Thermite welding is an exceptional process that does not require additional energy supplies, resulting in welded joints that exhibit mechanical properties and conductivity equivalent to those of the parent materials. The global adoption of thermite welding is growing across various industries. However, in Korea, limited research is being conducted on the core technology of thermite welding. Currently, domestic production of thermite powder in Korea involves recycling copper oxide (CuO). Unfortunately, controlling the particle size of waste CuO poses challenges, leading to the unwanted formation of pores and cracks during thermite welding. In this study, we investigate the influence of powder particle size on thermite welding in the production of Cu-thermite powder using waste CuO. We conduct the ball milling process for 0.5–24 h using recycled CuO. The evolution of the powder shape and size is analyzed using particle size analysis and scanning electron microscopy (SEM). Furthermore, we examine the thermal reaction characteristics through differential scanning calorimetry. Additionally, the microstructures of the welded samples are observed using optical microscopy and SEM to evaluate the impact of powder particle size on weldability. Lastly, hardness measurements are performed to assess the strengths of the welded materials.

Carbon short fibers/copper composites with different carbon short fiber contents up to 15 wt.% as reinforcements are prepared to investigate the influence of the carbon short fiber surface coating on the microstructure, density, and electrical properties of the carbon short fibers/copper composites. The carbon short fibers were surface treated by acid functionalization followed by alkaline treatment before the coating process. It was observed from the results that coated type copper nanoparticles were deposited on the surface of the carbon short fibers. The surface treated carbon short fibers were coated by copper using the electroless deposition technique in the alkaline tartrate bath by using formaldehyde as a reducing agent of the copper sulfate. The produced coated carbon short fibers/copper composite powders were cold compacted at 600 MPa, and then sintered at 875 °C for 2 h under (hydrogen/nitrogen 1:3) atmosphere. A reference copper sample was also prepared by the same method to compare between the properties of pure copper and the carbon short fibers/copper composites. The phase composition, morphology, and microstructure of the prepared carbon short fibers/copper composite powders as well as the corresponding carbon short fibers/copper composites were investigated using X-ray diffraction analysis (XRD) and scanning electron microscope (SEM) equipped with an energy-dispersive spectrometer (EDS), respectively. The density and the electrical resistivity of the sintered composites were measured. It was observed from the results that the density was decreased; however, the electrical resistivity was increased by increasing the carbon short fibers wt.%.

A conductive additive is prepared by dispersing multi-walled carbon nanotubes (MWCNTs) on Cu powder by mechanical milling and is distributed in epoxy to enhance its electrical conductivity. During milling, the MWCNTs are dispersed and partially embedded on the surface of the Cu powder to provide electrically conductive pathways within the epoxy-based composite. The degree of dispersion of the MWCNTs is controlled by varying the milling medium and the milling time. The MWCNTs are found to be more homogeneously dispersed when solvents (particularly, non-polar solvent, i.e., NMP) are used. MWCNTs gradually disperse on the surface of Cu powder because of the plastic deformation of the ductile Cu powder. However, long-time milling is found to destroy the molecular structure of MWCNTs, instead of effectively dispersing the MWCNTs more uniformly. Thus, the epoxy composite film fabricated in this study exhibits a higher electrical conductivity than 1.1 S/cm.

Cu-Fe alloys (CFAs) are much anticipated for use in electrical contacts, magnetic recorders, and sensors. The low cost of Fe has inspired the investigation of these alloys as possible replacements for high-cost Cu-Nb and Cu-Ag alloys. Here, alloys of Cu and Fe having compositions of Cu100-xFex (x = 10, 30, and 50 wt.%) are prepared by gas atomization and characterized microstructurally and structurally based on composition and powder size with scanning electron microscopy (SEM) and X-ray diffraction (XRD). Grain sizes and Fe-rich particle sizes are measured and relationships among composition, powder size, and grain size are established. Same-sized powders of different compositions yield different microstructures, as do differently sized powders of equal composition. No atomic-level alloying is observed in the CFAs under the experimental conditions.

A powder-in-sheath rolling (PSR) process utilizing a copper alloy tube was applied to a fabrication of a multi-walled carbon nanotube (CNT) reinforced aluminum matrix composite. A copper tube with an outer diameter of 30 mm and a wall thickness of 2 mm was used as a sheath material. A mixture of pure aluminum powders and CNTs with the volume contents of 1, 3, 5 vol% was filled in the tube by tap filling and then processed to 93.3% height reduction by a rolling mill. The relative density of the CNT/Al composite fabricated by the PSR decreased slightly with increasing of CNTs content, but showed high value more than 98%. The average hardness of the 5%CNT/Al composite increased more than 3 times, compared to that of unreinforced pure Al powder compaction. The hardness of the CNT/Al composites was some higher than that of the composites fabricated by PSR using SUS304 tube. Therefore, it is concluded that the type of tube affects largely on the mechanical properties of the CNT/Al composites in the PSR process.

Recovery of copper powder from copper chloride solution used in leaching process was carried out using a cementation method. Cementation is a simple and economical process, necessitating less energy compared with other recovery methods. Cementation utilizes significant difference in standard reduction potential between copper and iron under standard condition. In the present research, Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated using bench-scale cementation reaction system. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRF, SEM-EDS and laser diffraction and scattering methods. Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99.65% purity and average in size.

A two-step recovery method was developed to produce copper powders from copper chloride waste solution as byproducts of MoO leaching process. The first step consisted of replacing noble copper ions with external Fe ions which were formed by dissolving iron scraps in the copper chloride waste solution. The replaced copper ions were subsequently precipitated as copper powders. The second step was cementation of entire solution mixture to separate (pure) copper powders from aqueous solution of iron chloride. Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRD, SEM-EDS and laser diffraction and scattering methods.Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99% purity and average 12m in size.

For microelectronic circuits, the main type of failure is thermal fatigue. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers to meet these requirements. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed.

Dimensional change of compact made from (Fe-Cu) prealloyed powder and copper powder compared to that of compact made from iron-copper elemental powder. The compact made from the prealloyed powder with a copper content of 7.18mass% which is nearly equal to its solution limit and copper powder showed only the large contraction in spite of penetration of liquid copper into grain boundary of the prealloyed powder. But the compact made from iron-copper elemental powder showed the large expansion in spite of same chemical composition with former case.

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.

The thermal dissipation performance of sintered heat pipes is usually determined by the capillarity and permeability of the Cu powder wicks. Since the capillary provided by the Cu powder is usually large enough to draw water from the condenser end to the evaporator end, the permeability has become the controlling factor. In this study, Cu powders with different particle sizes and shapes were loosely sintered, and their permeabilities were compared. The results show that more complicated shapes, finer particle sizes, lower porosities, and rougher pore surfaces give lower permeability and thermal dissipation.

We present a systematic study of the heating and pre-sintering behavior of porous copper powder metal compacts. We employ a TE102 single mode microwave system to position the samples in the separated electric field (E) or magnetic field (H) anti-node of the cavity. We observe significant differences in the heating, pre-sintering, and microstructure evolution of the samples due to the individual fields. We note that sample history (whether heated first in the E-field or H-field) greatly effects a difference in heating trends and subsequent heating behavior and does not appear to be solely a thermal process.

Processing of W-Cu graded materials from attritor-milled W-CuO mixtures is described. The powder reduction steps are investigated by TG and XRD analyses and by microstructural observations (SEM, TEM). Sintering of reduced powder with different compositions is analysed by dilatometry. Sintering behaviour of the graded component processed by co-compaction of a 10/20/30wt%Cu multi-layer material is briefly discussed. Liquid Cu migration is observed and smooths the composition gradient. Perspectives to control this migration are discussed.

Nano Cu powders, synthesized by Pulsed Wire Evaporation (PWE) method, have been compacted by Magnetic Pulsed Cojpaction(MPC) method. The microstructure and mechanical properties were analyzed. The optimal condition for proper mechanical properties with nanostructure was found. Both pure nano Cu powders and passivated nano Cu powders were compacted, and the effect of passivated layer on the mechanical properties was investigated. The compacts by MPC, which had ultra-fine and uniform nanostructure, showed higher density of 95% of theoretical density than that of static compaction. The pur and passivated Cu compacted at exhibited maximum hardnesses of 248 and 260 Hv, respectively. The wear resistance of those compacts corresponded to the hardness.