In this study we examine variations in the structure of perovskite compounds of LaBa2Cu2O9, LaBa2CaCu3O12 and LaBa2Ca2Cu5O15 synthesized using the solid state reaction method. The samples’ compositions were assessed using X-ray fluorescence (XRF) analysis. The La: Ba: Ca: Cu ratios for samples LaBa2Cu2O9, LaBa2CaCu3O12 and LaBa2Ca2Cu5O15 were found by XRF analysis to be around 1:2:0:2, 1:2:1:3, and 1:2:2:5, respectively. The samples’ well-known structures were then analyzed using X-ray diffraction. The three samples largely consist of phases 1202, 1213, and 1225, with a trace quantity of an unknown secondary phase, based on the intensities and locations of the diffraction peaks. According to the measured parameters a, b, and c, every sample has a tetragonal symmetry structure. Each sample’s mass density was observed to alter as the lead oxide content rose. Scanning electron microscope (SEM) images of the three phases revealed that different Ca-O and Cu-O layers can cause different grain sizes, characterized by elongated thin grains, without a preferred orientation.

The relationship between the precipitation of secondary phase and the thermal properties of Al-4.5%Cu alloy (in wt.%) after various heat treatments has been studied. Solid solution treatment of alloy was performed at 808 K for 6 hours, followed by warm water quenching; then, the samples were aged in air at 473 K for different times. The thermal diffusivity of the Al-4.5%Cu alloy changed with the heat treatment conditions of the alloy at temperatures below 523 K. The as-quenched specimen had the lowest thermal diffusivity, and as the artificial aging time increased, the thermal diffusivity of the specimen increased in the temperature range between 298 and 523 K. For the specimen aged for five hours, the thermal conductivity was 12% higher than that of the as-quenched specimens at 298 K. It is confirmed that the thermal diffusivity and thermal conductivity of the Al-4.5%Cu alloy significantly depend on their thermal history at temperatures below 523 K. The precipitation and dissolution of the Al2Cu phase were confirmed via DSC for the alloys, and the formation of coefficient of thermal expansion peaks in TMA was caused by precipitation. The precipitation of supersaturated solid solution of Al-4.5%Cu alloys had an additional linear expansion of ≈ 0.05 % at 643 K during thermal expansion measurement.

The effect of intercritical annealing temperature on the microstructure and mechanical properties of Fe-9Mn-0.2C- 3Al-0.5Si medium manganese steels containing Cu and Ni is investigated in this study. Six kinds of medium manganese steels are fabricated by varying the chemical composition and intercritical annealing temperature. Hardness and tensile tests are performed to examine the correlation of microstructure and mechanical properties for the intercritical annealed medium manganese steels containing Cu and Ni. The microstructures of all the steels are composed mostly of lath ferrite, reverted austenite and cementite, regardless of annealing temperature. The room-temperature tensile test results show that the yield and tensile strengths decrease with increasing intercritical annealing temperature due to higher volume fraction and larger thickness of reverted austenite. On the other hand, total and uniform elongations, and strain hardening exponent increase due to higher dislocation density because transformation-induced plasticity is promoted with increasing annealing temperature by reduction in reverted austenite stability.

GdBa2Cu3O7-y(Gd123) powders were synthesized by the solid-state reaction method using Gd2O3 (99.9% purity), BaCO3 (99.75%) and CuO (99.9%) powders. The synthesized Gd123 powder and the Gd123 powder with Gd2O3 addition (Gd1.5Ba2Cu3O7-y(Gd1.5)) were used as raw powders for the fabrication of Gd123 bulk superconductors. The Gd123 and Gd1.5 bulk superconductors were fabricated by sintering or a top-seeded melt growth (TSMG) process. The superconducting transition temperature (Tc,onset) of the sintered Gd123 was 93 K and the transition width was as large as 20 K. The Tc,onset of the TSMG processed Gd123 was 82 K and the transition width was also as large as 12 K. The critical current density (Jc) at 77 K and 0 T of the sintered Gd123 and TSMG processed Gd123 were as low as a few hundreds A/cm2. The addition of 0.25 mole Gd2O3 and 1 wt.% CeO2 to Gd123 enhanced the Tc, Jc and magnetic flux density (H) of the TSMG processed Gd123 sample owing to the formation of the superconducting phase with high flux pinning capability. The Tc of the TSMG processed Gd1.5 was 92 K and the transition width was 1 K. The Jcs at 77 K (0 T and 2 T) were 3.2×104 A/cm2 and 2.5×104 A/cm2, respectively. The H at 77 K of the TSMG-processed Gd1.5 was 1.96 kG, which is 54% of the applied magnetic field (3.45 kG).

Large single grain Gd1.5Ba2Cu3O7-y (Gd1.5) bulk superconductors were fabricated by a top-seeded melt growth (TSMG) process using an NdBa2Cu3O7-y seed. The seeded Gd1.5 powder compacts with a diameter of 50 mm were subjected to the heating cycles of a TSMG process. After the TSMG process, the diameter of the single grain Gd1.5 compact was reduced to 43 mm owing to the volume contraction during the heat treatment. The superconducting transition temperature (Tc) of the top surface of the single grain Gd1.5 sample was as high as 93.5 K. The critical current densities (Jcs) at 77 K and 1T and 1.5 T were in ranges of 25,200-43,900 A/cm2 and 10,000-23,000 A/cm2, respectively. The maximum attractive force at 77 K of the sample field-cooled using an Nd-B-Fe permanent magnet (surface magnetic field of 0. 527 T) was 108.3 N; the maximum repulsive force of the zero field-cooled sample was 262 N. The magnetic flux density of the sample field-cooled at 77 K was 0.311T, which is approximately 85% of the applied magnetic field of 0.375 T. Microstructure investigation showed that many Gd2BaCuO5 (Gd211) particles of a few μm in size, which are flux pinning sites of Gd123, were trapped within the GdBa2Cu3O7-y (Gd123) grain; unreacted Ba3Cu5O8 liquid and Gd211 particles were present near the edge regions of the single grain Gd1.5 bulk compact.

In this study, Cu-5Ni-10Sn(wt%) spinodal alloy was manufactured by gas atomization spray forming, and the microstructural features and mechanical properties of Cu-5Ni-10Sn alloy have been investigated during homogenization, cold working and age-hardening. The spray formed Cu-5Ni-10Sn alloy consisted of an equiaxed microstructure with a mixture of solid solution -(CuNiSn) grains and lamellar-structure grains. Homogenization at and subsequent rapid quenching formed a uniform solid solution -(CuNiSn) phase. Direct aging at from the homogenized Cu-5Ni-10Sn alloy promoted the precipitation of finely distributed ' or phase throughout the matrix, resulting in a significant increase in microhardness and tensile strength. Cold working prior to aging was effective in strengthening Cu-5Ni-10Sn alloy, which gave rise to a maximum tensile strength of 1165 MPa. Subsequent aging treatment slightly reduced the tensile strength to 1000-1100 MPa due to annealing effects.

The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.

(hfac)Cu(1, 5-DMCOD)(1, 1, 1, 5, 5, 5-Hexafluoro-2, 4-pentanedionato Cu(I) 1, 5-dimethyl-cyclooctadine) 전구체와 He 운반기체를 이용하여 MOCVD(Metal Organic Chemical Vapor Deposition) 방법으로 Cu 박막을 형성하였으며, He 운반기체와 함께 H2 gas 및 H(hfac) Ligand의 첨가가 Cu 박막 형성에 미치는 영향에 대하여 조사하였다. He운반기체만을 사용한 경우, Cu 박막의 증착율은 기판온도 180~230˚C에서 20~125Å/min 정도로 낮은 값을 보였으며, 특히 기판온도 190˚C에서는 매우 얇은 두께 (700Å)이면서 낮은 비저항(2.8μΩcm)을 갖는 Cu 박막이 형성됨을 알 수 있었다 He 운반기체와 함께 환원가스(H2) 및 화학첨가제 (H (hfac) ligand)의 첨가 실험에서는 낮은 기판온도 (180~190˚C) 구간에서 현저하게 증착율이 증가하였으며 얇은 두께 (~500Å)의 Cu 박막이 낮은 비저항(3.6~2.86μΩcm)을 갖는 것으로 나타났다. 또한 얇은 두께의 MOCVD Cu박막들의 표면 반사도(reflectance)는 300˚C에서 열처리한 sputter Cu의 반사도에 근접하는 우수한 surface morphology를 보였다 결국, (hfac)Cu(1,6-DMCOD) 전구체를 이용하여 얻어진 MOCVD Cu박막은 얇은 두께에서 낮은 비저항을 갖는 우수한 막질을 보였으며, Electrochemical deposition공정에서 conformal seed layer로써의 적용이 가능할 것으로 기대된다.

63Sn-37Pb에 Cu6Sn5를 분산시킨 760μm크기의 솔더범프를 Au(0.5μm)/Ni(5μm)/Cu(27±20μm) BGA 기판에 스크린)/Ni(5im)/Cu(27:201m) B3GA 기판에 스크린 프린팅법으로 제조하여, 리플로우 피크온도 유지시간, 150˚C 시효처리 시간에 따른 전단강도를 분석하였다. Cu6Sn5를 첨가한 솔더범프는 피크온도에서 30초간 유지시에는 63Sn-37Pb 솔더범프보다 높은 전단강도를 나타내었으나, 피크온도 유지시간을 60초 이상으로 증가시킴에 따라 전단강도가 63Sn-37Pb 솔더범프보다 저하하였다. 전단시험 후 솔더범프의 파단면은 초기에 전단 균열의 점진적인 전파에 의해 발생된 파괴부위와 점진적 균열전파에 의한 면적 감소로 솔더범프가 급격히 떨어져 나가면서 발생한 파괴부위로 구분할 수 있었다 피크온도 유지시간, 150˚C 시효처리 시간 및 Cu6Sn5 첨가량에 무관하게 점진적 파괴모드에 의한 균열 전파길이가 증가할수록 솔더범프의 전단강도가 감소하였다.감소하였다.

An optimum route to fabricate the nanocomposites with sound microstructure and improved mechanical properties was investigated. Microstructural investigations for the composites prepared using -nitrate showed that fine Cu particles with average size of 150 nm were homogeneously distributed within the matrix grains and at the grain boundaries. Fracture strength of 953 MPa and toughness of 4.8 Mpa(equation omitted)m were measured for the composite. The strengthening and toughening of the composites are explained by the refinement of the microstructure and the crack bridging/deflection, respectively.