Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.

Bend tests were performed at temperatures between 77 and 473K for W-19vol%Cu, W-22vol%Ag and W-19vol%(BAg-8) composites. Yield and maximum strengths and ductility of the composite were discussed in terms of microstructure and fractography. Results are summarized as follows. (1) Almost no difference was recognized in yield strength between the composites. In contrast, a large difference was recognized in maximum strength and ductility between the composites. (2) Inferior mechanical properties of W-Ag composite to W-Cu composite are attributed to heterogeneous distribution of Ag-phases, whilst inferior mechanical properties of W-(BAg-8) composite to W-Cu composite are attributed to large pores at grain boundaries.

Two atomized alloy powders were pre-compacted by cold and subsequently hot forged at temperatures ranging from 653K to 845K. The addition of Cu and Mg causes a decrease in the eutectic reaction temperature of Al-10Si-5Fe-1Zr alloy from 841K to 786K and results in a decrease of flow stress at the given forging temperature. TEM observation revealed that in addition to Al-Fe based intermetallics, Al2Cu and Al2CuMg intermetallics appeared. The volume fraction of intermetallic dispersoids increased by the addition of Cu and Mg. Compressive strength of the present alloys was closely related to the volume fraction of intermetallic dispersoids.

Ti-Cu-Ni-Sn quaternary amorphous alloys of Ti50Cu32Ni15Sn3, Ti50Cu25Ni20Sn5, and Ti50Cu23Ni20Sn7 composition were prepared by mechanical alloying in a planetary high-energy ball-mill (AGO-2). The amorphization of all three alloys was found to set in after milling at 300rpm speed for 2h. A complete amorphization was observed for Ti50Cu32Ni15Sn3 and Ti50Cu25Ni20Sn5 after 30h and 20h of milling, respectively. Differential scanning calorimetry analyses revealed that the thermal stability increased in the order of Ti50Cu32Ni15Sn3, Ti50Cu25Ni20Sn5, and Ti50Cu23Ni20Sn7.

Mg55Y15Cu30 metallic glass powders were prepared by the mechanical alloying of pure Mg, Y, and Cu after 10 h of milling. The thermal stability of these Mg55Y15Cu30 amorphous powders was investigated using the differential scanning calorimeter (DSC). Tg ,Tx , and ΔTx are 442 K, 478 K, and 36 K, respectively. The as-milled Mg55Y15Cu30 powders were then consolidated by vacuum hot pressing into disk compacts with a diameter and thickness of 10 mm and 1 mm, respectively. This yielded bulk Mg55Y15Cu30 metallic glass with nanocrystalline precipitates homogeneously embedded in a highly dense glassy matrix. The pressure applied during consolidation can enhance thermal stability and prolong the existence of amorphous phase within Mg55Y15Cu30 powders.

An infiltration technique using W-Cu composite powder has been developed to enhance microstructural uniformity of W-Cu pseudo-alloy. W-Cu composite powder, manufactured by reduction from WO3 and CuO powder mixtures, were blended with W powder and then cold iso-statically pressed into a cylindrical bar under 150 MPa. The pressed samples were pre-sintered at 1300 oC for 1 hour under hydrogen to make a skeleton structure. This skeleton structure was more homogeneous than that formed by using W and Cu powder mixtures. The skeleton structures were infiltrated with Cu under hydrogen atmosphere. The infiltrated W-Cu pseudo-alloy showed homogeneous microstructure without Cu rich region.

Bulk amorphous materials have been intensively studied to apply for various advanced industry fields due to their high mechanical, chemical and electrical properties. These materials have been produced by several techniques such as mechanical alloying, melt spinning and gas atomization, etc. Among them, the atomization is the most potential technique for commercialization due to high cooling rate during solidification of the melt and mass productivity. However, the amorphous powders still have some limitations because of their low ductility and toughness. Therefore, intensive efforts have to be carried out to increase the ductility and toughness. In this study, the Ni-based amorphous powder was produced by the gas atomization process. And in order to increase the ductile toughness, ductile Cu phase was coated on the Ni amorphous powder by spray drying process. The characteristics of the as-synthesis powders have been examined and briefly mentioned. The master alloy with Ni57Zr20Ti16Si2Sn3 was prepared by vacum induction melting furnace with graphite crucible and mold. The atomization was conducted at 1450oC under the vacuum of 10-2 torr. The gas pressure during atomization was varied from 35 to 50 bars. After making the Ni amorphous powders, the spray drying was processed to produce the Cu -coated Ni amorphous composite powder. The amorphous powder and Cu nitrate solution were mixed together with a small amount of binder and then it was sprayed at temperature of 130oC and rotating speed of 15,000 R.P.M..

Warm compaction powder metallurgy was used to produce a Ti3SiC2 particulate reinforced Cu matrix composite. Fabrication parameters and warm compaction behaviors of Cu powder were studied. Based on the optimized fabrication parameters a Cu-based electrical contact material was prepared. Results showed that in expend of some electrical conductivity, addition of Ti3SiC2 particulate increased the hardness, wear resistivity and anti-friction ability of the sintered Cu-base material.

Dimensional change of compact made from (Fe-Cu) prealloyed powder and copper powder compared to that of compact made from iron-copper elemental powder. The compact made from the prealloyed powder with a copper content of 7.18mass% which is nearly equal to its solution limit and copper powder showed only the large contraction in spite of penetration of liquid copper into grain boundary of the prealloyed powder. But the compact made from iron-copper elemental powder showed the large expansion in spite of same chemical composition with former case.

The magnetic inductance of nanocrystalline Fe73Si16B7Nb3Cu1 and an amorphous FeSiB powder sheet has been investigated to identify RFID performance. The powder was mixed with binder and solvent and tape-casted to form films. Results show annealing significantly influenced on the inductance of the material. The surface oxidation of the particles was the main reason for the reduced inductance. The maximum inductance of Fe73Si16B7Nb3Cu1 alloy was about 88μH at 17.4 MHz, about 65% greater compared to the FeSiB alloy. The higher inductance in the nanocrystalline alloy indicates it may be used as a potential replacement of current RFID materials.

W-Cu alloy was very useful material for a heat sink, high electric contact and EDM electrode. Powder injection molding (PIM) is the optimum manufacturing technology to provide W-Cu components with low-cost and high-volume. We used various compositions of tungsten coated copper powders (W-Cu with 10 to 80 wt-% of copper) to manufacture W-Cu components by PIM. The optimum mixing, injection molding, debinding and sintering conditions to provide the high performance W-Cu components were investigated. The thermal and mechanical properties of W-Cu parts by PIM were measured. Finally, we can verify the high performance of W-Cu components by PIM with the tungsten coated copper.

A new method has been developed to fabricate microcomponents by a combination of photolithography and sintering of metallic powder mixtures, without the need for compression and the addition of Mg. This involves (1) the fabrication of a micromould, (2) mould filling of the powder/binder mixture, (3) debinding and (3) sintering. The starting powdered materials consisted of a mixture of aluminium powder(average size of 2.5 um) and alloying elemental powder of Cu and Sn(less than 70nm), at appropriate proportions to achieve nominal compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn. This paper presents detailed investigation of debinding behaviour and microstructural development.

Al-Cu alloy nano powders were produced by the electrical explosion of Cu-plated Al wires. The composition and phase of the alloy could be controlled by varying the thickness of Cu deposit on Al wire. When the Cu layer was thin, Al solid solution and were the major phases. As the Cu layer becomes thicker, Al diminished while phase prevailed instead. The average particle size of Al-Cu nano powders became slightly smaller from 63 nm to 44 nm as Cu layer becomes thicker. The oxygen content of Al-Cu powder decreased linearly with Cu content. It is well demonstrated that the electrodeposition combined with wire explosion could be simple and economical means to prepare variety of alloy and intermetallic nano powders.

The present paper investigates the possibilities of niobium using for the mechanical properties of the common low alloyed Cu-Ni-Mo-C sintered structural steels enhancing. On both thermodynamic and experimental bases there were demonstrated the Nb nitrides/carbides/carbonitrides preferential formation in these steels during sintering in dissociated ammonia at both common and elevated temperatures. The obtained results for fine Nb powder and 0.3% graphite additions to Distaloy AB iron base powder cold compacted and sintered in dissociated ammonia proved the expected strengthening effect, leading to higher mechanical properties of the processed steels than of the common Cu-Ni-Mo-C ones.