Recent high efficiency electronic devices have been found to have heat emission problems. As for LEDs, an excessive increase in the device temperature causes a drop of the luminous efficiency and circuit lifetime. Therefore, heat release in the limited space of such electronic parts is very important. This is a study of the possibility of using a coating of carbon materials as a solution for the thermal emission problem of electronic devices. Powdered carbon materials, cokes, carbon blacks, amorphous graphite, and natural flakes were coated with an organic binder on an aluminum sheet and the subsequent thermal emissivity was measured with an FT-IR spectrometer and was found to be in the range of 5~20 μm at 50˚C. The emissivity of the carbon materials coated on the aluminum sheet was shown to be over 0.8 and varied according to carbon type. The maximum thermal emissivity on the carbon black coated-aluminum surface was shown to be 0.877. The emissivity of the anodized aluminum sheets that were used as heat releasing materials of the electronic parts was reported to be in the range of 0.7~0.8. Therefore, the use of a coating of carbon material can be a potential solution that facillitates heat dissipation for electronic parts.

Thermal emissivity of nuclear graphite was measured with its oxidation degree. Commercial nuclear graphites (IG-110, PECA, IG-430, and NBG-18) have been used as samples. Concave on graphites surface increased as its oxidation degree increased, and R value (Id/Ig) of the graphites decreased as the oxidation degree increased. The thermal emissivity increased depending on the decrease of the R (Id/Ig) value through Raman spectroscopy analysis. It was determined that the thermal emissivity was influenced by the crystallinity of the nuclear graphite.

Epoxy resin based encapsulants are widely used in semiconductor packaging applications. Epoxy resin based encapsulants are often subject to crack or delamination during the reliability test due to the thermal stress caused by high modulus nature of epoxy resins. Epoxy functional siloxanes are often added into epoxy resin to reduce the modulus so that the thermal stress can be reduced. Epoxy functional siloxanes, additives for reduced modulus, were synthesized and added into the curable epoxy resins. The modulus and the coefficient of thermal expansion (CTE) were also measured to investigate the thermal stress and to see whether the epoxy functional siloxane adversely affects the CTE or not. As a result, around 26% to 72% of thermal stress reduction was observed with no adverse effect on CTE.

Bacillus cereus is a gram-positive spore-forming bacterium and produces an emetic or diarrheal syndrome induced by an emetic toxin and an enterotoxin, respectively. In this study, the effect of different types of media, temperature, and time on the sporulation of B. cereus, and thermal resistance of B. cereus spores produced in various temperatures were evaluated. The highest levels of spores were detected when they are produced at 25℃. There were no significant differences in levels of spores produced at 25℃ among culture media and times while levels of spores produced at 43℃ were significantly reduced with the increase of time. However, thermal resistance of B. cereus spores could be affected by incubation temperature. In fact, higher D-values (12.0, 10.1, and 5.9 min for 2, 4, and 6 weeks, respectively) of spores produced at 43℃ were observed than did in samples produced at other temperatures (25 and 37℃). D-values of spores were 7.7, 8.2, and 12.0 min when they were produced at 25, 37, and 43℃ for 2 weeks, respectively. The sporulation of B. cereus at 25℃ could result in high amounts of spores however the sporulation at 43℃ for 2 weeks could be effective to produce thermal resistant spores.

Single crystal ZnIn2S4 layers were grown on thoroughly etched semi-insulating GaAs(100) substrateat 450oC with hot wall epitaxy (HWE) system by evaporating ZnIn2S4 source at 610oC. The crystalline structureof the single crystal thin films was investigated by the photoluminescence (PL) and double crystal X-ray rockingcurve (DCRC). The temperature dependence of the energy band gap of the ZnIn2S4 obtained from theabsorption spectra was well described by the Varshni’s relation, Eg(T)=2.9514eV-(7.24×10−4eV/K)T2/(T＋489K). After the as-grown ZnIn2S4 single crystal thin films were annealed in Zn-, S-, and In-atmospheres, theorigin of point defects of ZnIn2S4 single crystal thin films has been investigated by the photoluminescence (PL)at 10K. The native defects of VZn, VS, Znint, and Sint obtained by PL measurements were classified as a donorsor acceptors type. And we concluded that the heat-treatment in the S-atmosphere converted ZnIn2S4 singlecrystal thin films to an optical p-type. Also, we confirmed that In in ZnIn2S4/GaAs did not form the nativedefects because In in ZnIn2S4 single crystal thin films existed in the form of stable bonds.

The effects of fillers on the mechanical and thermal properties of glass/novolac composites have been studied. The matrix polymer and reinforcement were novolac type phenolic resin and milled glass fiber, respectively. Three different fillers, such as calcium carbonate, aluminum oxide, and wood powder were used for glass fiber reinforced plastic(GFRP) manufacture. Gravity, moisture content, tensile and flexural strength were measured to analyze the mechanical properties of GFRP and the final composites was burned in the electronic furnace at 1000℃ to confirm thermal properties GFRP containing aluminium oxide shows the highest thermal stability with 32% of weight loss at 1000℃ for one hour. GFRP containing calcium carbonate shows the maximum flexural strength (146 MPa), but that containing wood powder dose the highest tensile strength (65 MPa). Conclusively, we found that the characteristics of final composites strongly depend on several factors, such as types of materials, contents and chemical affinity of fillers. Therefore, it is very important to set up the combination of fillers for GFRP manufacturing to improve both mechanical and thermal properties at the same time.

Microstructural evolution and the intermetallic compound (IMC) growth kinetics in an Au stud bump were studied via isothermal aging at 120, 150, and 180˚C for 300hrs. The AlAu4 phase was observed in an Al pad/Au stud interface, and its thickness was kept constant during the aging treatment. AuSn, AuSn2, and AuSn4 phases formed at interface between the Au stud and Sn. AuSn2, AuSn2/AuSn4, and AuSn phases dominantly grew as the aging time increased at 120˚C, 150˚C, and 180˚C, respectively, while (Au,Cu)6Sn5/Cu3Sn phases formed at Sn/Cu interface with a negligible growth rate. Kirkendall voids formed at AlAu4/Au, Au/Au-Sn IMC, and Cu3Sn/Cu interfaces and propagated continuously as the time increased. The apparent activation energy for the overall growth of the Au-Sn IMC was estimated to be 1.04 eV.

We investigated heat stability of epoxy resin products and epoxy resin according to the influence hardener. The heat flow which shows the degree of thermal decomposition of the epoxy resin product and epoxy resin measured by using the differential scanning calorimeter (DSC). As a result, we found that in the case of heat stability for epoxy resin as hardener was added, the ratio of one to one (epoxy resin : hardener) was the most suitable in air condition and nitrogen atmosphere.

This technology is to highly produce heat by microorganism during fermentation of mushroom sludge as a byproduct at farm field which would be established more competitive in mushroom growers and distinguished technology with ordinary mushroom growers. Furthermore this technology could be reduced energy as well as high efficiency in resource uses. There was highly reduction in energy consumption using by heat during fermentation of mushroom sludge which was produced by different media material with vegetable for mushroom cultivation. After 4 days the inner temperature during fermentation of mushroom media was a little changes of 61～50℃ and inner temperature of fermentation chamber was 55～45℃, inlet temperature of cooling water was 17℃, outlet temperature was 44～35℃, and ambient temperature was 28℃ at daytime and 14℃ at night time which was relatively constant. A heat exchange from fermentation chamber was 1090～648㎉/10min and the maximum heat exchange was 11550～1064㎉/10min which was caused to reduce fermentation heat with time The efficiency of heat exchange was distributed with 81～61% with time.

The preparation of metallic glass composite powders was accomplished by the mechanical alloying of a pure Ti, Cu, Ni, Sn and carbon nanotube (CNT) powder mixture after 8 h milling. In the ball-milled composites, the initial CNT particles were dissolved in the Ti-based alloy glassy matrix. The bulk metallic glass composite was successfully prepared by vacuum hot pressing the as-milled CNT/ metallic glass composite powders. A significant hardness increase with the CNT additions was observed for the consolidated composite compacts.

The electrical and thermal conductivity of W-Cu composites were investigated as a function of the W-particle size and W-W contiguity. Powder mixtures were prepared by ball milling or mechanical alloying process, and then sintered at various temperatures. The electrical conductivity of sintered composite was increased with decreasing W grain size. Dependence of electrical conductivity on the W grain size was explained by the W-W contiguity concept. The thermal conductivity was increased with increasing the temperature up to but decreased at the temperature above Also, thermal conductivity value was influenced by the W particle size. Change of thermal conductivity in W-Cu composites was discussed based on the observed microstructural characteristics and theoretical considerations.