간행물
Carbon Letters KCI 등재 Carbon letters
- 발행기관 한국탄소학회
- 자료유형 학술지
- 간기 격월간
- ISSN 1976-4251 (Print)2233-4998 (Online)
- 수록기간 2000 ~ 2023
- 주제분류 자연과학 > 자연과학일반 자연과학 분류의 다른 간행물
- 십진분류KDC 530DDC 620
권호리스트/논문검색
Vol.32 No.3 (2022년 5월) 22건
21.
2022.05
구독 인증기관 무료, 개인회원 유료
The electrochemical capacitive properties of biomass-derived activated carbons are closely dependent on their microscopic structures. Here, activated carbon fibers (ACFs) were prepared from natural cattail fibers by carbonization and further chemical activation. The activation temperature affected on the microscopic structures and electrochemical properties of the activated carbon fibers. The results show that the optimum activation temperature is 800 °C. And the as-prepared ACF- 800 possesses high micropore specific surface area of 710.4 m2 g− 1 and micropore volume of 0.313 cm3 g− 1, respectively. For supercapacitor applications, the ACF-800 displays a high specific capacitance of 249 F g− 1 at a current density of 0.05 A g− 1, excellent rate performance and cycle stability in a three-electrode system. The excellent electrochemical performance indicated that the obtained activated carbon fibers could be a promising electrode material in supercapacitor.
4,000원
22.
2022.05
구독 인증기관 무료, 개인회원 유료
Diamond reinforced silicon carbide matrix composites (diamond/SiC) with high thermal conductivity were prepared by tape casting combined with Si vapor infiltration for thermal management application. The effects of the mixing mode of bimodal diamond particles on the microstructure, thermal and mechanical properties of the composites were analyzed. The results reveal that the thermal conductivity of composites is affected significantly by mixing mode of diamond. In general, when the content of large diamond remains constant, adding a slight amount of small diamond was found to be effective in improving the thermal conductivity of the composite. However, excess small diamonds added will decrease thermal conductivity due to its high interfacial thermal resistance. The maximum thermal conductivity of obtained diamond/SiC is 469 W/(m K) when 38 vol% large diamond and 4 vol% small diamond were added. Such a result can be attributed to the formation of efficient heat transfer channels within the composite and sound interfacial bonding between diamond and SiC phase. Diamond/SiC with high thermal conductivity are expected to be the next generation of electronic packaging substrate.
4,000원
1
2
