There has been a huge progress in semiconductor manufacturing processes such as reduction of the design rule(DR) and development of multi-processes. And, semiconductor industries have steadily extended its business and market share by reducing the design rule(DR) and enlarging the wafer size as well as by resolving many difficult technical problems through various noble approaches in order to reduce the production cost and to improve the yield. In semiconductor manufacturing, there is a significant difference in the number of memory chips produced according to the wafer size, wafer yield, and the level of the design rule even though the same number of wafers were put to the manufacturing process. So, almost all semiconductor manufacturing companies reach the conclusion that the enlarged size of wafer should be adopted in order to enhance the productivity and reduce the production cost. Thus, in this study, we investigate the specifications of the key functions and capabilities of the necessary modules in the yield analysis and improvement system required to acquire the stationary wafer yield with considering the 450mm wafer manufacturing system. Then the results of this research will be helpful for constructing the advanced yield analysis and improvement system called Real-Time Fault Monitoring and Detection (RTFMD) system.

In 450mm wafers production environment for next generation Fab, one of the most significant features is the adoption of full automation to the whole manufacturing processes involved. The full automation system will prevent the workers from intervening the manufacturing processes as much as possible and increase the importance of each individual wafer noticeably, and thus require a more robust scheduling system for entire semiconductor manufacturing processes. The scheduling system for 450mm wafers production also should be capable of monitoring the status of each individual wafer and collecting useful Fab data in real time. In this study, we first analysis of cluster tool in 450mm wafers production environment, and then propose a real-time scheduling algorithm based on timetabling algorithm.

Recently, one-dimensional semiconducting nanomaterials have attracted considerable interest for their potential as building blocks for fabricating various nanodevices. Among these semiconducting nanomaterials,, SnO2 nanostructures including nanowires, nanorods, nanobelts, and nanotubes were successfully synthesized and their electrochemical properties were evaluated. Although SnO2 nanowires and nanobelts exhibit fascinating gas sensing characteristics, there are still significant difficulties in using them for device applications. The crucial problem is the alignment of the nanowires. Each nanowire should be attached on each die using arduous e-beam or photolithography, which is quite an undesirable process in terms of mass production in the current semiconductor industry. In this study, a simple process for making sensitive SnO2 nanowire-based gas sensors by using a standard semiconducting fabrication process was studied. The nanowires were aligned in-situ during nanowire synthesis by thermal CVD process and a nanowire network structure between the electrodes was obtained. The SnO2 nanowire network was floated upon the Si substrate by separating an Au catalyst between the electrodes. As the electric current is transported along the networks of the nanowires, not along the surface layer on the substrate, the gas sensitivities could be maximized in this networked and floated structure. By varying the nanowire density and the distance between the electrodes, several types of nanowire network were fabricated. The NO2 gas sensitivity was 30~200 when the NO2 concentration was 5~20ppm. The response time was ca. 30~110 sec.

The studies on semiconductor industrial accident in korea have been focused on the frequencies of each type of safety management employee, characteristics, cause and unsafe conditions, acts and so on Those attributes of semiconductor industrial accidents

Semiconductor industry is based on equipment industry and timing industry. In particular, semiconductor process is very complex and as semiconductor-chip width tails and is becoming equipment gradually more as a high technology. Equipment operation is primarily engaged in semiconductor manufacturing (engineers and operator) of being conducted by, equipment errors have also been raised. Equipment operational data related to the error of korea occupational safety and health agency were based on data and production engineers involved in the operator's questionnaire was drawn through the error factor. Equipment operating in the error factor of 9 big item and 36 detail item detailed argument based on the errors down, and 9 big item the equipment during operation of the correlation error factor was conducted. Each of the significance level was correlated with the tabulation and analysis. Using the maximum correlation coefficient, the correlation between the error factors to derive the relationship between factors were analyzed. Facility operating with the analysis of error factors (big and detail item) derive a relationship between the model saw. The end of the operation of the facility in operation on the part of the two factors appeared as prevention. Safety aspects and ergonomics aspects of the approach should be guided to the conclusion.

Negative binomial yield model for semiconductor manufacturing consists of two parameters which are the average number of defects per die and the clustering parameter. Estimating the clustering parameter is quite complex because the parameter has not clear

This study was carried out to estimate the usefulness of metal oxide semiconductor(MOS) sensor as an odor measuring instrument. In this study, sensor output for 12 legal malodorous compounds was measured by two kinds of the marketed MOS sensor and was investigated the correlation coefficient between sensor output and odor indicators as like odor concentration, air dilution ratio. As a results, it was estimated that MOS sensor has a high use possibility as odor measuring device for the single compound analysis, as the correlation coefficient between sensor outputs and odor concentration, R2 appeared to 0.9 or more high.

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

For the past 25 years, Korean semiconductor has experienced enormous growth to be the highest production country in the world. Semiconductor industry is very time sensitive and driven by technology and process, and requires 24-hour full operation. The environment includes many different types of equipment, utilities, different gases and toxic chemicals as well as high voltage electricity. We have performed a survey with 3-shift engineers and workers in one line. The content of the questionnaire was about the correlation between fatigue and performance shaping factor (work type and work ability), and as a result we were able to deduce the correlation, p-value and the pattern of scatter plot. The shape of the model was made of 4 blocks for fatigue, 5 blocks for work type and 5 blocks for work ability, i. e. 14 blocks in total. As a conclusion to this findings, there was a correlation between fatigue and work type and work ability specifically in semiconductor industry, and we need some effort to reduce this.

In recent semiconductor manufacturing clean rooms, air washers are used to remove airborne gaseous contaminants such as NH3, SOx and organic gases from outdoor air introduced into clean room. In order to improve the gas removal performance of the air washers, a hot water contact heat exchanger can be installed upstream of an air washer, heating and humidifying the incoming outdoor air before entering the air washer. In the present study, an experiment was carried out to examine closely the improvement of gas removal efficiency by the insertion of the hot water contact heat exchanger. The experiment showed that the gas removal efficiency was increased by the water vapor condensation effect.

The study on semiconductor industrial accident in korea has been focused on frequencies of each type, employee, characteristics, cause and un-safety condition, behaviour and so on. Those attributes of semiconductor industrial accidents were usually analyzed independently, so that it was hard to provides a well-process and systematic guide lines for efficient safety management. There fore, there were a few studies based on comprehensive survey in terms of sharp-type of safe management. The questionnaire survey carried out for the workers(284) who were responsible for safety management in to center with corporate company with semiconductor industry the factor analysis showed that there were three factor of safety management. They were 1) Investment and operation and management for accident prevention, 2) Unsafe, safety management 3) General human error and behavior the industries of respondents were correlative with three group. Three Groups showed a statistically significant differences on the number of cases. Actually, the group with the larger investment and the better unsafe cause, human error a of accident prevention had a smaller cause of accident cases.

  The estimation of mortality characteristics of industrial property is an important adjunct to engineering valuation and depreciation estimation. Once the important of depreciation estimation is determined, it is desirable to understand the processes upo

반도체 직접회로 패키지에서, 실리콘 칩의 탑 표면은 양면 리드 프레임 영역에서 바로 붙게 된다. 여기서, 양면이란 베이스 층에 상위 접착층과 하위 접착층으로 되어 있음을 말한다. IC 패키지 구조는 탈 라미네이트 화와 같이 열-기계적 파손 모드로 나타나게 된다고 알려져 왔다. 이 파손 모드의 원인은 실리콘 칩 접착면의 잔류응력 과 냉간 숙성 공정 내에 리드 프레임으로 인해 일어난다. 숙성 공정 내 유도된 열응력은 실리콘 칩과 리드 프레임위에 냉간 잔류 응력에 영향을 가진다. 본 연구에서는 칩 표면 손상의 최소화를 위해서, 실리콘 칩 위에 접착 위상 최적화 방법들이 유한 요소 해석(Finite Element Analysis)을 통해 연구되었다

Through so that accident of semiconductor industry deduces unsafe factor of the person center on unsafe behaviour that incident history and questionnaire and I made starting point that extract very important factor. It served as a momentum that make up base that analyzes factors that happen based on factor that extract factor cause classification for the first factor, the second factor and the third factor and presents model of human error. Factor for whole defines factor component for human factor and to cause analysis 1 stage in human factor and step that wish to do access of problem and it do analysis cause of data of 1 step. Also, see significant difference that analyzes interrelation between leading persons about human mistake in semiconductor industry and connect interrelation of mistake by this. Continuously, dictionary road map to human error theoretical background to basis traditional accidental cause model and modern accident cause model and leading persons. I wish to present model and new model in semiconductor industry by backbone that leading persons of existing scholars who present model of existent human error deduce relation. Finally, I wish to deduce backbone of model of pre-suppression about accident leading person of the person center.

The power of semiconductor, Korea is continuously constructing semiconductor production line for keeping a front-runner status. however, studies and data about potential risks in semiconductor factory are still short. If fire does not initially suppressed, the fire causes a great damage. To decrease fire risk factors, in addition to fire fighting safety equipment, more important thing is how to design and construct fire protection system. The current fire protection codes about semiconductor factory come under functional law, and this law is short of consideration about particularity of factory. The existing prescriptive fire codes depending on experience compose without evident engineering verifications, thus equipments which is created by the current prescriptive fire code may bring about a variety of problems. For example, the design under the current regulation can not cope with the excessive investments, low efficiencies, and the diversifying construction designs and be applied to the quick changes of new technologies. Ergo, an optimal design for fire protection is to equip fire protection arrangements with condition and environment of production field. Manufacturing factory of semiconductors is a windowless airtight space. And for cleanliness, there exists strong flow of cooperation. Therefore, there is a need for fire safety design that meets the characteristic of a clean room. Accordingly, we are to derive smoke flow according to cooperation process within a clean room and construction plan of an optimal sensor system. In this study, in order to confirm the performance of proposed smoke-exhaust equipment and suggest efficient smoke exhaust device when there is a fire of 1MW of methane in the clean room of company H, we have implemented fire simulation using fluid dynamics computation.

In this report, we provide the focus on suggesting a method of estimating and measurement of CBM(Customer Behavior Model). Through the use of internet, a new trend of business for e-CRM on B2C Web Site known as EC has emerged. The purpose of this study is to identify the relationship between the customers of a shopping mall and CBM characteristics. It can be used to gain a better understanding of customers. From this we can determine trends, and so refine business toward customer's needs and target new products to particular customer groups. Result shows that there is a significant relationship between the customers pattern of shopping mall and CBM, CVM(Customer Visit Model).

This research analyzes clean room major fire prevention standard of clean Room(FM, IRI, and NFPA Code), the structure of Performance-Based Fire Safety Design(PBD) applied the korean fire industry situation. Performance-Based Fire Safety can operate effectively the performance of fire protection equipment & building design, so the fitness of fire safety system can be embodied by operating this. moreover, cost to be consume fire safety of real building can reduce and Performance-Based Fire Safety is considered to important technique in fire protection field. A fire in a clean room may cause a serious loss by spreading smoke particles. We will be investigated by using a computational fluid dynamics, for loss prevention by smoke spreading from one fire area to another for clean room and compared the Performance-Based Fire Safety Design with the prescriptive code design. The methodology of fire safety performance-based fire safety design and guarantee of many kinds design skill of fire system and developing design procedure will be very serious one in order to improve efficiency of domestic system. Therefore, This research will be contributing to secure safety of clean room and to set up the performance-based fire safety design in Korea by regulation for the performance-based fire safety design effectively.

Numerical analysis was conducted to characterize particle deposition on a heated rotating semiconductor wafer with respect to wafer diameter. The particle transport mechanisms considered in this study were convection, Brownian diffusion, gravitational settling, and thermophoresis. The averaged particle deposition velocities and their radial distributions on the upper surface of the wafer were calculated from the particle concentration equation in an Eulerian frame of reference at rotating speeds of 0 and 1000 rpm, wafer diameters of 100, 300 mm and wafer heating of =0 and 5K. It was observed from the numerical results that the averaged deposition velocities on the upper surface increase, when the wafer diameter confirms increase. The comparison of the present numerical results with the available experimental results showed relatively good agreement between different studies.