Moso bamboo, as a kind of renewable functional material, exhibits outstanding development potential. It is promising to prepare activated carbon with good mechanical strength and high specific surface area using moso bamboo as raw material. In this work, we employed a hydraulic extruder to extrude the bamboo charcoal and the adhesive to obtain the moso bamboo activated carbon, and improved the specific surface area of the columnar activated carbon through high-temperature water vapor activation. Through the catalytic role of the water vapor activation process, the formation and expansion of the pores were promoted and the internal pores were greatly increased. The obtained columnar activated carbon shows excellent mechanical strength (93%) and high specific surface area (791.54 m2/ g). Polyacrylamide@asphalt is one of the most effective adhesives in the high-temperature water vapor activation. The average pore size (22.99 nm) and pore volume (0.36 cm3/ g) of the prepared columnar activated carbon showed a high mesoporous ratio (83%). Based on the excellent pore structure brought by the activation process, the adsorption capacity of iodine (1135.75 mg/g), methylene blue (230 mg/g) and carbon tetrachloride (64.03 mg/g) were greatly improved. The resultant moso bamboo columnar activated carbon with high specific surface area, excellent mechanical properties, and outstanding adsorption capacity possesses a wide range of industrial applications and environmental protection potential.

Environmental pollution has led to global warming, which threatens human life. In response, hydrogen is gaining attention as a next-generation energy source that does not emit carbon. Due to its explosive nature, special care must be taken in the safe storage and transportation of hydrogen. Among various storage methods, liquefied storage, which can reduce its volume to 1/800, is considered efficient. However, since its boiling point reaches -253°C, the design of an insulation system is essential. For the design of insulation systems applied to large containers, a membrane-type design is required, which necessitates the use of cryogenic adhesives. To evaluate whether the cryogenic adhesive is properly implemented, assessments such as tensile and shear tests are necessary. This study presents a methodology for shear evaluation. Conventional methods for shear evaluation of adhesives result in slippage, preventing proper assessment. Therefore, a method involving drilling holes in the gripper and pulling from the holes must be applied. Optimal design concerning the size and location of the holes is required, and this study derives optimal values based on finite element analysis. By conducting experiments based on the results of this study, it is expected that the risk of gripper damage will be minimized, allowing for accurate evaluation of the adhesive’s performance.

Recently, there has been growing interest in harmful substances released from household items such as volatile organic compounds (VOCs) and this has increased people’s environmental awareness. In this study, adhesives and manicures were used as samples of indoor household goods and formaldehyde emission and tested over time under temperature conditions of 15oC, 25oC, 35oC, and 45oC. The small chamber method as the indoor air quality process test method was employed and used to evaluate the concentration of formaldehyde emissions. As a result, formaldehyde emissions gradually decreased over time in both tests using adhesives and manicures. The cumulative emission showed a logarithmic function over time, and the formaldehyde can be released for longer periods of time at lower temperature conditions. The logarithmic value and response time showed linear relationships, and it can be inferred that the formaldehyde was released from the sample through the first order reaction. Furthermore, the relationship between temperature and velocity constants which was determined using the Arenius linear equation showed that the reaction rate of formaldehyde can be estimated by a temperature change.

홍합 족사 단백질은 수분이 있는 표면에서도 강한 접착력을 가진다. 홍합 연구에 대표가 되는 marine blue mussel을 통해 9가지 단백질의 구조와 기능이 보고되었으며, 이 단백질들은 홍합 족사를 구성하는 실(threads)과 플래크(plaques)를 형성한다. 알려진 바에 의하면, 히드록시기 2개가 포함된 카테콜 기 능기를 가진 DOPA 물질이 계면접착(adhesion)과 내부결합(cohesion) 과정에서 중요한 역할을 하는 것으로 알려져 있다. 본 논문에서는, 최근 10년간 활발히 연구된 계면접착과 내부응력 메카니즘에 대해 소개하고 평가하였다. 또한, 접착력을 갖는 기능기를 활용한 발전된 접착소재의 개발, 바이오접착제와 의료용 소재로 응용가능성에 대해 살펴보았다. 홍합 단백질이 다시 관심의 대상이 되면서, 바이오소재로 사용될 가능성이 커지고 있음이 주목된다.

To investigate the adhesion effect of various kinds and contents of polymeric methylene diphenyl diisocyanates (pMDIs) on adhesion performance, wood adhesives (A-1~5) were synthesized and characterized. As results, when the amount of pMDI increased in adhesives, the dry tensile strength was found to be proportionally increased sustaining at around 16.0~21.6 kgf/cm2. The polyurethane (PU) resin, which used M11S as a source of pMDI showed the best wet tensile strength at 11.9 kgf/cm2 and cyclic boil tensile strength at 8.1 kgf/cm2, which satisfied the requirement of over 7 kgf/cm2. Thermal properties of the rice powder (RP) based polyurethane resins were characterized by differential scanning calorimetry (DSC) and Thermal gravimetric analysis (TGA). Thermal stability of polyurethane resins increased to 250℃ with adding pMDIs. The more pMDI (M5S) was added to adhesive, the higher thermal stability of the resin was observed by TGA.

The natures of fatigue crack growth under Mode Ⅱ loading are studied. End notched flexure beam specimens were used. The effects of adherend thickness, rubber modification and adhesive thickness on fatigue crack growth were examined. The experimental results show that some of these parameters apparently do affect fatigue crack growth. Resistance to ModeⅡ fatigue crack growth are increased by rubber modification. The effects of adhesive thickness and rubber content on fatigue crack growth were explained by von Mises's equivalent stress using BEM analysis. For unmodified epoxy adhesives, the fatigue crack growth properties under Mode Ⅱ loadings were significantly different in all regions. For rubber-modified epoxy adhesives, they were also different in the first and second regions, but in the third region, they were similar

In this paper, the features of fatigue crack growth under ModeⅠ loading are studied. Double cantilever beam specimens were used. The effects of adherend thickness, rubber modification and adhesive thickness on fatigue crack growth were examined. The experimental results show that some of these parameters do apparently affect fatigue crack growth. Resistance to ModeⅠ fatigue crack growth are increased by rubber modification. The effects of adhesive thickness and rubber content on fatigue crack growth were explained by von Mises's equivalent stress using BEM analysis.

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at 160˚C was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

The crack initiation equals to fracture for bonded joint with brittle adhesive. The criterion is formulated in terms of the quasi-stress intensity factor Kp, for the maximum principle stress, that is analogous to the stress intensity factor used to characterize the stress field in the vicinity of bond terminus. Kp is evaluated using a boundary element analysis. The crack initiation at the terminus of adhesive bonded joints is estimated with the critical quasi-stress intensity factor Kp. This method presented here hardly pays attention to the crack propagation. Since there is a large influence of crack propagation on the strength of adhesive joints and structures, crack propagation must be taken into account on strength prediction of bonded joints. The quasi-stress intensity factor Kp for the maximum principle stress can use as the criteria of the crack initiation at the terminus of adhesive bonded joints having various shapes.

The objectives of the present study are to show how to predict the crack initiation at the terminus of adhesive bonded joints to calculate the crack growth in the adhesive layer using the total strain energy release rate. The crack propagation for ductile adhesives is theoretically estimated using -curve. -curve is determined from static shearing tests of single lap joints. The total strain energy release rate for single lap joints is evaluated using a boundary element analysis. The strength prediction is conducted by means of the R-curve and the total strain energy release rate.The conclusions are summarized as follows; (1) A crack propagation geometry of the bonded structure using ductile adhesive was predicted from the distribution of the total strain energy release rate. (2) The final failure load for lap joints is predicted by the R-curve method based on the fracture mechanics. (3) The final failure load for stiffened plates with a steel L-beam is predicted by the R-curve method based on the fracture mechanics.

To prepare a solution type acrylic pressure-sensitive adhesive, quarter polymers were synthesized from butyl acrylate(BA), 2-ethylhexylacrylate(2-EHA) as a base monomer, methyl methacrylate(MMA) as a comonomer, each of methacrylic acid(MAA), acrylic acid(AA) as a functional monomer. Acrylic solution type pressure-sensitive adhesives(PSA's) of isocyanate derivative crosslinking PSA's were prepared by crosslinking of BEMM, BEMA with toluene-2,4-diisocyanate. The structure of adhesive was identified by FT-IR. The viscosity was measured by using Brookfield DV-III and molecular weight was measured by using gel permeation chromatography. The physical properties of polyethylene film coated with BEMMT, BEMAT were measured as a function of the concentration. As the result, BEMMT(0.6, 0.8), BEMAT(0.6) showed peel adhesion of 160~180 gf/25 mm width and shear adhesion of more than 24 hours, and tackiness of 4/32~6/32 which was relevant to commercial usage.

Acrylic adhesives for automobiles protection were prepared by emulsion polymerization. Monomers used were n-butyl acrylate(BA), acrylonitrile (AN), butyl methacrylate(BMA), glycidyl methacrylate(GMA), and acrylic acid (AA). Emulsifiers used were sodium lauryl sulfate and polyoxyethylene lauryl ether, which are an anionic emulsifier and a nonionic emulsifier respectively. Potassium persulfate was used as an initiator and polyvinyl alcohol was used as a stabilizer. Emulsion polymerization was carried out in a semi-batch reactor at 70℃ and agitation speed was kept at 200 rpm. Water resistance, heat resistance, acid resistance, alkali resistance and smoke resistance were examined. As a result, when each 0.03 mole of GMA and AA was introduced, the adhesion properties and various above mentioned resistances of the prepared adhesives were satisfied the standard for automobiles.

In order to improve resistant properties of water-borne acrylic pressure sensitive adhesives(PSAs) for automobiles, this study was carried out. Removable PSAs for automobiles were synthesized by emulsion polymerization of monomers, n-butyl acrylate(BA), n-butyl methacrylate(BMA), acrylonitrile(AN), acrylic acid(AA) and 2-hydroxyethyl methacrylate(2-HEMA), and AA and 2-HEMA could act as functional monomers for crosslink. Emulsion polymerization was carried out in a semi-batch type reactor. Water resistance, heat resistance, acid resistance, alkali resistance and smoke resistance were examined. As a result, water resistance increased with the amount of BMA, however, the effect of BMA content on the water resistance was insignificant at a range of over 14 wt%. The water resistance also increased with the amount of functional monomers, AA and 2-HEMA. The prepared PSAs satisfied all the standard for automobiles except heat resistance. However, the heat resistance comes nearly up to the standard. Also, acid resistance, alkali resistance and smoke resistance of the prepared PSAs satisfied with the standard.

Removable protective adhesives for automobiles were synthesized by an emulsion polymerization of monomers such as n-butyl acrylate (BA), n-butyl methacrylate (BMA), acrylonitrile (AN), acrylic acid (AA) and 2-hydroxyethyl methacrylate (2-HEMA), in which AA and 2-HEMA were functional monomers. Potassium persulfate (KPS) was used as an initiator and sodium lauryl sulfate (SLS) was used as an emulsifier, and polyvinyl alcohol (PVA) was used as a stabilizer. Emulsion polymerization was carried out in a semi-batch type reactor. Tensile strength, extension, peel strength, viscosity and solid content of the synthesized adhesives were tested. The optimum physical properties of the removable protective adhesives for automobiles were obtained with the composition of 0.43 mole BA, 0.57 mole AN, 0.21 mole BMA, 0.03 mole AA, and 0.03 mole 2-HEMA.

To prepare an acrylic type pressure-sensitive adhesive, quarternary polymers were synthesized from butyl acrylate (BA), 2-ethyl hexyl acrylate (2-EHA), methyl methacrylate (MMA), and 2-hydroxy ethyl methacrylate (2-HEMA). The quarternary polymers were identified by FT-IR and Molecular weight was measured by Gel Pearmeation Chromatography. Also, viscosity, solid content and peel strength were examined. The peel strength was 160 gf/25 mm when the volume ratio of feed monomer to solvent was 1.3:1, and the ratio was relevant to commercial usage. The pot life of adhesive was 30 sec at the 50 m/min of heat treatment rate at, and it indicated that the minimum drying time was 30 sec. In weathering resistance test, peel strength of 160~180 gf/25 mm after 1000 h, with no residual remains on the adhesive surface.

Acrylic pressure sensitive adhesives of n-butyl acrylate, 2-ethyl acrylate, methyl acrylate, vinyl acetate, acrylic acid, acrylonitrile and 2-hydroxyethyl acrylate were synthesized and basic physical properties of pressure sensitive adhesives with increasing the contents of 2-hydroxyethyl acrylate were investigated. 2-Hydroxyethyl acrylates effects on glass transition temperature, viscosity, hardening time and peel strength. Glass transition temperature(Tg) decreased with increasing the contents of 2-hydroxyethyl acrylate. Viscosity and hardening time were increased with increasing the contents of 2-hydroxyethyl acrylate. On the other hands, peel strength increased with increasing the contents of 2-hydroxyethyl acrylate up to 6 wt% and the decreased at further higher contents of 2-hydroxyethyl acrylate. In peel test, interfacial failure was occured in 8 wt% and 10wt%.

비전도성 충진재를 포함한 개선된 이방성 전도 접착제의 열적/기계적 특성과 이를 이용한 유기 기판용 플립 칩의 신뢰성에 미치는 충진재 양의 영향을 고찰하였다. 비전도성 충진재 양이 다른 개선된 이방성 접착제의 특성을 살펴보기 위해 differential scanning calorimeter (DSC), thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo-mechanical analyzer (TMA)을 사용하였다. 비전도성 충진재의 양이 증가함에 따라 열팽창계수는 감소하였고, 상온에서의 storage modulus는 증가하였다. 추가로, 충진재의 양이 증가하면 DSC에 의한 유리전이온도와 TMA에 의한 유리전이온도도 증가하였다. 그러나 TGA 거동은 거의 변화가 없었다. 이방성 전도 접착제를 사용한 유기 기판 플립 칩의 신뢰성 테스트를 위해 열주기 시험, 고온고습 시험, 고온건조 시험을 수행하였는데, 주로 열주기 시험에서 이방서 전도 접착제의 열팽창계수의 영향이 컸다. 비전도성 충진재를 포함해서 낮은 열팽창계수와 높은 storage modulus를 갖는 이방성 전도 접착제에 의해 부착된 플립 칩의 신뢰성이 비전도성 충진재를 포함하지 않은 이방성 전도 접착제에 의한 플립 칩의 신뢰성보다 더 좋게 나타났다.

구동 IC를 유리기판 위의 Al패드 전극에 연결하는 LCD(Liquid Crystal Display) 모듈을 실장하는 Chip On Glass (COG) 기술을 개발하기 위하여 기존에 잘 알려진 기술 가운데 실제로 적용 가능성이 가장 유망한 이방성 도전 접착제 (ACA, Anisotropic Conductive Adhesives)를 사용한 공정에 대하여 조사하였다. ACA 공정은 본딩 부분에 ACA 수지를 균일하게 분포시키는 공정과 자외선을 조사하여 수지를 경화하여 칩을 실장하는 공정의 2단계로 진행하였다. 칩에 가해준 하중은 2-15kg이었고 칩의 예열 온도는 120˚C이었다. 이방성 도전체는 Au 또는 Ni이 표면 피막 재료로 사용된 것을 사웅하였으며 전도성 입자의 갯수가 500, 1000, 2000, 4000개/mm2이며 크기가 5, 7, 12μm이었다. ACA 처리의 결과 입자 크기가 5μm이고 입자 밀도는 4000개/mm2일 경우가 대단히 낮은 접촉 저항 및 가장 안정된 본딩 특성을 나타냈었다.