In order to develop a new commercial Al-12%Si casting alloy with improved physical properties, we investigated the effect of adding Sr and TiB to the alloy. Al-12%Si alloys were prepared by die casting at 660 oC. The eutectic temperature of the Sr-modified Al-12%Si alloy decreased to 9 oC and the mushy zone region increased. The shape of the Si phase changed from coarse acicula to fine fiber with the addition of Sr. The addition of TiB in the Al-12%Si alloy reduced the size of the primary α-Al and eutectic Si phases. When Sr and TiB were added together, it worked more effectively in refinement and modification. The density of twins in the Si phase-doped Sr increased and the width of the twins was refined to 5 nm. These results are related to the impurity induced twinning(IIT) growth.

Recently, applied areas of nonferrous materials have been expanded in terms of efficiency of materials used and cost reduction. And, in accordance with compactness and accuracy of parts, the need of joining of dissimilar materials is raised. Accordingly, this study aimed at finding out the optimal welding current value(6.3～6.5kA) considering tensile strength, fracture test and welding residue after joining with various welding conditions by means of copper pipe(Φ7.0 × t0.5) and aluminium pipe(Φ7.0 × t0.7) using an eutectic diffusion bonding machine.

The deformation properties of a TiC-Mo eutectic composite were investigated in a compression test at temperaturesranging from room temperature to 2053K and at strain rates ranging from 3.9×10−5s−1 to 4.9×10−3s−1. It was found that thismaterial shows excellent high-temperature strength as well as appreciable room-temperature toughness, suggesting that thematerial is a good candidate for high-temperature application as a structure material. At a low-temperature, high strength isobserved. The deformation behavior is different among the three temperature ranges tested here, i.e., low, intermediate and high.At an intermediate temperature, no yield drop occurs, and from the beginning the work hardening level is high. At a hightemperature, a yield drop occurs again, after which deformation proceeds with nearly constant stress. The temperature- andyield-stress-dependence of the strain is the strongest in this case among the three temperature ranges. The observed high-temperature deformation behavior suggests that the excellent high-temperature strength is due to the constraining of thedeformation in the Mo phase by the thin TiC components, which is considerably stronger than bulk TiC. It is also concludedthat the appreciable room-temperature toughness is ascribed to the frequent branching of crack paths as well as to the plasticdeformation of the Mo phase.

Al-based alloys have recently attracted considerable interest as structural materials and light weight materials due to their excellent physical and mechanical properties. For the investigation of the potential of Al-based alloys, a surface porous Al88Cu6Si6 eutectic alloy has been fabricated through a chemical leaching process. The formation and microstructure of the surface porous Al88Cu6Si6 eutectic alloy have been investigated using X-ray diffraction and scanning electron microscopy. The Al88Cu6Si6 eutectic alloy is composed of an α-Al dendrite phase and a single eutectic phase of Al2Cu and α-Al. We intended to remove only the α-Al phase and then the Al2Cu phase would form a porous structure on the surface with open pores. Both acidic and alkaline aqueous chemical solutions were used with various concentrations to modify the influence on the microstructure and the overall chemical reaction was carried out for 24 hr. A homogeneous open porous structure on the surface was revealed via selective chemical leaching with a H2SO4 solution. Only the α-Al phase was successfully leached while the morphology of the Al2Cu phase was maintained. The pore size was in a range of 1~5μm and the dealloying depth was nearly 3μm. However, under an alkaline NaOH, aqueous solution, an inhomogeneous porous structure on the surface was formed with a 5 wt% NaOH solution and the morphology of the Al2Cu phase was not preserved. In addition, the sample that was leached by using a 7 wt% NaOH solution crumbled. Al extracted from the Al2Cu phase as α-Al phase was dealloyed, and increasing concentration of NaOH strongly influenced the morphology of the Al2Cu phase and sample statement.

In the DBC (direct bonding of copper) process the oxygen partial pressure surrounding the AlN/Cu bonding pairs has been controlled by Ar gas mixed with oxygen. However, the direct bonding of Cu with sound interface and good adhesion strength is complicated process due to the difficulty in the exact control of oxygen partial pressure by using Ar gas. In this study, we have utilized the in-situ equilibrium established during the reaction of + 1/2 by placing powder bed of CuO or around the Cu/AlN bonding pair at . The adhesion strength was relatively better in case of using CuO powder than when powder was used. Microstructural analysis by optical microscopy and XRD revealed that the interface of bonding pair was composed of , Cu and small amount of CuO phase. Thus, it is explained that the good adhesion between Cu and AlN is attributed to the wetting of eutectic liquid formed by reaction of Cu and .

Recently, ultrafine grained (ufg, typically 100 > d > 500 nm) Ti-Fe eutectic materials have been highlighted due to their extraordinarily high strength and good abrasion resistance compared to conventional coarse grained (cg, d > 1μm) materials. However, these materials exhibit limited plastic strain and toughness during room temperature deformation due to highly localized shear strain. Several approaches have been extensively studied to overcome such drawbacks, such as the addition of minor elements (Sn, Nb, Co, etc.). In this paper, we have investigated the influence of the addition of Gd and Y contents (0.3-1.0 at.%) into the binary Ti-Fe eutectic alloy. Gd and Y are chosen due to their immiscibility with Ti. Microstructural investigation reveals that the Gd phase forms in the eutectic matrix and the Gd phase size increases with increasing Gd content. The improvement of the mechanical properties is possibly correlated to the precipitation hardening. On the other hand, in the case of Ti-Fe-Y alloys, with increasing Y contents, primary phases form and lamellar spacing increases compared to the case of the eutectic alloy. Investigation of the mechanical properties reveals that the plasticity of the Ti-Fe-Y alloys is gradually improved, without a reduction of strength. These results suggest that the enhancement of the mechanical properties is closely related to the formation of the primary phase.

Directional solidification experiments were carried out at 1-300 μm/sec solidification rates in the single crystal superalloy, CMSX 10. The solid/liquid interface morphology changed from planar to dendritic, and the dendrite spacing became finer as the solidification rate increased. The pool size of the γ/γ' eutectic, formed between dendrites, reduced as the solidification rate increased. The phase formation temperatures, such as the solidus, liquidus and eutectic, were estimated by differential scanning calorimetry (DSC) analysis. The morphology of the γ/γ' phase, known to be eutectic, showed γ' cells with a γ intercellular network, and this γ/γ' was composed of coarse and fine γ/γ' regions. In this study, it is suggested that the γ/γ' phase was a coupled peritectic.The solidification procedure of the γ/γ' between dendrites is also discussed.

In this work, the dispersion behavior of particles in binary aluminum (Al)-copper (Cu) cast alloy was investigated with respect to Cu contents of 20 (hypoeutertic), 33 (eutectic) and 40 (hypereutectic) wt.%. In cases of hypo and hypereutectic compositions, SEM images revealed that the primary Al and phases were grown up at the beginning, respectively, and thereafter the eutectic phase was solidified. In addition, it was found that some of particles can be dispersed into the primary Al phase, but none of them are is observed inside the primary 6 phase. This different dispersion behavior of particles is probably due to the difference in the val- ues of specific gravity between particles and primary phases. At eutectic composition, particles were well dispersed in the matrix since there is few primary phases acting as an impediment site for particle dispersion during solidification. Based on the experimental results, it is concluded that particles are mostly dispersed into the eutectic phase in binary Al-Cu alloy system.

TiC-TiB2-SiC system was a ternary eutectic, whose eutectic composition was 34TiC-22TiB2-44SiC (mol%). TiC-TiB2-SiC ternary eutectic composite were synthesized by a floating zone method using TiC, TiB2 and SiC powders as starting materials. The TiC-TiB2-SiC eutectic composite showed a lamellar texture. TiC(022), TiB2(010) and SiC(111) of the eutectic composite were perpendicular to the growth direction. TiC-TiB2-SiC ternary eutectic composite had specific relationship among the crystal planes: TiC[011]//TiB2[010]//SiC[112], TiC(200)//TiB2(001)//SiC( 402 ) and TiC( 111 )//TiB2(101 )//SiC( 220 ).

솔더 범프를 사용하는 플립 칩 접속기술에서 범프와 칩 사이에 위치하는 금속 충들의 조합을 UBM(Under Bump Metallurgy)라고 부르며 이 UBM을 어떤 조합으로 사용하는 가에 따라 접속의 안정성이 크게 좌우된다. 본 연구에서는 UBM중에서 솔더 접착 층으로 사용되는 구리 층의 두께를 1μm와 5μm로 하는 한편 barrier 층으로 사용되는 금속 층을 Ti, Ni, Pd으로 변화시키면서 이들 UBM과 공정 납-주석 사이의 계면반응을 살펴보았다. 이를 위해 100μm 크기의 솔더 범프를 전해도금법을 사용하여 제작하고 리플로 횟수와 시효시간에 따른 각 UBM에서의 금속간 화합물의 성장을 관찰하였다. Cu6Sn5 η'-상 금속간 화합물이 모든 조건에서 형성되었고 Cu층의 두께가 5μm로 두꺼운 경우에는 Cu3Sn ε-상도 관찰되었다. Pd을 사용한 UBM 구조에서는 시효 처리시에 Cu6Sn5 상 아래쪽에 PdSn4상이 형성되었다. 또한 이들 계면에서의 금속간 화합물의 성장은 솔더 범프의 접속강도 값과 밀접한 관계를 가진다.

비공정조성 공정복합재료의 일방향응고시 나타나는 액상내의 자연대류가 응고후 공정복합재료의 조성에 미치는 영향을 조사하였다. 이를 위해 Al-Cu합금을 선택하여 액상내에서 발생되는 애류의 형태를 변화시키기 위하여 상향 및 하향 일방향응고를 실시하여 각 응고조건에 따른 공정복합재료의 Cu 용질농도를 측정하였으며, 일방향응고 중에 급냉응고하여 고액계면 전방의 용질농도분포와 열분석을 통해 온도분포를 실측하였다. 그 결과로 비공정조성 공정복합재료의 일방향응고시 나타나는 대류는 공정복합재료의 용질편석에 커다란 영향을 주었으며, 고액계면 전방에서 thermal convection과 solutal convection이 모두 발생하는 하향 일방향응고된 아공정 Al-Cu합금에서 용질편석이 가장 크게 나타났다. 과공정 Al-Cu합금에서 상향 일방향응고한 경우가 하향 일방향응고한 경우보다도 용질편석이 증가한 것으로 나타났다. 이것은 본 연구조건에서는 solutal convection이 thermal convection보다 용질편석에 더 커다란 영향을 주는 것으로 생각되었다. 공정복합조직으로 성장시 고액계면은 평활계면으로 성장하였으며, 고액계면에서 액상 쪽의 용질농도는 아공정이나 과공정합금에 관계없이 공정조성의 용질농도를 가지며, 고액계면에서의 온도는 커다란 과냉도 없이 거의 공정온도 부근이었다.

일방향 응고한 AI-CuAI2공정 복합재료의 미세조직에 미치는 응고조건과 진동의 영향에 대해서 조사하였다. 진동하에서 성장속도(R) 변화에 따라 일방향응고 시켰을때 열구배(G)는 32˚C/cm와 35˚C/cm를 유지했다. 공정조직은 성장조건(G/R)에 따라 변화되었다. 조직미세화는 진동의 영향도 컸지만 G/R의 영향이 더 크다는 것을 알 수 있었다. 층상 간격은 λ2 =상수 라는 관계에 따라 성장속도와 더불어 변화 되었다.

전형적인 f-f 및 nf-f 공정합금계로 분류되는 Sb-InSb 및 Sn-Bi 합금계를 일방향 응고시켜서 성장속도에 따른 전기비저항값의 변화를 조사함으로써 미세조직의 이방성을 전기비저항의 특성으로 분석하고자 하였다. Sb-InSb 계의 경우 26-34wt.% In, Sn-Bi 계의 경우 53-65wt.% Bi의 조성을 갖는 공정합금을 진공봉합시켜 Bridgman형의수직관상로에서 일방향응고시켰다. 일방향응고 시편을 횡단면 및 종단면으로 절단 채취하여 미세조직을 관찰한 후 전기비저항을 측정하였다. Sb-InSb , Sn-Bi공정복합조직의 경우 모두 성장속도의 증가에 따라 성장방향에 수평한 방향의 비저항값(ρ┴)은 감소하였으며, Sb InSb 공정복합조직의 경우 특히 성장 속도의 증가에 따르는 미세조직상의 두가지 변화 즉, 상경계면적(phase boundary area)의 증가와 fiber방향성의 감소는 공히 ρ ll 값을 증가시키는 반면 ρ┴ 값에는 서로 상반된 영향을 끼쳤다. 또한 성장속도의 증가에 따라 점차 조직의 이방성이 상실되었다. 이와 같이 측정된 전기비저항은 미세조직특성과 잘 일치하는 바 전기비저항 측정은 조직 특성분석의 유효한 도구가 될 수 있다.

본 연구에서는 Cu-Cu2O의 공정반응에 의한 구리와 알루미나의 직접접합에 대하여 연구 하였다. 1.5×10-1torr, 1015˚C에서 산화시킨 후 10-3torr, 1075˚C에서 접합시킨 시편의 접합력과 계면특성을 인장시험, SEM, EDS 및 XRD를 통하여 분석하였다. 3분 산화시켜 접합하면 우수한 접합강도를 보이며 산화시간이 이보다 짧거나 길면 결합력은 저하하였다. 과단은 알루미나 공정조직 계면에서 발생하였으며 파단후 Al2O3표면에는 Cu쪽에서 빠져나간 Cu2O nodule의 존재하였는 바 접합력은 Cu2O-Al2O3계면보다는 Cu-Cu2O계면에 좌우됨을 보여주고 있다. 접합력은 접합시간에 따라 완만한 증가를 보였으며 CuAl2O4및 CuAlO2의 반응생성물이 접합중 형성되었다.