As the demand for p-type semiconductors increases, much effort is being put into developing new p-type materials. This demand has led to the development of novel new p-type semiconductors that go beyond existing p-type semiconductors. Copper iodide (CuI) has recently received much attention due to its wide band gap, excellent optical and electrical properties, and low temperature synthesis. However, there are limits to its use as a semiconductor material for thin film transistor devices due to the uncontrolled generation of copper vacancies and excessive hole doping. In this work, p-type CuI semiconductors were fabricated using the chemical vapor deposition (CVD) process for thin-film transistor (TFT) applications. The vacuum process has advantages over conventional solution processes, including conformal coating, large area uniformity, easy thickness control and so on. CuI thin films were fabricated at various deposition temperatures from 150 to 250 °C The surface roughness root mean square (RMS) value, which is related to carrier transport, decreases with increasing deposition temperature. Hall effect measurements showed that all fabricated CuI films had p-type behavior and that the Hall mobility decreased with increasing deposition temperature. The CuI TFTs showed no clear on/off because of the high concentration of carriers. By adopting a Zn capping layer, carrier concentrations decreased, leading to clear on and off behavior. Finally, stability tests of the PBS and NBS showed a threshold voltage shift within ±1 V.

Graphene has attracted the interest of many researchers due to various its advantages such as high mobility, high transparency, and strong mechanical strength. However, large-area graphene is grown at high temperatures of about 1,000 °C and must be transferred to various substrates for various applications. As a result, transferred graphene shows many defects such as wrinkles/ripples and cracks that happen during the transfer process. In this study, we address transfer-free, large-scale, and high-quality monolayer graphene. Monolayer graphene was grown at low temperatures on Ti (10nm)-buffered Si (001) and PET substrates via plasma-assisted thermal chemical vapor deposition (PATCVD). The graphene area is small at low mTorr range of operating pressure, while 4 × 4 cm2 scale graphene is grown at high working pressures from 1.5 to 1.8 Torr. Four-inch wafer scale graphene growth is achieved at growth conditions of 1.8 Torr working pressure and 150 °C growth temperature. The monolayer graphene that is grown directly on the Ti-buffer layer reveals a transparency of 97.4 % at a wavelength of 550 nm, a carrier mobility of about 7,000 cm2/V×s, and a sheet resistance of 98 W/□. Transfer-free, large-scale, high-quality monolayer graphene can be applied to flexible and stretchable electronic devices.

In this paper, synthesis of terephthalate intercalated Zn-Al: Layered double hydroxides (LDHs) was studied. We designed freestanding Zn-Al: carbonate LDH nanosheets for a facile exchange technique. The as-prepared Zn-Al carbonate LDHs were converted to terephthalate intercalated Zn-Al:LDHs by ion exchange method. Initially, Al-doped ZnO (AZO) thin films were deposited on p-Si (001) by facing target sputtering. For synthesis of free standing carbonate Zn-Al:LDH, we dipped the AZO thin film in naturally carbonated water for 3 hours. Further, Zn-Al: carbonate LDH nanosheets were immersed in terepthalic acid (TA) solution. The ion exchange phenomena in the terephthalate assisted Zn-Al:LDH were confirmed using FTIR analysis. The crystal structure of terephthalate intercalated Zn-Al:LDH was investigated by XRD pattern analysis with different mole concentrations of TA solution and reaction times. The optimal conditions for intercalation of terephthalate from carbonated Zn-Al LDH were established using 0.3 M aqueous solution of TA for 24 hours.

A thin film thermoelectric generator that consisted of 5 p/n pairs was fabricated with 1 μm-thick n-type In3Sb1Te2 and p-type Ge2Sb2Te5 deposited via radio frequency magnetron sputtering. First, 1 μm-thick GST and IST thin films were deposited at 250 oC and room temperature, respectively, via radio-frequency sputtering; these films were annealed from 250 to 450 oC via rapid thermal annealing. The optimal power factor was found at an annealing temperature of 400 oC for 10 min. To demonstrate thermoelectric generation, we measured the output voltage and estimated the maximum power of the n-IST/ p-GST generator by imposing a temperature difference between the hot and cold junctions. The maximum output voltage and the estimated maximum power of the 1 μm-thick n-IST/p-GST TE generators are approximately 17.1 mV and 5.1 nW at ΔT = 12K, respectively.

We have investigated the properties of thin film transistors(TFT) fabricated using zinc tin oxide(ZTO) thin films deposited via on-axis sputtering and FTS methods. ZTO thin films deposited by FTS showed lower root-mean-square(RMS) roughness and more uniformity than those deposited via on-axis sputtering. We observed enhanced electrical properties of ZTO TFT deposited via FTS. The ZTO films were deposited at room temperature via on-axis sputtering and FTS. The as-deposited ZTO films were annealed at 400 oC. The TFT using the ZTO films deposited via FTS process exhibited a high mobility of 12.91 cm2/V.s, a low swing of 0.80 V/decade, Vth of 5.78 V, and a high Ion/off ratio of 2.52 × 106.

In this study, we investigated localized surface plasmon resonance and the related coupling phenomena with respect to various geometric parameters of Ag nanoparticles, including the size and inter-particle distance. The plasmon resonances of Ag nanoparticles were studied using three-dimensional finite difference time domain(FDTD) calculations. From the FDTD calculations, we discovered the existence of a symmetric and an anti-symmetric plasmon coupling modes in the coupled Ag nanoparticles. The dependence of the resonance wavelength with respect to the inter-particle distance was also investigated, revealing that the anti-symmetric mode is more closely correlated with the inter-particle distance of the Ag nanoparticles than the symmetric mode. We also found that higher order resonance modes are appeared in the extinction spectrum for closely spaced Ag nanoparticles. Plasmon resonance calculations for the Ag particles coated with a SiO2 layer showed enhanced plasmon coupling due to the strengthened plasmon resonance, suggesting that the inter-particle distance of the Ag nanoparticles can be estimated by measuring the transmission and absorption spectra with the plasmon resonance of symmetric and anti-symmetric localized surface plasmons.

Mono- and few-layer graphenes were grown on Ni thin films by rapid-thermal pulse chemical vapor deposition technique. In the growth steps, the exposure step for 60 s in H2 (a flow rate of 10 sccm (standard cubic centimeters per minute)) atmosphere after graphene growth was specially established to improve the quality of the graphenes. The graphene films grown by exposure alone without H2 showed an intensity ratio of IG/I2D = 0.47, compared with a value of 0.38 in the films grown by exposure in H2 ambient. The quality of the graphenes can be improved by exposure for 60 s in H2 ambient after the growth of the graphene films. The physical properties of the graphene films were investigated for the graphene films grown on various Ni film thicknesses and on 260-nm thick Ni films annealed at 500 and 700˚C. The graphene films grown on 260-nm thick Ni films at 900˚C showed the lowest IG/I2D ratio, resulting in the fewest layers. The graphene films grown on Ni films annealed at 700˚C for 2 h showed a decrease of the number of layers. The graphene films were dependent on the thickness and the grain size of the Ni films.

Ni and NiO particles were made by a combustion synthesis process. The characteristics of synthesized powders were investigated with various kinds and amounts of fuels such as urea, citric acid and glycine. Ni phase particles without NiO phase were obtained through combustion synthesis process in air atmosphere with-out further calcinations process, when the content of glycine was 2.44 times of the stoichiometric ratio in the precursor solution. Primary particle sizes of synthesized Ni and NiO particles were about 20∼30 nm.

상부전극, Pt, Ir, 그리고 IrO2, 에 따라 수소 열처리전과 후, 그리고 회복열처리시 누설전류특성을 고찰하였다. Pt/PLZT/Pt 케페시터는 수소열처리 후에 다시 회복열처리를 수행하면 완전히 이력곡선의 회복을 보이며 또한 피로특성도 거의 회복 된다. Pt과 IrO2 상부전극의 경우의 진 누설전류 특성은 열처리조건에 관계없이 강한 시간 의존성을 갖는 space-charge influenced injection모델에 적합하다. 반면에 Ir 상부전극의 경우는 Ir과 PLZT 사이의 계면에 헝성된 전도성 상인 IrO2로 인해 높은 누설전류 밀도를 보이면서 relaxation current 영역이 없이 steady state 영역을 보이는, 주로 Schottky barrier 모델에 의해 설명된다.

약 90 nm 두께의 비정질 TaSiN박막을 poly-Si and SiO2/Si 기판 위에 rf magnetron sputtering법으로 증착하였다. TaSiN박막은 산소부위기에서 열처리 시 900˚C까지 결정화되지 않는 비정질 상을 보였다. 산소의 확산 깊이는 산소분위기 열처리 온도가 증가함에 따라 증가하였으며 650˚C, 30분 열처리시 Ta23Si29N48의 경우 약 20 nm의 깊이까지 확산되었다. Ta23Si29N48 박막의 증착 후 비저항은 약 1,300μΩ-cm의 값을 보였지만 산소분위기 열처리시 700˚C 이상에서 급격히 증가하였다.

Metal/ferroelectric/insulator/semiconductor(MFIS)-Field Effect Transistor을 위한 Pt/YMnO3/Y2O3/Si 구조를 제조하여 MFIS 구조의 특성에 미치는 Y2O3박막의 영향을 고찰하였다. PLD법을 이용하여 p=type Si(111) 기판 위에 증착시킨 Y2O3박막은 증착온도와 관계없이 (111)방향으로의 우선배향성을 갖고 결정화 되었다. 실리콘 위에 바로 MOCVD법에 의해 강유전체 YMnO3박막을 증착시킨 경우 실리콘과의 계면에서 Mn이 부족한 층이 형성되지만 Y2O3가 실리콘과 YMnO3사이에 삽입된 경우는 Y2O3바로 위에서부터 화학양론비에 일치하는 양질의 YMnO3박막을 얻을 수 있었다. 850˚C, 100mtorr의 진공분위기에서 열처리한 YMnO3박막은 Y2O3가 삽입된 경우 memory window 값이 Y2O3가 삽입되지 않은 경우보다 더 큰 값을 보였으며 5V에서 1.3V의 값을 보였다.