and during the sputtering modification, the valence state of copper is changed, resulting in the formation of a new CuO phase on the graphene oxide (GO) surface. Therefore, after copper ion beam irradiation of graphene, the interfacial adhesion between GOM and copper matrix is enhanced, and the wear resistance is significantly improved. When the GOM content is low, it can withstand most of the load during the friction and wear test, which reduces the wear of the copper matrix and the occurrence of fatigue cracks at the interface of the composite material.

This study focuses on how the partial substitution of copper by nickel nanoparticles affects the electrical and structural properties of the Bi2Ba2Ca2Cu2.9Ni0.1O10+δ, Bi2Ba2Ca2Cu2.8Ni0.2O10+δ and Bi2Ba2Ca2Cu2.6Ni0.4O10+δ compounds. Approximate values of crystallization size and crystallization percentage for the three compounds were calculated using the Scherer, modified Scherer, and Williamson-Hall methods. A great similarity was observed in the crystal size values from the Scherer method, 243.442 nm, and the Williamson-Hall method, 243.794 nm for the second sample. At the same time this sample exhibited the highest crystal size value for the three methods. In the examination of electrical properties, the sample with 0.1 partial substitution, Bi2Ba2Ca2Cu2.9Ni0.1O10+δ was determined to be the best with a critical temperature of 100 K and an energy gap of 6.57639 × 10-21 MeV. Using the SEM technique to analyze the structural morphology of the three phases, it was discovered that the size of the granular forms exceeds 25 nm. It was determined that the samples’ shapes alter when nickel concentration rises. The patterns that reveal the distribution of the crystal structure also exhibit clear homogeneity.

Thermite welding is an exceptional process that does not require additional energy supplies, resulting in welded joints that exhibit mechanical properties and conductivity equivalent to those of the parent materials. The global adoption of thermite welding is growing across various industries. However, in Korea, limited research is being conducted on the core technology of thermite welding. Currently, domestic production of thermite powder in Korea involves recycling copper oxide (CuO). Unfortunately, controlling the particle size of waste CuO poses challenges, leading to the unwanted formation of pores and cracks during thermite welding. In this study, we investigate the influence of powder particle size on thermite welding in the production of Cu-thermite powder using waste CuO. We conduct the ball milling process for 0.5–24 h using recycled CuO. The evolution of the powder shape and size is analyzed using particle size analysis and scanning electron microscopy (SEM). Furthermore, we examine the thermal reaction characteristics through differential scanning calorimetry. Additionally, the microstructures of the welded samples are observed using optical microscopy and SEM to evaluate the impact of powder particle size on weldability. Lastly, hardness measurements are performed to assess the strengths of the welded materials.

Nowadays, variable materials have been investigated to find alternative lightweight conductors instead of copper because copper has a relatively high density. Carbon nanotube (CNT) is one of the most suitable materials as an alternative conductor to Cu, thanks to its high conductivity. In addition, CNT has many other great properties, such as low density, high strength, and high ampacity. However, individual CNT loses some of its performance after the assembly process. Therefore, CNT materials have been electroplated with copper to achieve lighter conductors. In this study, CNT buckypaper (CNTBP) is fabricated using a multi-walled carbon nanotube and copper electroplated using optimizing electrolyte with the help of additive chemicals such as accelerator and suppressor. Furthermore, the effect of hydrochloric acid in the electrolyte on the electroplating of CNTBP is observed. The results show that HCl in electrolyte enhances the effectiveness of additive chemicals and provide a well-plated CNTBP@Cu composite. The composite in this study is expected to be used in various areas.

Carbon nanotube fiber is a promising material in electrical and electronic applications, such as, wires, cables, batteries, and supercapacitors. But the problem of joining carbon nanotube fiber is a main obstacle for its practical development. Since the traditional joining methods are unsuitable because of low efficiency or damage to the fiber structure, new methods are urgently required. In this study, the joining between carbon nanotube fiber was realized by deposited nickel–copper doublelayer metal via a meniscus-confined localized electrochemical deposition process. The microstructures of the double-layer metal joints under different deposition voltages were observed and studied. It turned out that a complete and defect-free joint could be fabricated under a suitable voltage of 5.25 V. The images of the joint cross section and interface between deposited metal and fiber indicated that the fiber structure remained unaffected by the deposited metal, and the introduction of nickel improved interface bonding of double-layer metal joint with fiber than copper joint. The electrical and mechanical properties of the joined fibers under different deposition voltages were studied. The results show that the introduction of nickel significantly improved the electrical and mechanical properties of the joined fiber. Under a suitable deposition voltage, the resistance of the joined fiber was 37.7% of the original fiber, and the bearing capacity of the joined fiber was no less than the original fiber. Under optimized condition, the fracture mode of the joined fibers was plastic fiber fracture.

This research studied the electrical characteristics, IR transmission characteristics, stealth functions, and thermal characteristics of infrared thermal-imaging cameras of copper-sputtered samples. Nylon samples were prepared for each density as a base material for copper-sputtering treatment. Copper-sputtered NFi, NM1, NM2, NM3, NM4, and NM5, showed electrical resistance of 0.8, 445.7, 80.7, 29.7, 0.3, and 2.2 Ω, respectively, all of which are very low values; for the mesh sample, the lower the density, the lower the electrical resistance. Measuring the IR transmittance showed that the infrared transmittance of the copper-sputtered samples was significantly reduced compared to the untreated sample. Compared to the untreated samples, the transmittance went from 92.0–64.1%. When copper sputtered surface was directed to the IR irradiator, the IR transmittance went from 73.5 to 43.8%. As the density of the sample increased, the transmittance tended to decreased. After the infrared thermal imaging, the absolute values of △R, △G, and △B of the copper phase increased from 2 to 167, 98 to 192, and 7 to 118, respectively, and the closer the density of the sample (NM5→NFi), the larger the absolute value. This proves that the dense copper phase-up sample has a stealth effect on the infrared thermal imaging camera. It is believed that the copper-sputtered nylon samples produced in this study have applications in multifunctional uniforms, bio-signal detection sensors, stage costumes, etc.