Tb3+-doped CaNb2O6 (CaNb2O6:Tb3+) thin films were deposited on quartz substrates at a growth temperature of 300 °C using radio-frequency magnetron sputtering. The deposited thin films were annealed at several annealing temperatures for 20 min and characterized for their structural, morphological, and luminescent properties. The experimental results showed that the annealing temperature had a significant effect on the properties of the CaNb2O6:Tb3+ thin films. The crystalline structure of the as-grown CaNb2O6:Tb3+ thin films transformed from amorphous to crystalline after annealing at temperatures greater than or equal to 700 °C. The emission spectra of the thin films under excitation at 251 nm exhibited a dominant emission band at 546 nm arising from the 5D4 → 7F5 magnetic dipole transition of Tb3+ and three weak emission bands at 489, 586, and 620 nm, respectively. The intensity of the 5D4 → 7F5 (546 nm) magnetic dipole transition was greater than that of the 5D4 → 7F6 (489 nm) electrical dipole transition, indicating that the Tb3+ ions in the host crystal were located at sites with inversion symmetry. The average transmittance at wavelengths of 370~1,100 nm decreased from 86.8 % at 700 °C to 80.5 % at an annealing temperature of 1,000 °C, and a red shift was observed in the bandgap energy with increasing annealing temperature. These results suggest that the annealing temperature plays a crucial role in developing green light-emitting CaNb2O6:Tb3+ thin films for application in electroluminescent displays.

Recent advances in technology using ultra-thin noble metal film in oxide/metal/oxide structures have attracted attention because this material is a promising alternative to meet the needs of transparent conduction electrodes (TCE). AZO/ Ag/AZO multilayer films are prepared by magnetron sputtering for Cu2ZnSn(S,Se)4 (CZTSSe) of kesterite solar cells. It is shown that the electrical and optical properties of the AZO/Ag/AZO multilayer films can be improved by the very low resistivity and surface plasmon effects due to the deposition of different thicknesses of Ag layer between oxide layers fixed at AZO 30 nm. The AZO/Ag/AZO multilayer films of Ag 15 nm show high mobility of 26.4 cm2/Vs and low resistivity and sheet resistance of 3.58*10−5 Ωcm and 5.0 Ω/sq. Also, the AZO/Ag (15 nm)/AZO multilayer film shows relatively high transmittance of more than 65% in the visible region. Through this, we fabricated CZTSSe thin film solar cells with 7.51% efficiency by improving the short-circuit current density and fill factor to 27.7 mV/cm2 and 62 %, respectively.

Aluminum nitride, a compound semiconductor, has a Wurtzite structure; good material properties such as high thermal conductivity, great electric conductivity, high dielectric breakdown strength, a wide energy band gap (6.2eV), a fast elastic wave speed; and excellent in thermal and chemical stability. Furthermore, the thermal expansion coefficient of the aluminum nitride is similar to those of Si and GaAs. Due to these characteristics, aluminum nitride can be applied to electric packaging components, dielectric materials, SAW (surface acoustic wave) devices, and photoelectric devices. In this study, we surveyed the crystallization and preferred orientation of AlN thin films with an X-ray diffractometer. To fabricate the AlN thin film, we used the magnetron sputtering method with N2, NH3 and Ar. According to an increase in the partial pressures of N2 and NH3, Al was nitrified and deposited onto a substrate in a molecular form. When AlN was fabricated with N2, it showed a c-axis orientation and tended toward a high orientation with an increase in the temperature. On the other hand, when AlN was fabricated with NH3, it showed a-axis orientation. This result is coincident with the proposed mechanism. We fabricated AlN thin films with an a-axis orientation by controlling the sputtering electric power, NH3 pressure, deposition speed, and substrate temperature. According to the proposed mechanism, we also fabricated AlN thin films which demonstrated high aaxis and c-axis orientations.

ZnO thin films co-doped with Mg and Ga (MxGyZzO, x+y+z=1, x=0.05, y=0.02 and z=0.93) were preparedon glass substrates by RF magnetron sputtering with different sputtering powers ranging from 100W to 200W at a substratetemperature of 350oC. The effects of the sputtering power on the structural, morphological, electrical, and optical propertiesof MGZO thin films were investigated. The X-ray diffraction patterns showed that all the MGZO thin films were grown asa hexagonal wurtzite phase with the preferred orientation on the c-axis without secondary phases such as MgO, Ga2O3, orZnGa2O4. The intensity of the diffraction peak from the (0002) plane of the MGZO thin films was enhanced as the sputteringpower increased. The (0002) peak positions of the MGZO thin films was shifted toward, a high diffraction angle as thesputtering power increased. Cross-sectional field emission scanning electron microscopy images of the MGZO thin filmsshowed that all of these films had a columnar structure and their thickness increased with an increase in the sputtering power.MGZO thin film deposited at the sputtering power of 200W showed the best electrical characteristics in terms of the carrierconcentration (4.71×1020cm−3), charge carrier mobility (10.2cm2V−1s−1) and a minimum resistivity (1.3×10−3Ωcm). A UV-visible spectroscopy assessment showed that the MGZO thin films had high transmittance of more than 80% in the visibleregion and that the absorption edges of MGZO thin films were very sharp and shifted toward the higher wavelength side, from270nm to 340nm, with an increase in the sputtering power. The band-gap energy of MGZO thin films was widened from3.74eV to 3.92eV with the change in the sputtering power.

In2O3 films were deposited by RF magnetron sputtering on a glass substrate and then the effect of post depositionannealing in nitrogen atmosphere on the structural, optical and electrical properties of the films was investigated. Afterdeposition, the annealing process was conducted for 30 minutes at 200 and 400oC. XRD pattern analysis showed that the asdeposited films were amorphous. When the annealing temperature reached 200-400oC, the intensities of the In2O3 (222) majorpeak increased and the full width at half maximum (FWHM) of the In2O3 (222) peak decreased due to the crystallization. Thefilms annealed at 400oC showed a grain size of 28nm, which was larger than that of the as deposited amorphous films. Theoptical transmittance in the visible wavelength region also increased, while the electrical sheet resistance decreased. In this study,the films annealed at 400oC showed the highest optical transmittance of 76% and also showed the lowest sheet resistance of89Ω/□. The figure of merit reached a maximum of 7.2×10−4Ω−1 for the films annealed at 400oC. The effect of the annealingon the work-function of In2O3 films was considered. The work-function obtained from annealed films at 400oC was 7.0eV. Thus,the annealed In2O3 films are an alternative to ITO films for use as transparent anodes in OLEDs.

The CdS thin film used as a window layer in the CdTe thin film solar cell transports photo-generated electrons to the front contact and forms a p-n junction with the CdTe layer. This is why the electrical, optical, and surface properties of the CdS thin film influence the efficiency of the CdTe thin film solar cell. When CdTe thin film solar cells are fabricated, a heat treatment is done to improve the qualities of the CdS thin films. Of the many types of heat treatments, the CdCl2 heat treatment is most widely used because the grain size in CdS thin films increases and interdiffusion between the CdS and the CdTe layer is prevented by the heat treatment. To investigate the changes in the electrical, optical, and surface properties and the crystallinity of the CdS thin films due to heat treatment, CdS thin films were deposited on FTO/glass substrates by the rf magnetron sputtering technique, and then a CdCl2 heat treatment was carried out. After the CdCl2 heat treatment, the clustershaped grains in the CdS thin film increased in size and their boundaries became faint. XRD results show that the crystallinity improved and the crystalline size increased from 15 to 42 nm. The resistivity of the CdS single layer decreased from 3.87 to 0.26 Ωcm, and the transmittance in the visible region increased from 64% to 74%.

Ultra-thin aluminum (Al) and tin (Sn) films were grown by dc magnetron sputtering on a glass substrate. The electrical resistance R of films was measured in-situ method during the film growth. Also transmission electron microscopy (TEM) study was carried out to observe the microstructure of the films. In the ultra-thin film study, an exact determination of a coalescence thickness and a continuous film thickness is very important. Therefore, we tried to measure the minimum thickness for continuous film (dmin) by means of a graphical method using a number of different y-values as a function of film thickness. The raw date obtained in this study provides a graph of in-situ resistance of metal film as a function of film thickness. For the Al film, there occurs a maximum value in a graph of in-situ electrical resistance versus film thickness. Using the results in this study, we could define clearly the minimum thickness for continuous film where the position of minimum values in the graph when we put the value of Rd3 to y-axis and the film thickness to x-axis. The measured values for the minimum thickness for continuous film are 21 nm and 16 nm for sputtered Al and Sn films, respectively. The new method for defining the minimum thickness for continuous film in this study can be utilized in a basic data when we design an ultra-thin film for the metallization application in nano-scale devices.

Most TCOs such as ITO, AZO(Al-doped ZnO), FTO(F-doped SnO2) etc., which have been widely used in LCD,touch panel, solar cell, and organic LEDs etc. as transparent electrode material reveal n-type conductivity. But in order to realizetransparent circuit, transparent p-n junction, and introduction of transparent p-type materials are prerequisite. Additionalprerequisite condition is optical transparency in visible spectral region. Oxide based materials usually have a wide optical band-gap more than ~3.0eV. In this study, single-phase transparent semiconductor of SrCu2O2, which shows p-type conductivity, havebeen synthesized by 2-step solid state reaction at 950oC under N2 atmosphere, and single-phase SrCu2O2 thin films of p-typeTCOs have been deposited by RF magnetron sputtering on alkali-free glass substrate from single-phase target at 500oC, 1%H2/(Ar+H2) atmosphere. 3% H2/(Ar+H2) resulted in formation of second phases. Hall measurements confirmed the p-typenature of the fabricated SrCu2O2 thin films. The electrical conductivity, mobility of carrier and carrier density 5.27×10−2S/cm,2.2cm2/Vs, 1.53×1017/cm3 a room temperature, respectively. Transmittance and optical band-gap of the SrCu2O2 thin filmsrevealed 62% at 550nm and 3.28eV. The electrical and optical properties of the obtained SrCu2O2 thin films deposited by RFmagnetron sputtering were compared with those deposited by PLD and e-beam.

Films consisting of a silicon quantum dot superlattice were fabricated by alternating deposition of silicon rich silicon nitride and Si3N4 layers using an rf magnetron co-sputtering system. In order to use the silicon quantum dot super lattice structure for third generation multi junction solar cell applications, it is important to control the dot size. Moreover, silicon quantum dots have to be in a regularly spaced array in the dielectric matrix material for in order to allow for effective carrier transport. In this study, therefore, we fabricated silicon quantum dot superlattice films under various conditions and investigated crystallization behavior of the silicon quantum dot super lattice structure. Fourier transform infrared spectroscopy (FTIR) spectra showed an increased intensity of the 840 cm-1 peak with increasing annealing temperature due to the increase in the number of Si-N bonds. A more conspicuous characteristic of this process is the increased intensity of the 1100 cm-1 peak. This peak was attributed to annealing induced reordering in the films that led to increased Si-N4 bonding. X-ray photoelectron spectroscopy (XPS) analysis showed that peak position was shifted to higher bonding energy as silicon 2p bonding energy changed. This transition is related to the formation of silicon quantum dots. Transmission electron microscopy (TEM) and electron spin resonance (ESR) analysis also confirmed the formation of silicon quantum dots. This study revealed that post annealing at 1100˚C for at least one hour is necessary to precipitate the silicon quantum dots in the SiNx matrix.

Solar cells have been more intensely studied as part of the effort to find alternatives to fossil fuels as power sources.The progression of the first two generations of solar cells has seen a sacrifice of higher efficiency for more economic use ofmaterials. The use of a single junction makes both these types of cells lose power in two major ways: by the non-absorptionof incident light of energy below the band gap; and by the dissipation by heat loss of light energy in excess of the band gap.Therefore, multi junction solar cells have been proposed as a solution to this problem. However, the 1st and 2nd generation solarcells have efficiency limits because a photon makes just one electron-hole pair. Fabrication of all-silicon tandem cells using anSi quantum dot superlattice structure (QD SLS) is one possible suggestion. In this study, an SiOx matrix system was investigatedand analyzed for potential use as an all-silicon multi-junction solar cell. Si quantum dots with a super lattice structure (Si QDSLS) were prepared by alternating deposition of Si rich oxide (SRO; SiOx (x=0.8, 1.12)) and SiO2 layers using RF magnetronco-sputtering and subsequent annealing at temperatures between 800 and 1,100oC under nitrogen ambient. Annealing temperaturesand times affected the formation of Si QDs in the SRO film. Fourier transform infrared spectroscopy (FTIR) spectra and x-rayphotoelectron spectroscopy (XPS) revealed that nanocrystalline Si QDs started to precipitate after annealing at 1,100oC for onehour. Transmission electron microscopy (TEM) images clearly showed SRO/SiO2 SLS and Si QDs formation in each 4, 6, and8nm SRO layer after annealing at 1,100oC for two hours. The systematic investigation of precipitation behavior of Si QDsin SiO2 matrices is presented.

Indium Gallium Zinc Oxide (IGZO) thin films were deposited onto 300 nm-thick oxidized Si substrates and glass substrates by direct current (DC) magnetron sputtering of IGZO targets at room temperature. FESEM and XRD analyses indicate that non-annealed and annealed IGZO thin films exhibit an amorphous structure. To investigate the effect of an annealing treatment, the films were thermally treated at 300˚C for 1hr in air. The IGZO TFTs structure was a bottom-gate type in which electrodes were deposited by the DC magnetron sputtering of Ti and Au targets at room temperature. The non-annealed and annealed IGZO TFTs exhibit an Ion/Ioff ratio of more than 105. The saturation mobility and threshold voltage of nonannealed IGZO TFTs was 4.92×10-1cm2/V·s and 1.46V, respectively, whereas these values for the annealed TFTs were 1.49×10-1cm2/V· and 15.43V, respectively. It is believed that an increase in the surface roughness after an annealing treatment degrades the quality of the device. The transmittances of the IGZO thin films were approximately 80%. These results demonstrate that IGZO thin films are suitable for use as transparent thin film transistors (TTFTs).

We present the structural, optical, and electrical properties of amorphous silicon suboxide (a-SiOx) films grown on indium tin oxide glass substrates with a radio frequency magnetron technique from a polycrystalline silicon oxide target using ambient Ar. For different substrate-target distances (d = 8 cm and 10 cm), the deposition temperature effects were systematically studied. For d = 8cm, oxygen content in a-SiOx decreased with dissociation of oxygen onto the silicon oxide matrix; temperature increased due to enlargement of kinetic energy. For d = 10 cm, however, the oxygen content had a minimum between 150˚ and 200˚. Using simple optical measurements, we can predict a preferred orientation of liquid crystal molecules on a-SiOx thin film. At higher oxygen content (x > 1.6), liquid crystal molecules on an inorganic liquid crystal alignment layer of a-SiOx showed homogeneous alignment; however, in the lower case (x< 1.6), liquid crystals showed homeotropic alignment.

세라믹 타겟인 Sr2Nb2O7 (SNO)과 Bi2O3을 장착한 RF-마그네트론 스퍼터링을 이용하여 SrBi2Nb2O9 (SBN) 박막을 p-type Si(100) 기판 위에 증착하였다. 증착시 두 타겟의 파워비를 조절하여 조성의 변화에 따른 SBN 박막의 구조적 및 전기적 특성을 조사하였다. 증착된 SBN 박막은 700˚C의 산소분위기에서 1시간 동안 열처리를 하였으며 상부전극으로 Pt를 증착한 후 산소분위기에서 30분 동안 700˚C에서 전극 후열처리를 실시하였다. 증착된 SBN 박막은 700˚C 열터리 후에 페로브스카이트 상을 나타냈으며 SNO 타겟과 Bi2O3타겟의 파워가 120 W/100 W 일 때 가장 좋은 전기적 특성을 나타내었다. 이때의 조성은 EPMA(Electron Probe X-ray Micro Analyzer) 분석을 통하여 확인하였으며 Sr:Bi:Nb의 비가 약 1:3:2임을 나타내었다. 이러한 과잉의 Bi조성을 가진 SBN 박막은 3-9 V의 인가전압에서 1.8 V-6.3 V의 우수한 메모리 윈도우 값을 나타내었으며 누설전류 값은 인가전압 5 V에서 1.54×10-7 A/cm2였다.