간행물

Carbon Letters KCI 등재 Carbon letters

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Vol.32 No.3 (2022년 5월) 22건

21.
2022.05 구독 인증기관 무료, 개인회원 유료
Activated carbon fibers derived from natural cattail fibers for supercapacitors
Chaonan Wang, Lijun Bai, Feng Zhao, Lizhong Bai
Carbon Letters Vol.32 No.3 pp.907-915 한국탄소학회
The electrochemical capacitive properties of biomass-derived activated carbons are closely dependent on their microscopic structures. Here, activated carbon fibers (ACFs) were prepared from natural cattail fibers by carbonization and further chemical activation. The activation temperature affected on the microscopic structures and electrochemical properties of the activated carbon fibers. The results show that the optimum activation temperature is 800 °C. And the as-prepared ACF- 800 possesses high micropore specific surface area of 710.4 m2 g− 1 and micropore volume of 0.313 cm3 g− 1, respectively. For supercapacitor applications, the ACF-800 displays a high specific capacitance of 249 F g− 1 at a current density of 0.05 A g− 1, excellent rate performance and cycle stability in a three-electrode system. The excellent electrochemical performance indicated that the obtained activated carbon fibers could be a promising electrode material in supercapacitor.
4,000원
22.
2022.05 구독 인증기관 무료, 개인회원 유료
Thermal and mechanical properties of diamond/SiC substrate reinforced by bimodal diamond particles
Pengfei Liu, Xulei Wang, Xinbo He, Xuanhui Qu
Carbon Letters Vol.32 No.3 pp.917-925 한국탄소학회
Diamond reinforced silicon carbide matrix composites (diamond/SiC) with high thermal conductivity were prepared by tape casting combined with Si vapor infiltration for thermal management application. The effects of the mixing mode of bimodal diamond particles on the microstructure, thermal and mechanical properties of the composites were analyzed. The results reveal that the thermal conductivity of composites is affected significantly by mixing mode of diamond. In general, when the content of large diamond remains constant, adding a slight amount of small diamond was found to be effective in improving the thermal conductivity of the composite. However, excess small diamonds added will decrease thermal conductivity due to its high interfacial thermal resistance. The maximum thermal conductivity of obtained diamond/SiC is 469 W/(m K) when 38 vol% large diamond and 4 vol% small diamond were added. Such a result can be attributed to the formation of efficient heat transfer channels within the composite and sound interfacial bonding between diamond and SiC phase. Diamond/SiC with high thermal conductivity are expected to be the next generation of electronic packaging substrate.
4,000원
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