The current density in copper electroplating is directly related with the productivity; then, to increase the productivity, an increase in current density is required. This study is based on an analysis of changes in surface characteristics and mechanical properties by applying the addition of Alcian Blue (AB, C56H68Cl4CuN16S4). The amount of Alcian Blue in the electrolytes is changed from 0 to 100 ppm. When Alcian Blue is added at 20 ppm, a seed layer is formed homogeneously on the surface at the initial stage of nucleation. However, crystals electroplated in electrolytes with more than 40 ppm of Alcian Blue are observed to have growth in the vertical direction on the surface and the shapes are like pyramids. This tendency of initial nucleation formation causes protrusions when the thickness of copper foil is 12 μm. Thereafter, a lot of extrusions are observed on the group of 100 ppm Alcian Blue. Tensile strength of groups with added Alcian Blue increased by more than 140% compare to no-addition group, but elongation is reduced. These results are due to the decrease of crystal size and changes of prior crystal growth plane from (111) and (200) to (220) due to Alcian Blue.

Electro-coagulation process has been gained an attention recently because it could overcome the membrane fouling problems in MBR(Membrane bio-reactor). Effect of the key operational parameters in electro-coagulation, current density(ρ i) and contact time(t) on membrane fouling reduction was investigated in this study. A kinetic model for ρi and t required to reduce the membrane fouling was suggested under different MLSS(mixed liquor suspended solids) concentration. Total 48 batch type experiments of electro-coagulations under different sets of current densities(2.5, 6, 12 and 24 A/m2), contact times(0, 2, 6 and 12 hr) and MLSS concentration(4500, 6500 and 8500mg/L) were carried out. After each electro-coagulation under different conditions, a series of membrane filtration was performed to get information on how much of membrane fouling was reduced. The membrane fouling decreased as the ρi and t increased but as MLSS decreased. Total fouling resistances, Rt (=Rc+Rf) were calculated and compared to those of the controls (Ro), which were obtained from the experiments without electro-coagulation. A kinetic approach for the fouling reduction rate (Rt/Ro) was carried out and three equations under different MLSS concentration were suggested: i) pi0.39t = 3.5 (MLSS=4500 mg/L), ii) pi0.46t = 7.0 (MLSS=6500 mg/L), iii) pi0.74t = 10.5 (MLSS=8500 mg/L). These equations state that the product of ρi and t needed to reduce the fouling in certain amounts (in this study, 10% of fouling reduction) is always constant.

In commercial solar cells, the pattern of the front electrode is critical to effectively assemble the photo generated current. The power loss in solar cells caused by the front electrode was categorized as four types. First, losses due to the metallic resistance of the electrode. Second, losses due to the contact resistance of the electrode and emitter. Third, losses due to the emitter resistance when current flows through the emitter. Fourth, losses due to the shading effect of the front metal electrode, which has a high reflectance. In this paper, optimizing the number of finger on a 4 ´ 4 solar cell is demonstrated with known theory. We compared the short circuit current density and fill factor to evaluate the power loss from the front metal contact calculation result. By experiment, the short circuit current density(Jsc), taken in each pattern as 37.61, 37.53, and 37.38 mA/ cm2 decreased as the number of fingers increased. The fill factor(FF), measured in each pattern as 0.7745, 0.7782 and 0.7843 increased as number of fingers increased. The results suggested that the efficiency(Eff) was measured in each pattern as 17.51, 17.81, and 17.84 %. Throughout this study, the short-circuit current densities(Jsc) and fill factor(FF) varied according to the number of fingers in the front metal pattern. The effects on the efficiency of the two factors were also investigated.

Recently EC-MBR (Elctrocoagulation - Membrane Bio Reactor) has been suggested as one of alternative processes to overcome membrane fouling problems. Most important operational parameters in the EC-MBR are known to current density and contact time. Their effect on membrane filtration performances has been reported well, however, quantitative interrelationship between both parameters not been investigated yet. The purpose of this study is to give a kinetic model suggesting the current density and the contact time required to reduce the membrane fouling. The 4 different set of current densities (2.5, 6, 12 and 24 A/m2) and contact times (0, 2, 6 and 12 hr) were selected as operational parameters. After each electro-coagulation under the 16 different conditions, a series of membrane filtration was carried out. The membrane fouling decreased as the current density and contact time increased, Total fouling resistances under different conditions, Rt(=Rc+Rf) were calculated and compared to those of the controls (R0), which were calculated from the data of experiments without electro-coagulation. A kinetic approach for the fouling reduction rate (Rt / R0) was carried out and the equation ρi0.46t=7.0 was obtained, which means that the product of current density and the contact time needed to reduce the fouling in certain amounts (in this study, 10% of fouling reduction) is always constant.

The crystallization effects of boron (B) powder on the phase, full width at half maximum (FWHM) values, and critical properties were investigated for in-situ reacted MgB2 bulk superconductors. The semi-crystalline B powder was heat-treated at different temperatures of 1000, 1300 and 1500˚C for 5 hours in an Ar atmosphere. Then, using as-received and heat-treated B powders, the MgB2 samples were prepared at 600˚C for 40 hours in an Ar atmosphere. As the heat-treatment temperature of the B powder increased, both the particle size of the B powder and crystalline phase increased. In the case of MgB2 samples using B powders heat-treated at above 1300˚C, unreacted magnesium (Mg) and B remained due to the improved crystallinity of the B powder. As the heat-treatment temperature of B powder increased, the critical current density of MgB2 decreased continuously due to the reduction of grain boundary density and superconducting volume caused by unreacted Mg and B.

In an effort to overcome the problems which arise when fabricating high-aspect-ratio TSV(through silicon via), we performed experiments involving the void-free Cu filling of a TSV(10~20 μm in diameter with an aspect ratio of 5~7) by controlling the plating DC current density and the additive SPS concentration. Initially, the copper deposit growth mode in and around the trench and the TSV was estimated by the change in the plating DC current density. According to the variation of the plating current density, the deposition rate during Cu electroplating differed at the top and the bottom of the trench. Specifically, at a current density 2.5 mA/cm2, the deposition rate in the corner of the trench was lower than that at the top and on the bottom sides. From this result, we confirmed that a plating current density 2.5 mA/cm2 is very useful for void-free Cu filling of a TSV. In order to reduce the plating time, we attempted TSV Cu filling by controlling the accelerator SPS concentration at a plating current density of 2.5 mA/cm2. A TSV with a diameter 10 μm and an aspect ratio of 7 was filled completely with Cu plating material in 90 min at a current density 2.5 mA/cm2 with an addition of SPS at 50 mg/L. Finally, we found that TSV can be filled rapidly with plated Cu without voids by controlling the SPS concentration at the optimized plating current density.

This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/cm2. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/cm2. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/cm2 considering the productivity and mechanical properties of copper foil.

Five kinds of double stacked 385 (55 x7) filamentary Bi2212/Ag round wires and 55 filamentary tapes with different Ag ratios (silver area/superconductor area) have been fabricated via PIT method, and the effects of Ag ratio and processing factors on critical current density were studied. The effects of the maximum temperature and average filament diameter on critical current density were also studied. The wire of 0.74 mm diameter having Ag ratio 3.7 showed critical current density of at 4.2 K, 0 T.

In this paper, we proposed the optimal process conditions on the electro-gilding process. The responses are plating thickness and Sn proportion. The factors are temperature, current density, and addition. We minimized the total number of experiments based

이온교환막의 전압-전류곡선의 plateau length를 결정하는 변수를 다양한 NaCl 농도와 유속 하에서 연구하였다. 또한, 한계전류밀도 이상의 전류에서 전기투석공정 운전의 타당성을 검토하기 위해 다양한 전류밀도의 전원을 공급하면서 0.1 M NaCl 용액의 탈염실험을 실시하여 이온의 제거효율, 전류효율, 에너지소비량, 물 분해 현상을 측정하였다. NaCl 용액의 농도와 유속이 감소하면서 확산경계층의 두께도 함께 감소하였으며, 본 확산경계층의 두께는 plateau length와도 밀접한 관련이 있는 것으로 나타났다. 탈염실험에서 측정된 이온 제거 효율 및 전류효율은 한계전류밀도 이상에서도 한계전류밀도 이하에서의 탈염실험과 크게 차이 나지 않은 것으로 보아 한계전류밀도 이상에서도 대부분의 전류는 이온교환막 표면의 물분해에 의한 것이 아니라 막을 통한 이온의 이동에 의한 것으로 사료된다. 한계전류밀도 이상에서의 탈염운전에 대한 에너지소비량은 plateau length의 영향으로 한계전류밀도 이하에서의 탈염운전 보다 다소 높지만, 한계전류밀도 이상에서는 전류밀도의 증가에도 에너지소비량이 증가하지 않았다. 이러한 결과들은 물분해 현상이 심각하게 일어나지 않는 한 한계전류밀도 이상에서도 매우 경제적으로 전기투석 공정을 운전찬 수 있다는 것을 제시해 주는 것이다.

균일하고 치밀한 미세구조를 갖는 Pd박막이 PdCl2를 사용하는 전기도금방법으로 제조되었다. 본 연구에서는 도금온도와 전류밀도가 주요 공정변수로서 고려되었고 이에 따른 음극효율 및 제조된 Pd도금막의 결정성, 형상 및 경도 등의 특성이 측정되었고, 이들간의 상호관계성이 검토되었다. 연구결과에 따르면, PdCl2를 사용하는 본 Pd전기도금 시스템에서는 50˚C와 5mA/cm2의 조건이 도금막의 형상으로 볼 때, 최적의 도금조건이라고 간주된다. 최적 조건에서 제조된 Pd도금막의 경도는 약 600kg/mm2이었다. 변수 및 특성간의 관계성 검토 결과, Pd막의 경도는 미세구조에 의해 큰 영향을 받지만, 결정의 배향성과의 연관성은 작은 것으로 해석된다.

10-50wt% 범위의 W을 함유하는 Ni-W 합금을 전기도금에 의해 제조하였다. 합금 중의 W 량은 전류밀도가 증가함에 따라 증가하였다. 전류밀도가 50mA/cm2이하인 경우 Ni-W합금은 미세한 결정립을 갖는 Ni의 고용체이었으며, 전류밀도가 50mA/cm2이상인 경우 비정질상으로 변화하였다. 이들의 결정질→비정질 천이는 W량이 40-46wt%인 구간에서 일어났으며 반각폭이 3배이상으로 증가하였다. 결정질 합금의 격자상수는 평형상태도 상의 W의 고용한계(약 30wt%)를 초과하는 40wt%까지 연속적으로 증가하는 것으로 나타나 Ni이 W을 과고용하고 있는 상태인 것으로 밝혀졌다. 비정질 Ni-W 합금은 400˚C이상의 온도에서 열처리하면 강한 [111]방향성을 가지며 재결정하였으며, 800˚C이상의 온도에서는 과고용된 W이 석출하였다. 합금조성 및 결정구조의 전류밀도 의존성을 이용하여 Ni-30%W과 Ni-50%W 합금층이 반복되는 결정질/비정질의 다층도금을 제조하였다.

평균조차(平均潮差)가 10cm내외(內外)인 포항(浦項) 영일만(迎日灣)으로 유입(流入)하는 형산강(兄山江)의 감조구간(感潮區間)을 채택(採擇)하여 유역내(流域內)의 부조(扶助) 수문기준점(水文基準點)에서 관측(觀測)한 자료(資料)와 하천유량(河川流量) 및 수질측정자료(水質測定資料) 등을 근거(根據)로 밀도유현상(密度流現象)을 분석(分析)한 결과(結果)를 요약(要約)하면 다음과 같다. 1. 영일만(迎日灣)의 조석현상(潮汐現象)은 1일(日)1회조(回潮)이며 대조차(大潮差) 0.104m, 소조차(小潮差) 0.066m, 평균조차(平均潮差) 0.085m로써 해면(海面)의 변동(變動)은 매우 작았다. 2. 감조구간내(感潮區間內)에는 해수(海水)의 영향(影響)으로 인(因)하여 약(約) 270만(萬) 이상(以上)의 물이 저류(貯溜)되고 있으며 이중에서 염분농도(鹽分濃度)가 이하(以下)로써 관개용수(灌漑用水)로 이용(利用) 가능한 수량(水量)은 약(約) 120 만(萬)톤에 달(澾)하고 있다. 3. 해수침투현상(海水浸透現象)은 간만(干滿)의 차(差)에 의한 수위변화(水位變化)는 작으나 만조시(滿潮時) 염분침입(鹽分侵入)이 탁월(卓越)하여 뚜렷한 층(層)이 형성(形成)되는 성층밀도류(成層密度流)가 되고 간조시(干潮時)에는 염수(鹽水)쐐기가 후퇴(後退)하면서 쐐기 상류단(上流端)의 염분(鹽分)이 담수(淡水)와 혼합확산(混合擴散)되면서 유하(流下)하여 잘 혼합(混合)된 하구(河口)를 형성(形成)한다. 4. 염수(鹽水)쐐기의 길이는 5.9km로 계산(計算)되었으나 실제로는 4.4km지점(地點)에 설치(設値)된 연일(延日) 잠수교(潛水橋)의 영향(影響)으로 인(因)하여 동지점(同地點)에서 로써 염수(鹽水)의 침투(浸透)가 중단(中斷)된다. 5. 담수(淡水)와 해수(海水)사이에 어떠한 크기의 밀도차(密度差)가 존재(存在)하는 한(限) 수로(水路)바닥을 따라 흐르는 순상류(純上流) 방향(方向)의 흐름이 존재(存在)한다.

본 연구는 면적선량에 따른 영상의 농도를 측정하여 피폭선량에 대한 정도관리 필요성을 제시하고자 하였다. 관전압을 80 kVp로 고정하고 관전류를 1, 25, 50, 80, 100 mAs로 조사한 결과 면적선량은 25 mAs에서 50 mAs로 증가하면 1.88배의 선량이 증가하고 50 mAs에서 100 mAs로 증가하면 2.05배 증가하였다. 하지만 필름으로 획득한 영상의 농도는 25 mAs에서 50 mAs로 증가하면 48% 증가하고, 50 mAs에서 100 mAs로 증가하면 29% 증가하였다. 또한 DR 영상의 농도는 25 mAs에서 50 mAs로 증가하면 12% 증가하고, 50 mAs에서 100 mAs로 증가하면 30% 증가하는 것으로 나타났다. 즉, 디지털 영상촬영 장비는 적정 촬영 조건에서 선량 증가에 따른 영상의 농도차이가 필름 영상보다는 적게 나타났다. 본 연구의 결과에서 디지털 영상 촬영 장비를 사용하는 의료기관에서는 방사선 선량에 대한 정도관리를 통하여 현재보다 촬영 부위별 피폭선량을 조금이나마 더 줄일 수 있을 것으로 판단되어진다.

In the industrial wastewater that occupies a large proportion of river pollution, the wastewater generated in textile, leather, and plating industries is hardly decomposable. Though dyeing wastewater has generally been treated using chemical and biological methods, its characteristics cause treatment efficiencies such as chemical oxygen demand (COD) and suspended solids (SS) to be reduced only in the activated sludge method. Currently, advanced oxidation technology for the treatment of dyeing wastewater is being developed worldwide. Electro-coagulation is highly adapted to industrial wastewater treatment because it has a high removal efficiency and a short processing time regardless of the biodegradable nature of the contaminant. In this study, the effects of the current density and the electrolyte condition on the COD removal efficiency in dyeing wastewater treatment by using electro-coagulation were tested with an aluminum anode and a stainless steel cathode. The results are as follows: ① When the current density was adjusted to 20 A/m2, 40 A/m2, and 60 A/m2 under the condition without electrolyte, the COD removal efficiency at 60 min was 62.3%, 72.3%, and 81.0%, respectively. ② The removal efficiency with NaCl addition was 7.9% higher on average than that with non-addition at all current densities. ③ The removal efficiency with Na2SO4 addition was 4.7% higher on average than that with non-addition at all current densities.

여름철 홍수기에 저수지 내로 유입한 탁수는 저수지 내부에 밀도차를 발생시키며 내부 성층류를 형성한다. 유입되는 고농도의 탁수층을 선택적으로 배제하거나 응집제 투입를 통한 오탁물질 입자의 침전 또는 탁수 차단망 설치로 방류 탁도를 저감시키기 위해서는 저수지내 성층 유동장에 대한 이해가 요구된다. 본 연구에서는 다양한 형상의 저수지 성층류 해석을 위한 수치해석 프로그램을 개발하였다. 다양한 형상으로의 적용을 위하여 비정렬 격자계를 사용하였으며, 성층류를 고려하기 위하여 Boussinesq 가정에 기초한 N-S 방정식 및 에너지 방정식을 지배방정식으로 사용하였다. 수치해석법의 검증을 위하여 결과가 잘 알려져 있는 2차원 및 3차원 공동 문제, 여러 개의 격벽이 설치된 정수장내 유동 및 댐 붕괴 거동 결과와 비교함으로써 개발된 알고리즘의 타당성을 검증하였다. 이를 통해 저수지 내 탁수 유입시 발생하는 성층류에 대한 수치해석을 시도하여 결과를 검토하였다.