본 실험에서는 α-Al2O3 지지체에 무전해도금을 이용하여 Pd-Ag-Cu 분리막을 제조하였다. Pd, Ag, Cu는 각각 무 전해도금을 통해 지지체 표면에 코팅하였고, 합금의 형성을 위해 무전해도금 중간에 H2, 500°C의 조건에서 18 h 동안 열처리 를 진행하였다. 이를 통해 제조된 Pd-Ag-Cu 분리막은 SEM을 통해 표면을 관찰하였으며, Pd 분리막의 두께는 7.82 μm, Pd-Ag-Cu 분리막의 두께는 3.54 μm로 측정되었다. EDS와 XRD 분석을 통해 Pd-Ag-Cu 합금이 Pd-78%, Ag-8.81%, Cu-13.19%의 조성으로 형성된 것을 확인하였다. 기체투과 실험은 H2 단일가스와 H2/N2 혼합가스에서 실험을 진행하였다. H2 단일가스에서 측정한 수소 분리막의 최대 H2 flux는 Pd 분리막의 경우 450°C, 4 bar에서 74.16 ml/cm2·min이고, Pd-Ag-Cu 분리막의 경우 450°C, 4 bar에서 113.64 ml/cm2·min인 것을 확인하였고, H2/N2 혼합가스에서 측정한 separation factor의 경우 450°C, 4 bar에서 각각 2437, 11032의 separation factor가 측정되었다.

Recent advances in technology using ultra-thin noble metal film in oxide/metal/oxide structures have attracted attention because this material is a promising alternative to meet the needs of transparent conduction electrodes (TCE). AZO/ Ag/AZO multilayer films are prepared by magnetron sputtering for Cu2ZnSn(S,Se)4 (CZTSSe) of kesterite solar cells. It is shown that the electrical and optical properties of the AZO/Ag/AZO multilayer films can be improved by the very low resistivity and surface plasmon effects due to the deposition of different thicknesses of Ag layer between oxide layers fixed at AZO 30 nm. The AZO/Ag/AZO multilayer films of Ag 15 nm show high mobility of 26.4 cm2/Vs and low resistivity and sheet resistance of 3.58*10−5 Ωcm and 5.0 Ω/sq. Also, the AZO/Ag (15 nm)/AZO multilayer film shows relatively high transmittance of more than 65% in the visible region. Through this, we fabricated CZTSSe thin film solar cells with 7.51% efficiency by improving the short-circuit current density and fill factor to 27.7 mV/cm2 and 62 %, respectively.

To achieve the fabrication of high-quality Ag-coated Cu particles through a wet chemical process, we reported herein pretreatment conditions using an ammonium-based mixed solvent for the removal of a Cu2O layer on Cu particles that were oxidized in air for 1 hr at 200 oC or for 3 days at room temperature. Furthermore, we discussed the results of post-Ag plating with respect to removal level of the oxide layer. X-ray diffraction results revealed that the removal rate of the oxide layer is directly proportional to the concentration of the pretreatment solvent. With the results of Auger electron spectroscopy using oxidized Cu plates, the concentrations required to completely remove 50-nm-thick and 2-nm-thick oxides within 5 min were determined to be X2.5 and X0.13. However, the optimal concentrations in an actual Ag plating process using Cu powder increased to X0.4 and X0.5, respectively, because the oxidation in powder may be accelerated and the complete removal of oxide should be tuned to the thickest oxide layer among all the particles. Back-scattered electron images showed the formation of pure fine Ag particles instead of a uniform and smooth Ag coating in the Ag plating performed after incomplete removal of the oxide layer, indicating that the remaining oxide layer obstructs heterogeneous nucleation and plating by reduced Ag atoms.

To elucidate the effects of a pretreatment process on the uniformity of Ag electroless plating on Cu flakes, pretreatment time was mainly considered with a mixed solution of 0.15 M ammonium hydroxide and 0.0375 M ammonium sulphate. Optical inspection of Ag-coated Cu flakes determined that the optimal pretreatment time is 120 s. Repetition of the sequence in which Ag plating was done immediately after the pretreatment of 120 s clearly enhanced the plating uniformity. Scanning electron microscopy revealed that holes were formed irregularly on some Cu flakes during the period from the asdropping of an Ag precursor solution to 5 min. The hole formation was judged to be due to continuous removal of Cu on the local surfaces by the repetitive formation and elimination of Cu2O or Cu(OH)2 layers. However, the increase of the amount of Ag coating suppressed the hole creation and increasingly enhanced the antioxidant property.

This study was performed to obtain high conversion efficiency of NH3 and minimize generation of nitrogen oxides using metal-supported catalyst with Ag : Cu ratio. Through structural analysis of the prepared catalyst with Ag : Cu ratio ((10-x)Ag–xCu (0≤ x ≤6)), it was confirmed that the specific surface area was decrease with increasing metal content. A prepared catalysts showed Type Ⅱ adsorption isotherms regardless of the ratio Ag : Cu of metal content, and crystalline phase of Ag2O, CuO and CuAl2O was observed by XRD analysis. In the low temperature(150∼200 ℃), a conversion efficiency of AC_10 recorded the highest(98%), whereas AC_5 (Ag : Cu = 5 : 5) also showed good conversion efficiency(93.8%). However, in the high temperature range, the amounts of by-products(NO, NO2) formed with AC_5 was lower than that of AC_10. From these results, It is concluded that AC_5 is more environmentally and economically suitable.

Two types of nanoclusters, termed Cluster (1) and Cluster (2) here, both play an important role in the age-hardening behavior in Al-Mg-Si alloys. Small amounts of additions of Cu and Ag affect the formation of nanoclusters. Two exothermic peaks were clearly detected in differential scanning calorimetry(DSC) curves by means of peak separation by the Gaussian method in the base, Cu-added, Ag-added and Cu-Ag-added Al-Mg-Si alloys. The formation of nanoclusters in the initial stage of natural aging was suppressed in the Ag-added and Cu-Ag-added alloys, while the formation of nanoclusters was enhanced at an aging time longer than 259.2 ks(3 days) of natural aging with the addition Cu and Ag. The formation of nanoclusters while aging at 100˚C was accelerated in the Cu-added, Ag-added and Cu-Ag-added alloys due to the attractive interaction between the Cu and Ag atoms and the Mg atoms. The influence of additions of Cu and Ag on the clustering behavior during low-temperature aging was well characterized based on the interaction energies among solute atoms and on vacancies derived from the first-principle calculation of the full-potential Korrinaga-Kohn-Rostoker(FPKKR)-Green function method. The effects of low Cu and Ag additions on the formation of nanoclusters were also discussed based on the age-hardening phenomena.

Ag spot-coated Cu nanopowders were synthesized by a hydrothermal-attachment method (HA) using oleic acid capped Ag hydrosol. Cu nano powders were synthesized by pulsed wire exploding method using 0.4 mm in diameter of Cu wire (purity 99.9%). Synthesized Cu nano powders are seen with comparatively spherical shape having range in 50 nm to 150 nm in diameter. The oleic acid capped Ag hydrosol was synthesized by the precipitation-redispersion method. Oleic acid capped Ag nano particles showed the narrow size distribution and their particle size were less than 20 nm in diameter. In the case of nano Ag-spot coated Cu powders, nanosized Ag particles were adhered in the copper surface by HAA method. The components of C, O and Ag were distributed on the surface of copper powder.

A semi-empirical method to estimate the surface tension of molten alloys at different oxygen partialpressures is suggested in this study. The surface tension of molten Ag-Sn and Ag-Cu alloys were calculatedusing the Butler equation with the surface tension value of pure substance at a given oxygen partialpressure. The oxygen partial pressure ranges were 2.86×10-12－1.24×10-9Pa for the Ag-Sn system and2.27×10-11－5.68×10-4 Pa for the Ag-Cu system. In this calculation, the interactions of the adsorbed oxygenwith other metallic constituents were ignored. The calculated results of the Ag-Sn alloys were in reasonableaccordance with the experimental data within a difference of 8%. For the Ag-Cu alloy system at a higheroxygen partial pressure, the surface tension initially decreased but showed a minimum at XAg = 0.05 to increaseas the silver content increased. This behavior appears to be related to the oxygen adsorption and thecorresponding surface segregation of the constituent with a lower surface tension. Nevertheless, the calculatedresults of the Ag-Cu alloys with the present model were in good agreement with the experimental data withina difference of 10%.

Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were molar ratio 4, concentration of reductant 15g/l and feeding rate of silver ions solution 2 ml/min.

The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.

Ag-Cu alloy nano powders were fabricated by the electrical explosion of Cu-plated Ag wires. Ag wires of 0.2mm diameter was electroplated to final diameter of 0.220 mm and 0.307 mm which correspond to Ag-27Cu and Ag-68Cu alloy. The explosion product consisted of equilibrium phases of and -Cu. The particle size of Ag-Cu nano powders were 44 nm and 70 nm for 0.220 mm and 0.307 mm wires, respectively. The Ag-Cu nano powders contained less Cu than average value due to higher sublimation energy compared to that of Ag. As a result, micron-sized spherical particles formed from liquid droplets contained higher Cu content.

We developed the copper core ball electroplated with Sn-Ag-Cu of the eutectic composition which used mostly as Pb free solder ball with high reliability. In order to search for the practicality of this developed copper core ball, the evaluation was executed by measuring the initial joint strength of the sample mounted on the substrate and reflowed and by measuring the joint strength of the sample after the high temperature leaving test and the constant temperature and the humidity leaving test. This evaluation was compered with those of the usual other copper core balls electroplated with (Sn,Sn-Ag,Sn-Cu,Sn-Bi) and the Sn-Ag-Cu solder ball.

Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.

Bend tests were performed at temperatures between 77 and 473K for W-19vol%Cu, W-22vol%Ag and W-19vol%(BAg-8) composites. Yield and maximum strengths and ductility of the composite were discussed in terms of microstructure and fractography. Results are summarized as follows. (1) Almost no difference was recognized in yield strength between the composites. In contrast, a large difference was recognized in maximum strength and ductility between the composites. (2) Inferior mechanical properties of W-Ag composite to W-Cu composite are attributed to heterogeneous distribution of Ag-phases, whilst inferior mechanical properties of W-(BAg-8) composite to W-Cu composite are attributed to large pores at grain boundaries.

The brazing adhesion properties of Ag coated W-Ag electric contact on the Cu substrate have been investigated in therms of microstructure, phase equilibrium and adhesion strength. Precoating of Ag layer ( in thickness) on the contact material was done by electro-plating method. Subsequently the brazing treatment was conducted by inserting BCuP-5 filler metal (Ag-Cu-P alloy) layer between Ag coated W-Ag and Cu substrate and annealing at in atmosphere. The optimum brazing temperature of was semi-empirically calculated on the basis of the Cu atomic diffusion profile in Ag layer of commercial electric contact produced by the same brazing process. As a mechanical test of the electric contact after brazing treatment the adhesion strength between the electric contact and Cu substrate was measured using Instron. The microstructure and phase equilibrium study revealed that the sound interlayer structure was formed by relatively low brazing treatment at . Thin Ag electro-plated layer precoated on the electric contact ( in thickness) is thought to be enough for high adhesion strength arid sound microstructure in interface layer.