The overseas small ship market is witnessing a trend towards research aimed at substituting Fiber Reinforced Plastics (FRP), which poses environmental concerns, with High-Density Polyethylene (HDPE) in the shipbuilding process. Given the low melting point and high coefficient of thermal expansion of HDPE, research on joint areas is essential. This study focuses on preliminary investigations into ensuring the integrity of joints in shipbuilding processes using HDPE materials. Utilizing the Hot Gas Extrusion Welding method, which is conducive to joining large structures such as ships, HDPE joints were conducted. The material properties were evaluated based on the ASTM D638-14 international standards. This research aims to provide fundamental knowledge on the joining process of HDPE through Hot Gas Extrusion Welding and offers guidance on ensuring the integrity of joints in shipbuilding.

In this study, a new manufacturing process for a multilayer-clad electrical contact material is suggested. A thin and dense BCuP-5 (Cu-15Ag-5P filler metal) coating layer is fabricated on a Ag plate using a high-velocity oxygen-fuel (HVOF) process. Subsequently, the microstructure and bonding properties of the HVOF BCuP-5 coating layer are evaluated. The thickness of the HVOF BCuP-5 coating layer is determined as 34.8 μm, and the surface fluctuation is measured as approximately 3.2 μm. The microstructure of the coating layer is composed of Cu, Ag, and Cu-Ag-Cu3P ternary eutectic phases, similar to the initial BCuP-5 powder feedstock. The average hardness of the coating layer is 154.6 HV, which is confirmed to be higher than that of the conventional BCuP-5 alloy. The pull-off strength of the Ag/BCup-5 layer is determined as 21.6 MPa. Thus, the possibility of manufacturing a multilayer-clad electrical contact material using the HVOF process is also discussed.

In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu3P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/cm2. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.

Using a customized diffusion bonder, we executed diffusion bonding for ring shaped white gold and red gold samples (inner, outer diameter, and thickness were 15.7, 18.7, and 3.0 mm, respectively) at a temperature of 780 °C and applied pressure of 2300 N in a vacuum of 5 × 10−2 torr for 180 seconds. Optical microscopy, field emission scanning electron microscopy (FE-SEM), and energy-dispersive X-ray spectroscopy (EDS) were used to investigate the microstructure and compositional changes. The mechanical properties were confirmed by Vickers hardness and shear strength tests. Optical microscopy and FE-SEM confirmed the uniform bonding interface, which was without defects such as micro pores. EDS mapping analysis confirmed that each gold alloy was 14K with the intended composition; Ni and Cu was included as coloring metals in the white and red gold alloys, respectively. The effective diffusion coefficient was estimated based on EDS line scanning. Individual values of Ni and Cu were 5.0 × 10−8 cm2/s and 8.9 × 10−8 cm2/s, respectively. These values were as large as those of the melting points due to the accelerated diffusion in this customized diffusion bonder. Vickers hardness results showed that the hardness values of white gold and red gold were 127.83 and 103.04, respectively, due to solid solution strengthening. In addition, the value at the interface indicated no formation of intermetallic compound around the bonding interface. From the shear strength test, the sample was found not to be destroyed at up to 100,000 gf due to the high bonding strength. Therefore, these results confirm the successful diffusion bonding of 14K white-red golds with a diffusion bonder at a low temperature of 780 °C and a short processing time of 180 seconds.

This study was carried out to investigate the optimum condition of a friction stir welding process for a joint of AA2219-T87 and AA2195-T8 dissimilar aluminum alloys. These alloys are known to have good cryogenic properties, and as such to be suitable for use in fuel tanks of space vehicles. The welding parameters include the travelling speed, rotation speed and rotation direction of the tool. The experiment was conducted under conditions in which the travelling speed of the tool was 120-300 mm/min and the rotation speed of the tool was 400-800 rpm. To investigate the effect of the rotation direction of the tool, the joining was performed by switching the positions of the two dissimilar alloys. After welding, the microstructure was observed and the micro-hardness were measured; non-destructive evaluation was carried out to perform tensile tests on defect-free specimens. The result was that the microstructure of the weld joint underwent dynamic recrystallization due to sufficient deformation and frictional heat. The travelling speed of the tool had little effect on the properties of the joint, but the properties of the joint varied with the rotation speed of the tool. The conditions for the best joining properties were 600 rpm and 180-240 mm/min when the AA2219-T8 alloy was on the retreating side(RS).

In this study, the mechanical characteristics with micro structure were analyzed on the butt joint of AZ60 magnesium material extruded by GMAW and GTAW processes. As the result of tensile test, the fracture in the welding joint area happened at both processes and seemed to be brittle fracture. The yield strength of GMAW was 84.29% and GTAW was 60.43% as compared with base metal. The yield strength of GMAW was higher 23.86% than that of GTAW. The result of decreased micro hardness was indicated at both processes. The value of minimum micro hardness in FZ at GMAW was Hv 46.7 and GTAW was Hv 43.6 as compared with base metal. The value of minimum micro hardness at GMAW process was higher 5.64 % than that at GTAW process. The size of grain boundary at GMAW process in HAZ is smaller than that at GTAW process. GMAW process is more superior than GTAW process from the productivity and quality in case of automatic welding for magnesium alloy such as the automobile seat frame.

A roll-bonding process was applied to fabricate an AA1050/AZ91/AA1050 laminate complex sheet. Two AA1050 and one AZ91 magnesium sheets of 2 mm thickness, 30 mm width and 200 mm length were stacked up after surface treatment that included degreasing and wire brushing; material was then reduced to a thickness of 3 mm by one-pass cold rolling. The laminate sheet bonded by the rolling was further reduced to 2 mm in thickness by conventional rolling. The rolling was performed at 623K without lubricant using a 2-high mill with a roll diameter of 210 mm. The rolling speed was 15.9 m/min. The AA1050/AZ91/AA1050 laminate complex sheet fabricated by roll bonding was then annealed at 373~573K for 0.5h. The microstructure of the complex sheets was revealed by electron back scatter diffraction (EBSD) measurement; the mechanical properties were investigated by tensile testing and hardness testing. The strength of the complex sheet was found to increase by 11 % and the tensile elongation decreased by 7%, compared to those values of the starting material. In addition, the hardness of the AZ91 Mg region was slightly higher than those of the AA1050 regions. Both AA1050 and AZ91 showed a typical deformation structure in which the grains were elongated in the

Recently, applied areas of nonferrous materials have been expanded in terms of efficiency of materials used and cost reduction. And, in accordance with compactness and accuracy of parts, the need of joining of dissimilar materials is raised. Accordingly, this study aimed at finding out the optimal welding current value(6.3～6.5kA) considering tensile strength, fracture test and welding residue after joining with various welding conditions by means of copper pipe(Φ7.0 × t0.5) and aluminium pipe(Φ7.0 × t0.7) using an eutectic diffusion bonding machine.

Excellent electron transport properties with enhanced light scattering ability for light harvesting have made well-ordered one dimensional TiO2 nanotube(TNT) arrays an alternative candidate over TiO2 nanoparticles in the area of solar energy conversion applications. The principal drawback of TNT arrays being activated only by UV light has been addressed by coupling the TNT with secondary materials which are visible light-triggered. As well as extending the absorption region of sunlight, the introduction of these foreign components is also found to influence the charge separation and electron lifetime of TNT. In this study, a novel method to fabricate the TNT-based composite photoelectrodes employing visible responsive CuInS2 (CIS) nanoparticles is presented. The developed method is a square wave pulse-assisted electrochemical deposition approach to wrap the inner and outer walls of a TNT array with CIS nanoparticles. Instead of coating as a dense compact layer of CIS by a conventional non-pulsed-electrochemical deposition method, the nanoparticles pack relatively loosely to form a rough surface which increases the surface area of the composite and results in a higher degree of light scattering within the tubular channels and hence a greater chance of absorption. The excellence coverage of CIS on the tubular TiO2 allows the construction of an effective heterojunction that exhibits enhanced photoelectrochemical performance.

An ultrafine grained complex aluminum alloy was fabricated by an accumulative roll-bonding (ARB) process using dissimilar aluminum alloys of AA1050 and AA5052 and subsequently annealed. A two-layer stack ARB process was performed up to six cycles without lubricant at an ambient temperature. In the ARB process, the dissimilar aluminum alloys, AA1050 and AA5052, with the same dimensions were stacked on each other after surface treatment, rolled to the thickness reduction of 50%, and then cut in half length by a shearing machine. The same procedure was repeated up to six cycles. A sound complex aluminum alloy sheet was fabricated by the ARB process, and then subsequently annealed for 0.5h at various temperatures ranging from 100 to 350˚C. The tensile strength decreased largely with an increasing annealing temperature, especially at temperatures of 150 to 250˚C. However, above 250˚C it hardly decreased even when the annealing temperature was increased. On the other hand, the total elongation increased greatly above 250˚C. The hardness exhibited inhomogeneous distribution in the thickness direction of the specimens annealed at relatively low temperatures, however it had a homogeneous distribution in specimens annealed at high temperatures.

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and 6.44 J/m2 for 400, 450, and 500˚C, respectively, in a N2 atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

Silicon carbide (SiC) is a promising material for power device applications due to its wide band gap(3.26 eV for 4H-SiC), high critical electric field and excellent thermal conductivity. The Schottky barrier diodeis the representative high-power device that is currently available commercially. A field plate edge-terminated4H-SiC was fabricated using a lift-off process for opening the Schottky contacts. In this case, Ni/Ti dual-metalcontacts were unintentionally formed at the edge of the Schottky contacts and resulted in the degradation ofthe electrical properties of the diodes. The breakdown voltage and Schottky barrier height (SBH, ΦB) was 107V and 0.67eV, respectively. To form homogeneous single-metal Ni/4H-SiC Schottky contacts, a deposition andetching method was employed, and the electrical properties of the diodes were improved. The modified SBDsshowed enhanced electrical properties, as witnessed by a breakdown voltage of 635V, a Schottky barrier heightof ΦB=1.48eV, an ideality factor of n=1.04 (close to one), a forward voltage drop of VF=1.6V, a specific onresistance of Ron=2.1mΩ-cm2 and a power loss of PL=79.6Wcm-2.

본 연구에서는 Cu-Cu2O의 공정반응에 의한 구리와 알루미나의 직접접합에 대하여 연구 하였다. 1.5×10-1torr, 1015˚C에서 산화시킨 후 10-3torr, 1075˚C에서 접합시킨 시편의 접합력과 계면특성을 인장시험, SEM, EDS 및 XRD를 통하여 분석하였다. 3분 산화시켜 접합하면 우수한 접합강도를 보이며 산화시간이 이보다 짧거나 길면 결합력은 저하하였다. 과단은 알루미나 공정조직 계면에서 발생하였으며 파단후 Al2O3표면에는 Cu쪽에서 빠져나간 Cu2O nodule의 존재하였는 바 접합력은 Cu2O-Al2O3계면보다는 Cu-Cu2O계면에 좌우됨을 보여주고 있다. 접합력은 접합시간에 따라 완만한 증가를 보였으며 CuAl2O4및 CuAlO2의 반응생성물이 접합중 형성되었다.

In the TV manufacturing industry, a demand for chic design of TVs is increasing. As a reult of this trend in TV design, more curved surfaces in a TV cabinet are introduced, which enforces the use of fixers to combine a front cabinet with a TV main body. In this paper, we introduce a robot system for attaching various types of fixers to a TV cabinet. The developed system consists of three main blocks. The first one is the dispensing block, in which transferred cabinet is centered and UV adhesives are dispensed on the cabinet. The second one is the fixer attaching block, in which a cabinet is centered again and fixers are attached to pre-determined places on a cabinet by a robot with several end effectors. The last one is the UV hardening block, in which very strong ultraviolet rays are applied to the cabinet for attaching fixers tightly to the cabinet. The developed system is successfully adopted in a TV manufacturing process.