In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of 300˚C for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer (200Å), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of 300˚C for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.

For the fabrication of core-shell structure bimetallic lead-free solder balls, both the critical temperature (Tcr) for the phase separation of two immiscible liquid phases and the temperature coefficient of the interfacial tension between the two separated liquid phases are required. In order to obtain this information, the temperature dependence of the surface tension of 60%Bi-24%Cu-16%Sn(-REM) alloys was measured using the constrained drop method. The slope of the temperature dependence of the surface tension changed clearly at a critical temperature for the separation of two immiscible liquid phases. The critical temperature of the 60%Bi-24%Cu-16%Sn alloy was estimated to be 1097K. An addition of 0.05% Ce decreased the critical temperature to 1085K, whereas that of 0.05% La increased it to 1117K. It was found that the surface tension and its temperature coefficient of the 60%Bi-24%Cu-16%Sn alloy were slightly increased by the addition of 0.05% Ce and 0.05% La. In addition, additions of Ce and La increased the temperature coefficient of the interfacial tension.

Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires. 50 nm Co (Re,P) films were deposited on Cu/Ti-coated silicon wafers which acted as a catalytic seed and an adhesion layer, respectively. To obtain the optimized bath composition, electroless deposition was studied through an electrochemical approach via a linear sweep voltammetry analysis. The results of using this method showed that the best deposition conditions were a CoSO4 concentration of 0.082 mol/l, a solution pH of 9, a KReO4 concentration of 0.0003 mol/l and sodium hypophosphite concentration of 0.1 mol/L at 80˚C. The thermal stability of the Co (Re,P) layer as a barrier preventing Cu was evaluated using Auger electron spectroscopy and a Scanning calorimeter. The measurement results showed that Re impurities stabilized the h.c.p. phase up to 550˚C and that the Co (Re,P) film efficiently blocked Cu diffusion under an annealing temperature of 400˚C for 1hr. The good barrier properties that were observed can be explained by the nano-sized grains along with the blocking effect of the impurities at the fast diffusion path of the grain boundaries. The transformation temperature from the amorphous to crystal structure is increased by doping the Re.

A semi-empirical method to estimate the surface tension of molten alloys at different oxygen partialpressures is suggested in this study. The surface tension of molten Ag-Sn and Ag-Cu alloys were calculatedusing the Butler equation with the surface tension value of pure substance at a given oxygen partialpressure. The oxygen partial pressure ranges were 2.86×10-12－1.24×10-9Pa for the Ag-Sn system and2.27×10-11－5.68×10-4 Pa for the Ag-Cu system. In this calculation, the interactions of the adsorbed oxygenwith other metallic constituents were ignored. The calculated results of the Ag-Sn alloys were in reasonableaccordance with the experimental data within a difference of 8%. For the Ag-Cu alloy system at a higheroxygen partial pressure, the surface tension initially decreased but showed a minimum at XAg = 0.05 to increaseas the silver content increased. This behavior appears to be related to the oxygen adsorption and thecorresponding surface segregation of the constituent with a lower surface tension. Nevertheless, the calculatedresults of the Ag-Cu alloys with the present model were in good agreement with the experimental data withina difference of 10%.

Reactive oxygen species (ROS) is toxic to living organisms, because its high reactivity causes oxidative damage to proteins, nucleic acids, and lipids. Superoxide dismutase (SOD) is an enzyme facilitating the removal of superoxide anions from living organisms. This study focused on the cloning of MnSOD cDNA from Hyphantria cuneaand its induction upon bacterial infection and various stresses. The open reading frame of MnSOD is composed of 645 bp, encoding 215 amino acid residues. The theoretical molecular mass and pI of putative MnSOD was evaluated to be 24276 Da and 9.14, respectively. The MnSOD from H. cunea is highly similar to human MnSOD (59.5%) as well as Bombyx mori MnSOD (76.2%). MnSOD showed no big induction upon bacterial infection and stresses, compared to that of Cu/ZnSOD.

Fe based () amorphous powder were produced by a gas atomization process, and then ductile Cu powder fabricated by the electric explosion of wire(EEW) were mixed in the liquid (methanol) consecutively. The Fe-based amorphous - nanometallic Cu composite powders were compacted by a spark plasma sintering (SPS) processes. The nano-sized Cu powders of 200 produced by EEW in the methanol were mixed and well coated with the atomized Fe amorphous powders through the simple drying process on the hot plate. The relative density of the compacts obtained by the SPS showed over 98% and its hardness was also found to reach over 1100 Hv.

Hydrogen production via high high-temperature steam electrolysis consumes less electrical energy than compared to conventional low low-temperature water electrolysis, mainly due to the improved thermodynamics and kinetics at elevated temperaturetemperatures. The elementalElemental powders of Cu, Ni, and YSZ are were used to synthesize high high-temperature electrolysis cathodecathodes, of Ni/YSZ and Cu/YSZ composites, by mechanical alloying. The metallic particles of the composites were uniformly covered with finer YSZ particles. Sub-micron sized pores are were homogeneously dispersed in the Ni/YSZ and Cu/YSZ composites. In this study, The cathode materials were synthesized and their Characterizations properties were evaluated in this study: It was found that the better electric conductivity of the Cu/YSZ composite was measured improved compared tothan that of the Ni/YSZ composite. Slight A slight increase in the resistance can be produced for in a Cu/YSZ cathode by oxidation, but it this is compensated offset for by a favorable thermal expansion coefficient. Therefore, Cu/YSZ cermet can be adequately used as a suitable cathode material of in high high-temperature electrolysis.

The purpose of this study is to characterize various electrolytes on electrochemical mechanical planarization (ECMP). The ECMP system was modified from conventional CMP system to measure the potentiodynamic curve and removal rate of Cu. The potentiodynamic curves were measured in static and dynamic states in investigated electrolytes using a potentiostat for the evaluation of the polishing behavior on ECMP. KOH (alkaline) and NaNO3 (salt) were selected as electrolytes which have high conductivity. In static and dynamic states, the corrosion potential decreased and the corrosion current increased as a function of the electrolyte concentration. But, the electrochemical reaction was prevented by mechanical polishing effect in the dynamic state. The static etch and removal rate were measured as functions of concentration and applied voltage. When NaNO3 was used, the dissolution was much faster than that of KOH. It was concluded that the removal rate was strongly depended on electrochemical dissolution. The removal rate increased up to 350 nm/min in NaNO3 based electrolyte.

This study is focused on the antimicrobial activity of cyanobacteria Microcystis aeruginosa by the reduction and oxidation reaction of copper and zinc alloy metal fiber filter. Cu/Zn ion is easily makes radicals with molecular hydroperoxide. Especially, hydroperoxide radical shows strong toxicity to the strains. Plasma membrane causes conformational change when hydroperoxide radical binds to plasma membrane. Elution of copper ion from copper and zinc alloy metal fiber is detected in the cyanobacteria solution as 0.5 ppm, and that of zinc ion is 0 ppm respectively. Zinc ion is figured to form a hydroxide in the cyanobacteria solution and precipitated to form a sludge. The concentration of chlorophyll-a in the cyanobacteria solution was proved to be the index of antimicrobial level of Microcystis aeruginosa.

Al-Cu alloy nano powders have been produced by the electrical explosion of Cu-plated Al wire. The porous nano particles were prepared by leaching for Al-Cu alloy nano powders in 40wt% NaOH aqueous solution. The surface area of leached powder for 5 hours was 4 times larger than that of original alloy nano powder. It is demonstrated that porous nano particles could be obtained by selective leaching of alloy nano powder. It is expected that porous Cu nano powders can be applied for catalyst of SRM (steam reforming methanol).

Dynamic plastic deformation behavior of copper particles occurred during the cold spray processing was numerically analyzed using the finite element method. The study was to investigate the impact as well as the heat transfer phenomena, happened due to collision of the copper particle of in diameter with various initial velocities of into the copper matrix. Effective strain, temperature and their distribution were investigated for adiabatic strain and the accompanying adiabatic shear localization at the particle/substrate interface.

Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.

1.5 μm-thick copper films deposited on silicon wafers were successfully bonded at 415˚C/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than 10.4 J/m2 as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than 300˚C had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over 400˚C. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

The present work was performed to investigate the effect of coiling temperature on the annealed texture in Cu/Nb-added ultra-low-carbon steels. The ultra-low-carbon steels were coiled at 650 and 720˚C, respectively. The result showed that the Cu-added ultra-low-carbon steel at a low coiling temperature produced a desirable annealed texture related to good formability. On the other hand, Nb-added ultra-low-carbon steel at a high coiling temperature also produced a desirable texture. This is attributed to the effect of Nb, which retards recrystallization during the coiling process.

The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.

The magnetron sputtering was used to deposit Ni buffer layers on the polyimide surfaces to increase the adhesion strength between Cu thin films and polyimide as well as to prevent Cu diffusion into the polyimide. The Ni layer thickness was varied from 100 to 400Å. The adhesion strength increased rather significantly up to 200Å of Ni thickness, however, there was no significant increase in strength over 200Å. The XPS analysis revealed that Ni thin films could increase the adhesion strength by reacting with the polar C=O bonds on the polyimide surface and also it could prevent Cu diffusion into the polyimide. The Cu/Ni/ polyimide multilayer thin films showed a high stability even at the high heating temperature of 200˚C, however, at the temperature of 300˚C, Cu diffused through the Ni buffer layer into polyimide, resulting in the drastic decrease in adhesion strength.

The texture and microstructure in Cu/Nb added ultra low carbon steels through the different thickness layer were studied after hot rolling. It was found that the two ultra low carbon steels all show the inhomogeneity of hot rolling texture and the Cu-added ultra low carbon steel was far more inhomogeneous than Nb-added one. In the center layer, the strong α fibre, γ fibre textures and the shear textures including 001<110>, 111<112> were founded. Near the surface, the α fibre texture and the orientation texture caused by a typical plane-strain deformation condition of bcc metals were observed.

Cu-coated CaS:Eu2+을 1000℃에서 1500℃까지 소성하여 합성하였으며, 이를 스크린 인쇄 방법(screen printing method)을 이용하여 전면 전극층(ITO PET film), 형광층(Cu-coated CaS:Eu2+), 절연층(BaTiO3), 배면 전극층(silver)순으로 적층하였다. 1000℃에서 1500℃까지 소성 온도가 올라감에 따라서 형광체의 grain 크기가 증가 하는 것을 SEM 사진을 통하여 확인하였다. 또한 광 발광(Photoluminescence) 측정에서는 1000℃에서 가장 밝은 발광을 보였으며, 온도가 증가함에 따라 점진적으로 감소하는 경향성을 보였으나, 전계 발광 (Electroluminescence)의 경우에는 1400℃에서 가장 좋은 발광 상태를 보였다. 광 발광과 전계 발광의 경향성 차이는 전계 발광 소자에서의 grain 크기 효과 때문이다. grain 크기가 작아지면 sheet 저항이 낮아지며, 이에 따라 가속되는 전자의 에너지가 증가하여 발광 효율을 높여준 것으로 판단된다.